Electronic engineering and hardware systems focus on the design, development, and testing of electronic circuits, devices, and systems, including both hardware and software components. This field encompasses a wide range of applications, from basic electronic components to complex systems. 

MDPI’s cluster of electronic engineering and hardware systems aims to publish cutting-edge research in electronics and hardware systems, catering to academic and industrial advancements. This journal cluster represents a platform fostering innovation, from chip design (Chips) to low-power systems (JLPEA) and microwave engineering (Microwave), facilitating rapid dissemination of innovations. 

The six participating journals include the following: 

• Chips (ISSN: 2674-0729) covers all aspects of chip-related research. The journal publishes papers that are about the designs of chips, chip production, and related applications. Chips is led by its Editor-in-Chief, Prof. Dr. Gaetano Palumbo (Università di Catania, Italy);
• Electronics (ISSN: 2079-9292) is a comprehensive open access journal that publishes cutting-edge research spanning the entire spectrum of electronic science and technology. Edited by Prof. Flavio Canavero, it provides fast publication and global knowledge-sharing for researchers and engineers. The journal is led by its Editor-in-Chief, Prof. Dr. Flavio Canavero (Politecnico di Torino, Italy);
• Hardware (ISSN: 2813-6640) is an open access journal publishing articles detailing the construction of a broad range of scientific and laboratory instrumentation, devices, and equipment. It is a platform for the dissemination of open source hardware designs. Hardware publishes regular papers, review articles, and tutorials as well as Special Issues on particular subjects. The journal is led by its Editor-in-Chief, Prof. Dr. Peter C. Hauser (University of Basel, Switzerland);
• Journal of Low Power Electronics and Applications (JLPEA, ISSN: 2079-9268) is an open access journal which provides an advanced forum for rapid dissemination of innovative research and important results in all aspects of low power electronics and design. The journal is led by its Editor-in-Chief, Dr. Davide Bertozzi (University of Manchester, UK);
• Microelectronics (ISSN: 3042-5344) covers all aspects of microelectronics science, from fundamentals and physics, materials and fabrication technology, device design, circuit design and system integration to its application and emerging technologies and testing and reliability. Microelectronics is led by its Editor-in-Chief, Prof. Dr. M. Jamal Deen (McMaster University, Canada);
• Microwave (ISSN: 3042-5697) is dedicated to advancing research in microwave theory, technology, and applications. It covers key areas such as microwave components, antennas, propagation, and applications in communication, sensing, and biomedicine. Microwave is led by its Editor-in-Chief, Prof. Dr. Changjun Liu (Sichuan University, China).

 MDPI’s mission and values:

As a pioneer of academic open access publishing, MDPI has been serving the scientific community since 1996. Our aim is to foster scientific exchange in all forms, across all disciplines. MDPI’s guidelines for disseminating open science are based on the following values and guiding principles:

• Open Access—All of our content is published in open access and distributed under a Creative Commons License, providing free access to science and the latest research, allowing articles to be freely shared and content to be re-used with proper attribution;
• Timeliness and Efficiency—Publishing the latest research through thorough editorial work, ensuring a first decision is provided to authors in under 32 days and papers are published within 7–10 days of acceptance;
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• Rooted in Sustainability—Ensuring the long-term preservation of published papers and supporting the future of science through partnerships, sponsorships, and awards. 

By adhering to these values and principles, MDPI remains committed to advancing scientific knowledge and promoting open science practices. 

Selected Topics:

• “Advances in Microelectronics and Semiconductor Engineering”;
• “Computer Vision and Image Processing, 2nd Edition”;
• “New Developments for Circuit Design: Synthesis, Modeling, Simulation, and Applications”;
• “VLSI-Based Sequential Devices in Cyber-Physical Systems”. 

Selected Articles: 

Chips
“Silicon Radiation Detector Technologies: From Planar to 3D”
by Gian-Franco Dalla Betta and Jixing Ye
Chips 2023, 2(2), 83-101; https://doi.org/10.3390/chips2020006 

Electronics
“DC-YOLOv8: Small-Size Object Detection Algorithm Based on Camera Sensor”
by Haitong Lou, Xuehu Duan, Junmei Guo, Haiying Liu, Jason Gu, Lingyun Bi and Haonan Chen
Electronics 2023, 12(10), 2323; https://doi.org/10.3390/electronics12102323 

Hardware
“Tactile Simultaneous Localization and Mapping Using Low-Cost, Wearable LiDAR”
by John LaRocco, Qudsia Tahmina, John Simonis, Taylor Liang and Yiyao Zhang
Hardware 2024, 2(4), 256-272; https://doi.org/10.3390/hardware2040012 

JLPEA
“FPGA-Based Decision Support System for ECG Analysis”
by Agostino Giorgio, Cataldo Guaragnella and Maria Rizzi
Low Power Electron. Appl. 2023, 13(1), 6; https://doi.org/10.3390/jlpea13010006 

Microwave
“Design of a Novel Ultra-Wideband Antipodal Vivaldi Antenna Based on Klopfenstein Curve”
by Yanxing Zhang and Jinling Zhang
Microwave 2025, 1(1), 4; https://doi.org/10.3390/microwave1010004