You are currently viewing a new version of our website. To view the old version click .
Sensors
  • Article
  • Open Access

30 November 2015

Simulated and Real Sheet-of-Light 3D Object Scanning Using a-Si:H Thin Film PSD Arrays

,
,
,
,
and
1
Institute of Design and Manufacturing, Technical University of Valencia, CPI, Edif. 8G, 46022 Valencia, Spain
2
CENIMAT/I3N, Department of Material Science, Faculty of Science and Technology, FCT, New University of Lisbon and CEMOP/UNINOVA, 2829-516 Caparica, Portugal
3
Department of Electrical Engineering, Faculty of Science and Technology, FCT, New University of Lisbon, and CTS/UNINOVA, Campus da Caparica, 2928-516 Caparica, Portugal
*
Authors to whom correspondence should be addressed.
This article belongs to the Special Issue Imaging: Sensors and Technologies

Abstract

A MATLAB/SIMULINK software simulation model (structure and component blocks) has been constructed in order to view and analyze the potential of the PSD (Position Sensitive Detector) array concept technology before it is further expanded or developed. This simulation allows changing most of its parameters, such as the number of elements in the PSD array, the direction of vision, the viewing/scanning angle, the object rotation, translation, sample/scan/simulation time, etc. In addition, results show for the first time the possibility of scanning an object in 3D when using an a-Si:H thin film 128 PSD array sensor and hardware/software system. Moreover, this sensor technology is able to perform these scans and render 3D objects at high speeds and high resolutions when using a sheet-of-light laser within a triangulation platform. As shown by the simulation, a substantial enhancement in 3D object profile image quality and realism can be achieved by increasing the number of elements of the PSD array sensor as well as by achieving an optimal position response from the sensor since clearly the definition of the 3D object profile depends on the correct and accurate position response of each detector as well as on the size of the PSD array.

1. Introduction

Sheet-of-light range imaging is an interesting technique that is used in a number of 3D object rendering applications. Among the existing laser scanning techniques, a structured light triangulation method is considered to be fastest when acquiring 3D data information from an object in real time [1]. Generally, sheet-of-light systems use digital sensors such as CCDs (Charged Coupled Devices) or CMOS (Complementary Metal Oxide Semiconductors) [2], nevertheless, analog sensors such as arrays of PSDs (position sensitive detectors) with reported sizes of up to a maximum of 128 have also been employed [3,4]. The latter are fabricated using crystalline silicon, however, PSD arrays based on amorphous silicon nip or pin structures also exist and have already been described elsewhere [5,6]. In this work, results show for the first time the possibility of scanning an object in 3D when using an a-Si:H thin film 128 PSD array system and, in addition, a MATLAB/SIMULINK software simulation has been constructed in order to view and analyze the potential of PSD array concept technology before it is further expanded or developed. This study will enable the triangulation platform and system to be further developed and enhanced for future needs identified during simulations. Inspired by the simulation, examples of improvements and future adaptations could be the inclusion of suitable 360°rotation plates, faster translation tables, more precise optics and laser lines as well as larger sensor arrays depending of course on the limitations imposed by such a scenario. This simulation allows changing most of its parameters, such as the number of elements in the PSD array. The existing 128 PSD array sensor system, when mounted in a triangulation platform, is able to perform 3D object profile scans at high resolutions and speeds with a large number of frames, and this experiment was already presented here. Our previous works describe the implementation, characteristics and behavior of such 32/128 PSD array sensor systems, as well as the manner in which the scanned 3D object profile image is constructed thereby presenting a high speed sheet-of-light 3D object rendering platform [7] using as sensor an array of 32 amorphous silicon position sensitive detectors [6]. In the most recent work [8], we also exploited the 3D scanning optical characteristics of such an inspection system.

Analog versus Digital Technology

The foreseen PSD array technology roadmap proposes the use of amorphous silicon or other more suitable materials such as nanocrystalline silicon (which does not degrade as much), for the fabrication of analog 32/128/256/512/1024 PSD array sensors. The latter are used to scan and represent 3D profiles of objects in real-time [8], preferably at a greater speed than digital CCD or CMOS-based systems.
AT-Automation Technology GmbH [9], manufactures the most advanced CMOS sensor based sheet-of-light laser triangulation 3D cameras. They use digital sensors such as CMOS sensors (e.g., 1280 × 1024 pixels). The principle of application for these 3D sheet-of-light cameras is exactly the same as the one used for the 3D PSD sensor system and thereby they are the most advanced direct competitors in terms of speed, resolution and overall system performance, since they claim their cameras are the fastest in the world. One of their cameras (C4-1280) reaches 40,000 profiles/frames per second, when using 128 pixels and 128 rows of the sensors, representing only just a small part of the whole sensor (1280 × 1024 pixels).
Amorphous or nanocrystalline 32/128/256/512/1024 PSD array 3D sensors would be an alternative to these CMOS cameras in similar application scenarios. The overall performance between both technologies will be similar when using the 128 PSD sensor, however, amorphous or nanocrystalline 256/512/1024 PSD array 3D sensors are expected to outperform these 3D CMOS cameras when used in high speed 3D scanning applications. The reason for this is that the analog structure of the PSD sensor is different to the traditional discrete sensor and thereby it can process data much faster than a pixel-based structure. The resolution of these 3D CMOS cameras is quite good, depending on the application, and, in some applications, they claim to reach resolutions of about 35 µm or even 10 or 5 µm [9].
Therefore, it seems 3D cameras with digital sensors are already quite advanced and relatively cheap. A complete set generally includes a camera, laser and lens but not the software; nevertheless, third party software is readily available.

2. 128 PSD Array System 3D Object Profile Scanning

As already described in our previous work [7], an array of 32 amorphous silicon position sensitive detectors, was integrated inside a self-constructed machine vision system as the vision sensor component and the response was analyzed for the required application. Such work proposed the use of these sensors and relevant systems for 3D object profiling even at high speeds. A photograph of an amorphous silicon 128 element PSD linear array developed at CEMOP/UNINOVA is shown in Figure 1.
Figure 1. Amorphous silicon 128 PSD array glued and wire bonded to a suitable chip carrier.
This device can also be regarded as a three-dimensional PSD, being simply an array of one-dimensional PSDs mounted together in parallel to each other on a surface, where the separation between them and the detector width defines the minimum discrimination in one direction (discrete), while in the other (along the strip) it is continuous [6]. This type of structure has been specially designed for sheet-of-light 3D shape measurement.
The experimental setup and procedure for obtaining 3D object profiles with the 32 PSD sensor system were already described elsewhere [7,8] and these also apply for the 128 PSD sensor system. Here, we show results for the detection of the same object when using the 128 PSD array sensor system. The width of the rubber is small and it is only covered or detected by a few sensor channels. In addition, in these trials, the translation table (and object) moved from one side to the other so that the object (white color rubber), shown in Figure 2a, was scanned by the laser sheet-of-light system.
The object reflection was projected onto the active area of the 128 PSD sensor array. The dimensions of the rubber object, as measured by an electronic ruler, were the following: Length, 41.90 mm; Width, 16.70 mm; and Height, 11.74 mm.
The total distance travelled by the translation table (object) or scanned distance was about 69.37 mm at a speed of about 0.197 cm/s. As already reported elsewhere [8], here the incident scanning angle was fixed at 45° and the rate of acquisition was kept at 8 ms. The system integration time was maintained at 1ms for all scans and for low noise purposes, results were acquired using 128 sub-samplings (128 sample average). The light intensity recorded on the active area of the 128 PSD sensor array was 2.53 µW/cm².
The results obtained when channel 75 of a 128 PSD sensor array detects the light reflected by the white rubber as a function of the scanned distance are illustrated in Figure 2b. The response was acquired at 65 frames per second leading to 2289 frames in total.
The maximum resolution that can be obtained with an acquisition time of 8 ms derives from the number of maximum possible frames acquired in one second taking into account the lowest possible scanning speed. Therefore, 1/0.008 s = 125 frames per second is the maximum possible acquisition frame rate at present (WINDOWS limitation) for this particular system configuration. Using the previously referred to acquisition time of 8ms and speed of 0.197 cm/s, a calculated scanning resolution of around 15.76 μm should be expected (0.00197/125 = 15.76 μm). However, in reality it takes more than 30 μm to acquire each frame, mainly due to software execution internal timings, etc.
The response shown in Figure 2b corresponds fairly well to the measured length of the rubber object being 41.90 mm as measured by an electronic ruler. Channel 75 of the sensor detects a signal for about 41mm. The difference in the position of the laser line reflected on the sensor active area [8] in Figure 2b (Y-axis) corresponds to the height of the rubber. The real measured height of the rubber being 11.74 mm is equivalent to a height of about 3 mm (from 0 mm to 3 mm on the Y axis) measured of course on the sensor active area after a lens reduction [8].
Figure 2. (a) Photograph of a white rubber object; (b) 3D object profile representation for the individual detection of channel 75 from the 128 PSD array sensor.
The stability of the profile detected is acceptable, even though a slight flickering is observed, which could be attributed to vibrations caused by the translation table during the scanning procedures as well as to the noise of the sensor.

4. Triangulation Platform Configuration and Formulae

The triangulation configuration sketch and formulae derived by Park and DeSouza (see Figure 6.4 in reference [10]) was used to construct the simulation depicted in Figure 6 and Figure 7, which corresponds to the real physical triangulation 3D sensor system scenario, which is being simulated in this SIMULINK model.
The coordinates of each of the 3D scanned points are calculated in accordance to the properties of similar triangles.
The Z-coordinate is calculated using the following expression [10]:
z = f b p + f  tan  θ
where f is the focal length of the camera, p is the image coordinate of the illuminated point, θ is the incident/scanning angle, Xc and Zc (see Figure 6.4 in reference [10]) are two of the three principle axes of the camera coordinate system, respectively, and b (baseline) is the distance between the focal point and the laser along the Xc axis (see Figure 6.4 in reference [10]).
The X-coordinate is calculated using the following expression [10]:
x = b z  tan  θ
The Y-coordinate is calculated using the following expression also from the principle of similar triangles:
y = Y q z
where y is the distance along individual detectors on the sensor measured from the middle point of the sensor on the Y-axis on the sensor active area, Y is the distance measured from the middle point of the translation table (where object is placed) along the Y-axis within the scanning area, q is the distance between the sensor and the lens which is not the focal distance f, and z is the perpendicular distance between the lens and the object or the Z coordinate.
The error in the Z-coordinate measurement, Δz, is obtained by differentiating the equation of the Z-coordinate (Equation (1)), and the resulting expression is illustrated below [10]:
Δ z = z 2 f b Δ p + z 2 sec 2 θ b Δ θ
where Δp and Δθ are the measurement errors of p and θ, respectively.
The results obtained by the physical sensor system (e.g., Figure 2b) when measuring object profiles in 3D conclude that the error of the sensor system when detecting objects in the existing triangulation platform setup is of ~5% in the X-axis and of ~5.6% in the Z-axis, which could be attributed to possible vibrations of the translation table (object) movement during the scanning process as well as to sensor noise. Signal fluctuations (noise in the signal) on the scanned profile define the object measurement error in the Z-axis and the maximum and minimum values of such fluctuations define such error interval.

5. Conclusions and Future Work

It has been demonstrated that a-Si:H 128 PSD sensor arrays and their corresponding systems work correctly and can be used as high speed and high resolution sheet-of-light 3D object scanning systems. The constructed simulation shows a huge potential for the proposed 3D sensor technology, which is clearly able to compete with the most advanced CMOS sensor-based sheet-of-light laser triangulation 3D cameras. Improvements are needed in order to achieve 100% correct sensor position response, especially for the 128 PSD array sensor and such a goal could be attained by fabricating a sensor using a different material, such as nanocrystalline silicon, which hardly degrades the overall position response of the structure over time. Other foreseen restrictions are expected when miniaturizing the sensor, for example to 256, 512 or 1024 elements, now that even if the technology for that purpose exists, problems may occur during material layer fabrication procedures, such as possible short circuiting in sensor channels, etc. Other limitations exist within the triangulation platform. Better optics and equipment can be used to improve the 3D detection setup overall. Anti-vibration and sensor noise reduction measures could be introduced, too. However, system hardware and software do not need to be enhanced.
The successful integration of amorphous silicon PSD array sensors into suitable sheet-of-light 3D object rendering systems is now possible and feasible. The quality and realism of the 3D object profiles depends on the correct and accurate position response of each detector from the sensor as well as on the size of the PSD array, meaning that the higher the number of PSDs integrated on the array, the higher the 3D object profile resolution on the discrete sensor axis, and, subsequently, the higher the number of total image 3D scan points.

Acknowledgments

This work was supported by IDF, Valencia, Spain as well as by “Fundação para a Ciência e a Tecnologia” (Foundation for Science and Technology, FCT-MEC) through a contract with CENIMAT/I3N and by the projects PEst-C/CTM/LA0025/2011 (Strategic Project—LA 25—2011–2012), PTDC/CTM/099719/2008, ADI—2009/003380, and ADI—2009/005610. The author is very grateful to Jordi Uriel for his relevant contribution to this work. The author would also like to thank his colleagues in CENIMAT for their valuable help on sensor fabrication. Javier Contreras would also like to thank FCT-MEC for providing him with the PhD fellowship SFRH/BD/62217/2009.

Author Contributions

Javier Contreras, Josep Tornero conceived and designed the experiments; Javier Contreras performed the experiments; Javier Contreras, Isabel Ferreira, Rodrigo Martins, Elvira Fortunato, Luis Gomes and Josep Tornero analyzed the data; Josep Tornero, Rodrigo Martins, Elvira Fortunato, Isabel Ferreira and Luis Gomes contributed with support/infrastructures/reagents/materials/analysis tools/know-how; Javier Contreras wrote the paper.

Conflicts of Interest

The authors declare no conflict of interest.

References

  1. Raja, V.; Fernandes, K.J. Reverse Engineering—An Industrial Perspective; Springer: Berlin, Germany, 2008. [Google Scholar]
  2. Johannesson, M. Can sorting using sheet-of-light range imaging and MAPP2200. In Proceedings of the International Conference on Systems, Man and Cybernetics, “Systems Engineering in the Service of Humans”, Iowa, IA, USA, 17–20 October 1993; pp. 325–330.
  3. Araki, K.; Shimizu, M.; Noda, T.; Chiba, Y.; Tsuda, Y.; Ikegaya, K.; Sannomiya, K.; Gomi, M. High speed and continuous 3-D measurement system. Mach. Vis. Appl. 1995, 8, 79–84. [Google Scholar] [CrossRef]
  4. De Bakker, M.; Verbeek, P.W.; vanden Ouden, F.; Steenvoorden, G.K. High-speed acquisition of range images. In Proceedings of the 13th International Conference on Pattern Recognition, Vienna, Austria, 25–29 August 1996; pp. 293–297.
  5. Martins, R.; Costa, D.; Aguas, H.; Soares, F.; Marques, A.; Ferreira, I.; Borges, P.; Pereira, S.; Raniero, L.; Fortunato, E. Insights on amorphous silicon nip and MIS 3D position sensitive detectors. Mater. Sci. Forum. 2006, 514, 13–17. [Google Scholar] [CrossRef]
  6. Martins, R.; Fortunato, E.; Figueiredo, J.; Soares, F.; Brida, D.; Silva, V.; Cabrita, A. 32 Linear array position sensitive detector based on NIP and hetero a-Si:H microdevices. J. Non Cryst. Solids 2002, 299, 1283–1288. [Google Scholar] [CrossRef]
  7. Contreras, J.; Ferreira, I.; Idzikowski, M.; Filonovich, S.; Pereira, S.; Fortunato, E.; Martins, R. Amorphous silicon position sensitive detector array for fast 3D object profiling. IEEE Sens. J. 2012, 12, 812–820. [Google Scholar] [CrossRef]
  8. Contreras, J.; Gomes, L.; Filonovich, S.; Correia, N.; Fortunato, E.; Martins, R.; Ferreira, I. 3D scanning characteristics of an amorphous silicon position sensitive detector array system. Opt. Exp. 2012, 20, 4583–4602. [Google Scholar] [CrossRef] [PubMed]
  9. AT-Automation Technology GmbH, Bad Oldesloe, Germany, 23843. Available online: www.automationtechnology.de (accessed on 6 October 2015).
  10. Park, J.; DeSouza, G.N. 3D modelling of real-world objects using range and intensity images. In Innovations in Machine Intelligence and Robot Perception; Patnaik, S., Jain, L.C., Tzafestas, G., Bannore, V., Eds.; Springer-Verlag: Berlin, Germany, 2005. [Google Scholar]

Article Metrics

Citations

Article Access Statistics

Multiple requests from the same IP address are counted as one view.