Special Issue "Physics and Mechanics of New Materials and Their Applications 2019"

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Applied Physics".

Deadline for manuscript submissions: 1 January 2020.

Special Issue Editors

Prof. Ivan A. Parinov
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Guest Editor
I. I. Vorovich Mathematics, Mechanics, and Computer Science Institute, Southern Federal University, Rostov-on-Don, Russia
Interests: microstructure; superconductivity; superconductors; piezoelectric ceramics; piezoelectric composites; piezoelectric devices; energy harvesting; optics
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Prof. B. Tien-Long
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Guest Editor
Department of Mechanical Engineering, Hanoi University of Science and Technology-HUST, Hungyen University of Technology and Education, Vietnam Association for Science Editing – VASE, Vietnam
Interests: metal engineering materials; environmental materials; lubricant and tribology; CAD/CAM/CAE application; mechatronics; industrial instruments; EDM; materials machining; machines; mechanical properties; strength properties; finite-element modeling; mathematical modeling
Prof. Shun-Hsyung Chang
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Guest Editor
Department of Microelectronic Engineering, National Kaohsiung University of Science and Technology, Taiwan, ROC
Interests: signal processing; electrical engineering; signal analysis; time–frequency analysis; transducers; ultrasonics; piezoelectricity; array signal processing; adaptive beamforming
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Prof. Hung-Yu Wang
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Guest Editor
Department of Electronic Engineering, National Kaohsiung University of Science and Technology, Taiwan, ROC
Interests: analog IC design; circuit theory; analysis and synthesis; applied electronics

Special Issue Information

Dear Colleagues,

To boost the development of artificial intelligent correlative technologies, better performance of sensing devices, signal processing, and communication are prerequisites. To enhance the function and performance of sensing devices, the mechanics investigation of related materials, circuits, and applications are critical. The present Special Issue aims to explore new trends in physics and mechanics of new materials and their applications. A certain number of contributions for this Special Issue will come from selected papers of PHENMA 2019 Hanoi, the 8th “International conference on Physics and Mechanics of New Materials and Their Applications”.

http://phenma2019.math.sfedu.ru/

Topics of interest (among others) include:

Materials: ferro-piezoelectrics, semiconductors, superconductors, environmental materials, medical materials, composite, ceramics, thin films, nanomaterials, new materials for additive manufacturing, metal engineering materials, etc.;

Synthesis & Processing: powder processing, processing technologies, piezoelectric technologies, MEMS-processing, etc.;

Characterization and Research Methods: microstructure properties, physical properties, mechanical properties, strength properties, finite-element modeling, mathematical modeling, physical modeling, physical experiment, etc.;

Applications: MEMS, heterostructures, piezotransducers, superconductive devices, light-emitting diodes, multimedia communication, fiber reinforced composites, construction health monitoring, lubricant and tribology, waste, etc.;

Energy Harvesting: materials, methods and applications;

Underwater Technologies: underwater communication, marine engineering, power system, ocean energy, etc.;

Industry and Management: CAD/CAM/CAE application, industrial instruments, EDM, materials machining, machines, etc.

Prof. Ivan A. Parinov
Prof. B. Tien-Long
Prof. Shun-Hsyung Chang
Prof. Hung-Yu Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 1500 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers

This special issue is now open for submission.
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