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Open AccessCommunication

Piezoelectric Impedance-Based Non-Destructive Testing Method for Possible Identification of Composite Debonding Depth

1
Sustainable Infrastructure Research Center, Korea Institute of Civil Engineering & Building Technology, Gyeonggi-Do 10223, Korea
2
Future Infrastructure Research Center, Korea Institute of Civil Engineering & Building Technology, Gyeonggi-Do 10223, Korea
*
Author to whom correspondence should be addressed.
Micromachines 2019, 10(9), 621; https://doi.org/10.3390/mi10090621
Received: 3 August 2019 / Revised: 10 September 2019 / Accepted: 16 September 2019 / Published: 17 September 2019
(This article belongs to the Special Issue Piezoelectric Transducers: Materials, Devices and Applications)
Detecting the depth and size of debonding in composite structures is essential for assessing structural safety as it can weaken the structure possibly leading to a failure. As composite materials are used in various fields up to date including aircrafts and bridges, inspections are carried out to maintain structural integrity. Although many inspection methods exist for detection damage of composites, most of the techniques require trained experts or a large equipment that can be time consuming. In this study, the possibility of using the piezoelectric material-based non-destructive method known as the electromechanical impedance (EMI) technique is used to identify the depth of debonding damage of glass epoxy laminates. Laminates with various thicknesses were prepared and tested to seek for the possibility of using the EMI technique for identifying the depth of debonding. Results show promising outcome for bringing the EMI technique a step closer for commercialization. View Full-Text
Keywords: debonding; non-destructive testing; piezoelectric; electromechanical impedance; damage detection; impedance-based technique; damage depth debonding; non-destructive testing; piezoelectric; electromechanical impedance; damage detection; impedance-based technique; damage depth
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MDPI and ACS Style

Na, W.S.; Baek, J. Piezoelectric Impedance-Based Non-Destructive Testing Method for Possible Identification of Composite Debonding Depth. Micromachines 2019, 10, 621.

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