applsci-logo

Journal Browser

Journal Browser

Technological Advancements and Innovative Applications of AIoT and Edge AI

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Computing and Artificial Intelligence".

Deadline for manuscript submissions: 10 October 2026 | Viewed by 238

Special Issue Editors


E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, Tamkang University, New Taipei City 251, Taiwan
Interests: wireless communication systems; internet of things applications; 5G/B5G and next-generation communication (6G) technology; smart healthcare
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We invite submissions focused on the technological advancements and innovative applications of AIoT and Edge AI. This call emphasizes technical breakthroughs in distributed computing architectures, lightweight deep learning (TinyML), heterogeneous sensor fusion, and low-power communication protocols. We specifically encourage research that demonstrates how these core technologies optimize system performance and address ESG sustainability challenges, such as energy efficiency, carbon footprint monitoring, and green supply chains. Authors should present rigorous engineering validations, highlighting measurable improvements in computational power, inference latency, and energy efficiency. We look forward to manuscripts that advance the state-of-the-art in AIoT systems while demonstrating scalable solutions for a sustainable future.

Dr. Shu-Han Liao
Dr. Miguel García-Pineda
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • artificial intelligence of things (AIoT)
  • edge computing
  • TinyML
  • deep learning on chip
  • heterogeneous data fusion
  • smart sensing systems
  • green computing
  • energy efficiency

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • Reprint: MDPI Books provides the opportunity to republish successful Special Issues in book format, both online and in print.

Further information on MDPI's Special Issue policies can be found here.

Published Papers

This special issue is now open for submission.
Back to TopTop