Advanced Thin Films of High-Entropy Alloys

A special issue of Coatings (ISSN 2079-6412). This special issue belongs to the section "Thin Films".

Deadline for manuscript submissions: 31 December 2025 | Viewed by 57

Special Issue Editors


E-Mail Website
Guest Editor
School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan 430023, China
Interests: high-entropy alloy; film; coating; porous membrane; hydrogen evolution
State Key Laboratory of Material Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
Interests: ferroelectric ceramics; piezoelectric ceramcis; dielectric ceramics; spark plasma sintering; ceramic composites; microstructure

E-Mail Website
Guest Editor Assistant
School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan 430023, China
Interests: high-entropy alloy; ferroelectric thin film; coating

Special Issue Information

Dear Colleagues,

High-entropy alloys (HEAs) have emerged as a revolutionary class of materials in recent decades. Their unique multi-principal-element composition, typically consisting of five or more elements in equimolar or near-equimolar ratios, endows them with exceptional properties such as high strength, good ductility, excellent corrosion resistance, and high-temperature stability. These properties make HEAs attractive candidates for a wide range of applications, ranging from aerospace components to energy-related devices.

Thin films of high-entropy alloys have further expanded the scope of their applications. The reduced dimensionality in thin-film form not only enables the study of fundamental material properties at the nanoscale but also offers opportunities for integration into micro- and nano-electronic devices, sensors, chemical industry, biology, medicine, food processing, new energy sources, and coatings for wear and corrosion protection. The ability to precisely control the composition, structure, and morphology of high-entropy alloy thin films is crucial for tailoring their properties to meet the requirements of specific applications.

We invite you to submit manuscripts for publication in this Special Issue: Advanced Thin Films of High-Entropy Alloys. This Special Issue will present the latest developments in this field.

In this Special Issue, original research articles and reviews are welcome. Research areas may include (but not limited to) the following:

  • Fabrication methods and optimization of thin films;
  • Fundamental principles of thin films;
  • Functional properties and applications of thin films;
  • Multifunctional high-entropy alloy thin films;
  • Integration with micro- and nano-electronic devices;
  • Three-dimensional integration and additive manufacturing of high-entropy alloy thin films.

We look forward to receiving your contributions.

Dr. Junsheng Yang
Dr. Hua Tan
Guest Editors

Dr. Wenkai Jiang
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced thin film
  • high-entropy alloy
  • fabrication method of thin films
  • applications of thin film
  • micro- and nano-electronic devices
  • functionalization of thin films
  • characterization of thin films
  • functional coatings
  • gradient thin films
  • novel thin-film electrode

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Published Papers

This special issue is now open for submission.
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