Effect of the Inclination Angle on the Steady-State Heat Transfer Performance of a Thermosyphon
AbstractA two-phase closed thermosyphon is an efficient heat transfer element. The heat transfer process of this type of thermosyphon includes conduction and convective heat transfer accompanied by phase changes. Variations in the inclination angle of a thermosyphon affect the steady-state heat transfer performance of the device. Therefore, the inclination angle is an important factor affecting the performance of a thermosyphon. In this paper, an equation for the actual heating area variations with respect to the inclination angle is deduced, and a model for the areal thermal resistance of a thermosyphon is proposed by analyzing the main influence mechanisms of the inclination angle on the heat transfer process. The experimental results show that the areal thermal resistance, which accounts for the effect of the actual heating area, does not change with respect to the inclination angle and exhibits a linear relationship with the heat transfer rate. The thermal resistance equation is fit according to the experimental data when the inclination angle of the thermosyphon is vertically oriented (90°), and the predicted values of the thermosyphon’s thermal resistance are obtained when the thermosyphon is inclined. The deviations between the experimental data and predicted values are less than ±0.05. Therefore, the theoretical equation can accurately predict the thermosyphon’s thermal resistance at different inclination angles. View Full-Text
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Wu, Y.; Zhang, Z.; Li, W.; Xu, D. Effect of the Inclination Angle on the Steady-State Heat Transfer Performance of a Thermosyphon. Appl. Sci. 2019, 9, 3324.
Wu Y, Zhang Z, Li W, Xu D. Effect of the Inclination Angle on the Steady-State Heat Transfer Performance of a Thermosyphon. Applied Sciences. 2019; 9(16):3324.Chicago/Turabian Style
Wu, Yafeng; Zhang, Zhe; Li, Wenbin; Xu, Daochun. 2019. "Effect of the Inclination Angle on the Steady-State Heat Transfer Performance of a Thermosyphon." Appl. Sci. 9, no. 16: 3324.
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