Microelectronic Devices and Materials
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Electronic Materials, Devices and Applications".
Deadline for manuscript submissions: 31 January 2026 | Viewed by 8
Special Issue Editors
Interests: chemical sensors; microelectronics; system on chip; temperature sensors; X-ray detectors
Special Issues, Collections and Topics in MDPI journals
Interests: micromachined thermal sensors; gas sensors; vacuum sensors; flow sensors; atomic force microscopy; microbial fuel cells; analytical modeling; numerical modeling; intelligent transmitters
Interests: digital signal processing; design and analysis of the virtual instrumentation; automotive and power system applications
Special Issue Information
Dear Colleagues,
The field of microelectronics is at the forefront of technological innovation, driving advancements in various sectors such as computing, communications, healthcare, and energy. This Special Issue aims to showcase the latest research and developments in microelectronic devices and materials, with a focus on novel device architectures, advanced fabrication techniques, and innovative material applications. Topics of interest include, but are not limited to, semiconductor devices, sensors, thin-film technologies, nanomaterials, MEMS/NEMS, flexible substrates, and integration strategies for enhanced performance and reliability. Contributions that address challenges in scaling, energy efficiency, and sustainability are particularly encouraged. By bringing together researchers and practitioners from academia and industry, this Special Issue seeks to foster collaboration and the exchange of knowledge, paving the way for next-generation microelectronic technologies.
Dr. Milija Sarajlic
Prof. Dr. Danijela Randjelovic
Dr. Predrag Poljak
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Keywords
- microelectronic devices
- semiconductor materials
- thin-film technologies
- MEMS/NEMS
- nanomaterials
- flexible substrates
- sensors
- device fabrication
- integration techniques
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