Next Article in Journal
The Effect of Tab Attachment Positions and Cell Aspect Ratio on Temperature Difference in Large-Format LIBs Using Design of Experiments
Next Article in Special Issue
Collective Losses of Low Power Cage Induction Motors—A New Approach
Previous Article in Journal
Optimization and Analysis of a High Power Density and Fault Tolerant Starter–Generator for Aircraft Application
Previous Article in Special Issue
In Loop Design of the Coils and the Electromagnetic Shielding Elements for the Wireless Charging Systems
 
 
Article

Analysis of Influence Factors for Heat Generation Minimization of DC-Link Capacitor

1
Department of Mechanics Engineering, Kongju National University, Cheonan-daero, Seobuk-gu, Cheonan-si 31080, Korea
2
Industrial Technology Research Institute, Kongju National University, Cheonan-daero, Seobuk-gu, Cheonan-si 31080, Korea
3
Department of Future Convergence Engineering, Industrial Technology Research Institute, Kongju National University, Cheonan-daero, Seobuk-gu, Cheonan-si 31080, Korea
*
Authors to whom correspondence should be addressed.
Energies 2021, 14(1), 114; https://doi.org/10.3390/en14010114
Received: 7 November 2020 / Revised: 23 December 2020 / Accepted: 24 December 2020 / Published: 28 December 2020
With the rapid development of ecofriendly cars, various inverters are also being developed depending on the performance of motors. The DC-link capacitor is used as an inverter component; however, there are several limitations on its size, such as the requirement for wide films. Film width is a major factor that affects the capacitor’s equivalent series resistance (ESR) and is closely related to heat generation. When the temperature of the capacitor increases, the dielectric breakdown due to high voltage causes a reduction in capacitance, which leads to a decrease in inverter power and causes vehicle defects; this needs to be addressed to minimize the heat of the capacitor. Recently, genetic films that can be used at high temperatures have been developed. However, producing such films is difficult because of their 5 µm thickness; thus, the size increases when they are designed and they consequently cannot be used in practical applications. Based on a film width of 50 mm, this study analyzed the factors that can reduce ESR, set the level for each factor, and conducted experiments using the Box–Behnken design. The variables (thermal conductivity, film thickness, and capacitance) were set to three levels for each factor, and the ESR, thermal flux, and temperature characteristics were analyzed through finite element analysis. Based on the temperature results, optimized conditions for film thickness of 3.15 μm, capacitance of 390 μF, and thermal conductivity epoxy of 4.5 W/m·K were derived using Minitab, and samples were made for verification tests. A capacitor was installed in the chamber and was saturated for 2 h at 85 °C and current of 50 A rms was applied at 16 kHz frequency. The K Type sensor attached to the film surface was connected to a temperature recorder to measure the temperature change in the film over time after applying the current. The experimental results confirmed that the temperature of the genetic film with a 50 mm film width was similar to that with a 35 mm film width, and this confirmed that the set factors were similar to that of the genetic film with 35 mm film width. It was confirmed that increased film width can reduce ESR and minimize heat generation. View Full-Text
Keywords: DC-link capacitor; equivalent series resistance (ESR), thermal conductivity; dielectric thickness; capacitance; thermal resistance DC-link capacitor; equivalent series resistance (ESR), thermal conductivity; dielectric thickness; capacitance; thermal resistance
Show Figures

Figure 1

MDPI and ACS Style

Jeon, Y.W.; Kim, Y.S.; Jeon, E.S. Analysis of Influence Factors for Heat Generation Minimization of DC-Link Capacitor. Energies 2021, 14, 114. https://doi.org/10.3390/en14010114

AMA Style

Jeon YW, Kim YS, Jeon ES. Analysis of Influence Factors for Heat Generation Minimization of DC-Link Capacitor. Energies. 2021; 14(1):114. https://doi.org/10.3390/en14010114

Chicago/Turabian Style

Jeon, Yong Won, Young Shin Kim, and Euy Sik Jeon. 2021. "Analysis of Influence Factors for Heat Generation Minimization of DC-Link Capacitor" Energies 14, no. 1: 114. https://doi.org/10.3390/en14010114

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop