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Correction published on 10 April 2019, see Sensors 2019, 19(7), 1725.
Open AccessArticle

A Novel Fingerprint Sensing Technology Based on Electrostatic Imaging

State Key Laboratory of Mechatronics Engineering and Control, Beijing Institute of Technology, Beijing 100081, China
Author to whom correspondence should be addressed.
Sensors 2018, 18(9), 3050;
Received: 14 July 2018 / Revised: 3 September 2018 / Accepted: 9 September 2018 / Published: 12 September 2018
(This article belongs to the Special Issue Innovative Sensor Technology for Intelligent System and Computing)
In this paper, we propose a new fingerprint sensing technology based on electrostatic imaging, which can greatly improve fingerprint sensing distance. This can solve the problem of the existing capacitive fingerprint identification device being easy to damage due to limited detection distance and a protective coating that is too thin. The fingerprint recognition sensor can also be placed under a glass screen to meet the needs of the full screen design of the mobile phone. In this paper, the electric field distribution around the fingerprint is analyzed. The electrostatic imaging sensor design is carried out based on the electrostatic detection principle and MEMS (micro-electro-mechanical system) technology. The MEMS electrostatic imaging array, analog, and digital signal processing circuit structure are designed. Simulation and testing are carried out as well. According to the simulation and prototype test device test results, it is confirmed that our proposed electrostatic imaging-based fingerprint sensing technology can increase fingerprint recognition distance by 46% compared to the existing capacitive fingerprint sensing technology. A distance of more than 439 μm is reached. View Full-Text
Keywords: electrostatic imaging; fingerprint sensing; MEMS; electrostatics field electrostatic imaging; fingerprint sensing; MEMS; electrostatics field
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Tang, K.; Liu, A.; Wang, W.; Li, P.; Chen, X. A Novel Fingerprint Sensing Technology Based on Electrostatic Imaging. Sensors 2018, 18, 3050.

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