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Open AccessArticle

Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications

Departament de Màquines i Motors Tèrmics, ESEIAAT, Universitat Politècnica de Catalunya, C/Colom 11, 08222 Terrassa, Spain
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Polymers 2018, 10(3), 340; https://doi.org/10.3390/polym10030340
Received: 13 February 2018 / Revised: 9 March 2018 / Accepted: 15 March 2018 / Published: 20 March 2018
(This article belongs to the Special Issue Thermosets)
An epoxy-thiol system filled with boron nitride (BN), in the form of 80 µm agglomerates, has been investigated with a view to achieving enhanced thermal conductivity. The effect of BN content on the cure reaction kinetics has been studied by differential scanning calorimetry (DSC) and the thermal conductivity of the cured samples has been measured by the transient hot bridge method. The heat of reaction and the glass transition temperature of the fully cured samples are both independent of the BN content, but the cure reaction kinetics is not: with increasing BN content, the reaction first advances and is then delayed, this behaviour being more pronounced than for the same system with 6 µm BN particles, investigated previously. This dependence on BN content is attributed to the effects of heat transfer, and the DSC results can be correlated with the thermal conductivity of the cured systems, which is found to increase with both BN content and BN particle size. For a given BN content, the values of thermal conductivity obtained are significantly higher than many others reported in the literature, and achieve a value of over 4.0 W/mK for a BN content of about 40 vol %. View Full-Text
Keywords: epoxy; thiol; boron nitride; differential scanning calorimetry (DSC); thermal conductivity epoxy; thiol; boron nitride; differential scanning calorimetry (DSC); thermal conductivity
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MDPI and ACS Style

Hutchinson, J.M.; Román, F.; Folch, A. Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications. Polymers 2018, 10, 340. https://doi.org/10.3390/polym10030340

AMA Style

Hutchinson JM, Román F, Folch A. Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications. Polymers. 2018; 10(3):340. https://doi.org/10.3390/polym10030340

Chicago/Turabian Style

Hutchinson, John M.; Román, Frida; Folch, Adrià. 2018. "Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications" Polymers 10, no. 3: 340. https://doi.org/10.3390/polym10030340

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