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CO Adsorption Performance of CuCl/Activated Carbon by Simultaneous Reduction–Dispersion of Mixed Cu(II) Salts

College of Chemistry and Chemical Engineering, Taiyuan University of Technology, Taiyuan 030024, China
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Materials 2019, 12(10), 1605; https://doi.org/10.3390/ma12101605
Received: 15 April 2019 / Revised: 13 May 2019 / Accepted: 14 May 2019 / Published: 16 May 2019
(This article belongs to the Special Issue Porous Materials for Environmental Applications)
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Abstract

CO is a toxic gas discharged as a byproduct in tail gases from different industrial flue gases, which needs to be taken care of urgently. In this study, a CuCl/AC adsorbent was made by a facile route of physically mixing CuCl2 and Cu(HCOO)2 powder with activated carbon (AC), followed by heating at 533 K under vacuum. The samples were characterized by X-ray powder diffraction (XRD), inductively coupled plasma optical emission spectrometry (ICP-OES), N2 adsorption/desorption, and scanning electron microscopy (SEM). It was shown that Cu(II) can be completely reduced to Cu(I), and the monolayer dispersion threshold of CuCl on AC support is 4 mmol·g−1 AC. The adsorption isotherms of CO, CO2, CH4, and N2 on CuCl/AC adsorbents were measured by the volumetric method, and the CO/CO2, CO/CH4, and CO/N2 selectivities of the adsorbents were predicted using ideal adsorbed solution theory (IAST). The obtained adsorbent displayed a high CO adsorption capacity, high CO/N2, CO/CH4, and CO/CO2 selectivities, excellent ad/desorption cycle performance, rapid adsorption rate, and appropriate isosteric heat of adsorption, which made it a promising adsorbent for CO separation and purification. View Full-Text
Keywords: CuCl/AC adsorbent; CO adsorption; monolayer dispersion; isosteric heat; adsorption isotherms CuCl/AC adsorbent; CO adsorption; monolayer dispersion; isosteric heat; adsorption isotherms
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Xue, C.; Hao, W.; Cheng, W.; Ma, J.; Li, R. CO Adsorption Performance of CuCl/Activated Carbon by Simultaneous Reduction–Dispersion of Mixed Cu(II) Salts. Materials 2019, 12, 1605.

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