Modeling of the Through-the-Thickness Electric Potentials of a Piezoelectric Bimorph Using the Spectral Element Method
Dong, X.; Peng, Z.; Hua, H.; Meng, G. Modeling of the Through-the-Thickness Electric Potentials of a Piezoelectric Bimorph Using the Spectral Element Method. Sensors 2014, 14, 3477-3492. https://doi.org/10.3390/s140203477
Dong X, Peng Z, Hua H, Meng G. Modeling of the Through-the-Thickness Electric Potentials of a Piezoelectric Bimorph Using the Spectral Element Method. Sensors. 2014; 14(2):3477-3492. https://doi.org/10.3390/s140203477
Chicago/Turabian StyleDong, Xingjian, Zhike Peng, Hongxing Hua, and Guang Meng. 2014. "Modeling of the Through-the-Thickness Electric Potentials of a Piezoelectric Bimorph Using the Spectral Element Method" Sensors 14, no. 2: 3477-3492. https://doi.org/10.3390/s140203477