Nakamura, T.; Nishioka, M.; Tomitsuka, K.; Yoshida, H.; Sakuma, H.; Uemura, S.
Comparison between Magnetic Fields and Electric Fields of Microwave Radiation for Heating the Solder Used to Connect a Transistor to a Printed Circuit Board. Processes 2023, 11, 491.
https://doi.org/10.3390/pr11020491
AMA Style
Nakamura T, Nishioka M, Tomitsuka K, Yoshida H, Sakuma H, Uemura S.
Comparison between Magnetic Fields and Electric Fields of Microwave Radiation for Heating the Solder Used to Connect a Transistor to a Printed Circuit Board. Processes. 2023; 11(2):491.
https://doi.org/10.3390/pr11020491
Chicago/Turabian Style
Nakamura, Takashi, Masateru Nishioka, Kenichi Tomitsuka, Hisahiko Yoshida, Haruya Sakuma, and Sei Uemura.
2023. "Comparison between Magnetic Fields and Electric Fields of Microwave Radiation for Heating the Solder Used to Connect a Transistor to a Printed Circuit Board" Processes 11, no. 2: 491.
https://doi.org/10.3390/pr11020491
APA Style
Nakamura, T., Nishioka, M., Tomitsuka, K., Yoshida, H., Sakuma, H., & Uemura, S.
(2023). Comparison between Magnetic Fields and Electric Fields of Microwave Radiation for Heating the Solder Used to Connect a Transistor to a Printed Circuit Board. Processes, 11(2), 491.
https://doi.org/10.3390/pr11020491