Special Issue "Advance of Cooperative Working in Design, Visualization and Engineering"

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Industrial Electronics".

Deadline for manuscript submissions: 5 May 2024 | Viewed by 718

Special Issue Editors

Prof. Dr. Yuhua Luo
E-Mail Website
Guest Editor
Department of Computer Science, University of Balearic Islands, Palma, Spain
Interests: computer supported cooperative work; computer vision; computer graphics; multimedia
Special Issues, Collections and Topics in MDPI journals
Faculty of Transdisciplinary Innovation, University of Technology Sydney, Ultimo 2007, Australia
Interests: data science; network analysis and visualisation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Recently, artificial intelligence, the Industrial Internet of Things (IIoT), metaverse, blockchain, cloud computing and cyber security have become hot topics, shaping the computing landscape.

This new computing landscape opens a wider possibility to access to social media, e-business, e-learning, e-finance, crowdsourcing, and many other cooperative technology-supported services. We are excited to see that the scale and popularity have reached a level that our human society has never experienced before. This Special Issue aims to gather original, state-of-the-art research and development contributions from all types of cooperative working applications, with the focus on cooperative design, cooperative visualization, and cooperative engineering.

New papers, or extended versions of papers, presented at the 20th International Conference on Cooperative Design, Visualization and Engineering (CDVE2023)(https://www.cdve.org/) are welcome. Submissions must not be currently under review for publication elsewhere. Conference papers may be submitted only if they are substantially extended (more than 50%), and must be referenced. All submitted papers will be peer-reviewed using the normal standards of the Electronics journal, and accepted based on their quality, originality, novelty, and relevance to the theme of the Special Issue.

Prof. Dr. Yuhua Luo
Dr. Tony Huang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2200 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • multi-user, multi-location, multi-modal cooperative design
  • cooperative visualization
  • integration and interoperability in engineering
  • concurrent engineering
  • cooperative applications that network, multiple units are involved
  • basic theories, methods and technologies that support cooperation

Published Papers

This special issue is now open for submission.
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