Recent Advances in Printed and Flexible Electronics

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electronic Materials, Devices and Applications".

Deadline for manuscript submissions: 15 August 2026 | Viewed by 2006

Editors


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Guest Editor
Organic Devices, Technische Universität Dresden, 01062 Dresden, Germany
Interests: organic electronics; flexible electronics

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Guest Editor
Bosch Sensortec GmBH, 72764 Reutlingen, Germany
Interests: printed oxide electronics; solution processing

Special Issue Information

Dear Colleagues,

Flexible electronics is a rapidly growing field in the larger context of the ‘internet-of-things’, especially when it comes to wearable electronics. New materials and techniques are being developed, not only for state-of-the-art applications but with an aim to integrate into the existing development infrastructure with minimal wastage. Solution-processed methods, printed electronics and roll-to-roll technology are among the primary fields that tackle the issues hovering around wearable and flexible electronics.
The aim of this Special Issue is to identify the latest works targeting the above-mentioned topics and updates in the field of printed, flexible electronics. This clearly fits the scope of Electronics.

In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following themes from the general field of flexible electronics:

  • Printed organic electronics;
  • Bioelectronics;
  • Sustainable materials;
  • Roll-to-roll processing;
  • Low-temperature processing;
  • Advanced circuitry;
  • Artificial neural networks and computing;
  • Conductive inks;
  • Photovoltaics;
  • Solution processed inorganics;
  • All-printed circuits.

I/We look forward to receiving your contributions.

Dr. Katherina Haase
Dr. Surya Abhishek Singaraju
Guest Editors

Manuscript Submission Information

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Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • printed electronics
  • flexible electronics
  • organics
  • neural networks
  • computing
  • additive manufacturing
  • roll-to-roll processing
  • inkjet-printing
  • sustainable electronics

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Published Papers (1 paper)

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Review

49 pages, 3040 KB  
Review
Advancements in Substrate Technologies and Design Challenges for 5G mmWave Systems
by Ali Hamad Ali, Siti Marwangi Mohamad Maharum and Zuhanis Mansor
Electronics 2026, 15(9), 1768; https://doi.org/10.3390/electronics15091768 - 22 Apr 2026
Viewed by 1619
Abstract
Substrates have become essential enabling materials for creating lightweight electronic components, particularly supporting advanced telecommunication technologies. This progress is driven by continuous advancements in novel substrate materials and cutting-edge fabrication techniques, pushing the limits of high-frequency device design. This paper explores both the [...] Read more.
Substrates have become essential enabling materials for creating lightweight electronic components, particularly supporting advanced telecommunication technologies. This progress is driven by continuous advancements in novel substrate materials and cutting-edge fabrication techniques, pushing the limits of high-frequency device design. This paper explores both the challenges and breakthroughs in 5G mmWave substrate technology, focusing on recent developments in materials, device fabrication, and integration methods that enhance performance and provide an in-depth analysis of the importance of mmWave technology. This paper also highlights the key concerns in substrate design for researchers and academicians to accelerate the invention and commercialization of substrate designs in areas such as antenna engineering and integrated circuit technologies, as well as addressing key issues like scalability, thermal impact in flexible substrates, and AI-driven RSSI-aware beamforming and its implications. Likewise, since matters related to material losses and substrates’ fabrication constraints are increasingly severe at high frequencies, mmWave substrates need to be looked at; therefore, this paper details, as well, the particular issues related to mmWave propagation and manufacturing design processes for high-frequency devices. Aims at optimizing antenna and system reliability by employing advanced strategies and materials, as well as outlining the existing gaps that need clarification to augment 5G mmWave infrastructure and services. Full article
(This article belongs to the Special Issue Recent Advances in Printed and Flexible Electronics)
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