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Appl. Sci. 2018, 8(10), 1706; https://doi.org/10.3390/app8101706

Study on the Reliability of Sn50Pb49Sb1/Cu Solder Joints Subjected to γ-ray Irradiation

College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
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Received: 24 August 2018 / Revised: 10 September 2018 / Accepted: 13 September 2018 / Published: 20 September 2018
(This article belongs to the Special Issue Selected Papers from the NMJ2018)
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Abstract

Cosmic radiation has always been the most obvious barrier to planetary travels, especially in long-duration deep space exploration missions. Therefore, the reliability of satellite materials and the requirements of satellite miniaturization have received considerable attention. In this paper, the effect of γ-ray irradiation on the reliability of Sn50Pb49Sb1/Cu solder joints was investigated. It was found that the influence of γ-ray irradiation on the thickness and morphology of the intermetallic compound layer in Sn50Pb49Sb1/Cu was not obvious. However, the formation and growth of micro-voids and micro-cracks was observed in Pb-based solid solutions. Due to the Compton effect, the γ-ray photon could knock the electron out of its orbit, which created the energetic electron. The accumulation of dislocated atoms and lattice vacancies generated by energetic electrons could be the main factor that caused the formation of micro-voids and micro-cracks. The pull force of Sn50Pb49Sb1/Cu solder joints was reduced by 22% after being irradiated at the dose rate of 0.25 Gy(Si)/s for 960 h. Fractographic analysis showed that after irradiation, the fracture type of solder joints was still ductile but the ductility of the solder joints decreased with slightly inconspicuous dimples. View Full-Text
Keywords: Sn50Pb49Sb1 solder joint; γ-ray irradiation; fractographic analysis; pull force; microstructure Sn50Pb49Sb1 solder joint; γ-ray irradiation; fractographic analysis; pull force; microstructure
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Wang, J.; Xue, S.; Lv, Z.; Wen, L.; Liu, S. Study on the Reliability of Sn50Pb49Sb1/Cu Solder Joints Subjected to γ-ray Irradiation. Appl. Sci. 2018, 8, 1706.

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