New Challenges in Beyond 5G/6G Network Wireless Technologies

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 15 June 2026 | Viewed by 813

Special Issue Editors


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Guest Editor
Department of Telecommunication and Artificial Intelligence (TMIT), Budapest University of Technology and Economics (BME), 1117 Budapest, Hungary
Interests: 5G/6G and beyond wireless networks; millimeter-wave and terahertz communications; optical fronthaul and backhaul; optical networks; free-space optics; network slicing; energy-efficient networking; non-terrestrial networks (NTNs); AI/ML for network optimization; green communications

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Guest Editor
Institute for Infocomm Research, A*STAR, Singapore 138632, Singapore
Interests: RF; microwave; mmWave antenna engineering; antenna array; wireless power transfer; 5G communication; 5G mmWave

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Guest Editor
Department of Computer Algebra, ELTE Eotvos Lorand University, 1117 Budapest, Hungary
Interests: Applied cryptography; network security; B5G/6G security; federated learning security; AI/ML for cybersecurity

Special Issue Information

Dear Colleagues,

The ongoing evolution toward Beyond 5G (B5G) and 6G wireless networks is redefining the landscape of global connectivity, aiming for ultra-high reliability, low latency, massive capacity, and sustainable design. This Special Issue of Electronics, titled ‘New Challenges in Beyond 5G/6G Network Wireless Technologies,’ seeks original research and comprehensive reviews addressing both foundational advances and emerging innovations across these domains.

We welcome submissions on cutting-edge topics such as millimeter-wave and terahertz communications, intelligent reflecting surfaces (IRSs), AI/ML-based resource management, integrated terrestrial and non-terrestrial networks (NTNs), and green networking paradigms. In addition, security and privacy are becoming critical pillars of 6G systems—authors are encouraged to explore novel methods for securing data transmission, safeguarding user privacy, and building resilient, trust-aware network infrastructures.

Topics of interest include, but are not limited to, the following:

  • AI-driven network optimization for B5G/6G;
  • cost-efficient wireless and optical networks;
  • Energy-efficient and sustainable 6G wireless;
  • Secure and privacy-preserving architectures;
  • Moving Target Defense;
  • Trust models and privacy preservation;
  • AI-based behavioral analysis;
  • ML/AI-based threat detection and mitigation;
  • Security in edge and fog computing;
  • Optical and wireless fronthaul/backhaul innovations;
  • Satellite and UAV-enabled communication systems;
  • ML- and SDN-based dynamic network slicing;
  • Physical layer security and authentication mechanisms.

Dr. Abdulhalim Fayad
Dr. N. Nasimuddin
Dr. Mohammed B. Alshawki
Guest Editors

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Keywords

  • 6G
  • beyond 5G
  • millimeter-wave
  • intelligent reflecting surfaces
  • energy-efficient networking
  • non-terrestrial networks
  • network slicing
  • AI/ML in wireless
  • secure communications
  • optical fronthaul/backhaul
  • securty and privacy

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Published Papers (1 paper)

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Research

12 pages, 3132 KB  
Article
A Compact On-Chip Ka-Band Bandpass Filter Using Folded Crossed Interdigital Coupling Structure
by Ming-An Chung, Chia-Wei Lin and Bing-Ruei Chuang
Electronics 2026, 15(7), 1455; https://doi.org/10.3390/electronics15071455 - 31 Mar 2026
Viewed by 414
Abstract
This paper proposes a millimeter-wave miniature on-chip bandpass filter (BPF) implemented using a 0.18 μm CMOS process. To address the issues of insufficient coupling capability, limited control of transmission zeros, and excessive chip area in traditional on-chip filters, a folded cross-interdigital coupling structure [...] Read more.
This paper proposes a millimeter-wave miniature on-chip bandpass filter (BPF) implemented using a 0.18 μm CMOS process. To address the issues of insufficient coupling capability, limited control of transmission zeros, and excessive chip area in traditional on-chip filters, a folded cross-interdigital coupling structure is proposed to enhance coupling efficiency and reduce size. The design incorporates metal–insulator–metal (MIM) capacitors to increase the coupling capacitance between resonators without increasing the area, and utilizes a defected ground structure (DGS) to modify the current distribution at the ground plane, generating additional transmission zeros to improve selectivity. An LC equivalent circuit model was established and verified through full-wave electromagnetic simulation, and the design was validated through chip fabrication and on-wafer measurements. The measurement results show an insertion loss of 3.36 dB and a fractional bandwidth of 49.1% at 32 GHz, with two transmission zeros. The core dimensions are 0.25 mm × 0.18 mm. This design achieves a good balance between miniaturization, selectivity, and insertion loss, making it suitable for millimeter-wave SoC applications. Full article
(This article belongs to the Special Issue New Challenges in Beyond 5G/6G Network Wireless Technologies)
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