Recent Progress in Magnetron Sputtering of Coatings and Thin Films

A special issue of Coatings (ISSN 2079-6412). This special issue belongs to the section "Thin Films".

Deadline for manuscript submissions: 25 August 2026

Special Issue Editors

International Research Center for EM Metamaterials and Institute of Advanced Magnetic Materials, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, China
Interests: micro-nano devices; magnetron sputtering; magnetic film; micro-nano magnetic; high frequency
International Research Center for EM Metamaterials and Institute of Advanced Magnetic Materials, College of Materials and Environmental Engineering, Hangzhou Dianzi University, Hangzhou 310018, China
Interests: metal additive manufacturing

Special Issue Information

Dear Colleagues,

Magnetron sputtering is a type of physical vapor deposition (PVD). With its advantages of easy operation, high film quality, and strong repeatability, it has become a commonly used method for preparing various functional thin films. Among various target materials, magnetic target materials have broad application prospects in electronic devices, magnetic storage, sensors, and other fields due to their unique magnetic, electrical, and mechanical properties. However, the high magnetic permeability of magnetic targets can interfere with the distribution of magnetron sputtering equipment, thereby affecting plasma confinement and sputtering efficiency. This results in multiple challenges during film formation. In addition, with the existence of numerous scientific issues that have yet to be clarified in classical magnetron sputtering depositions (e.g., process control and stability, nanostructuration mechanisms, connection between film morphology and properties, or upscaling procedures from the laboratory to industrial scales), we have edited a specialized volume containing state-of-the-art research containing innovative fundamental and applied research topics. These include, but are not limited to, the following:

  • New thin film materials;
  • Nanostructure-related properties;
  • Atomistic processes during film growth;
  • Process control, process stability, and in situ diagnostics;
  • Thin film nanostructuration phenomena;
  • Combined procedures based on the magnetron sputtering technique;
  • Industrial applications;
  • Film devices.

Dr. Lianze Ji
Dr. Dapeng Zhu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • magnetron sputtering
  • thin films
  • structure and microstructure
  • film devices
  • functional properties

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Published Papers

This special issue is now open for submission.
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