Search Results (460)

Thermal management is an area of study in electronics focused on managing temperature to improve reliability and efficiency. When temperatures are too high, cooling systems are activated to prevent overheating, which can lead to reliability issues. To monitor the temperatures, sensors are often placed on-chip near hotspot locations. These sensors should be very small to allow them to be placed among compact, high-activity circuits. Often, they are connected to a central control circuit located far away from the hot spot locations where more area is available. This paper proposes sensing units for a novel temperature sensing architecture in the TSMC 180 nm process. This architecture functions by approximating the current through the sensing unit at a reference voltage, which is used to approximate the temperature in the digital back end using fitting functions. Sensing units are selected based on how well its temperature–current relationship can be modeled, sensing unit area, and power consumption. Many sensing units will be experimented with at different reference voltages. These temperature–current curves will be modeled with various fitting functions. The sensing unit selected is a diode-connected p-type MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with a size of W = 400 nm, L = 180 nm. This sensing unit is exceptionally small compared to existing work because it does not rely on multiple devices at the sensing unit location to generate a PTAT or IPTAT signal like most work in this area. The temperature–current relationship of this device can also be modeled using a 2nd order polynomial, requiring a minimal number of trim temperatures. Its temperature error is small, and the power consumption is low. The range of currents for this sensing unit could be reasonably made on an IDAC. Full article

Modern aircraft increasingly utilizes highly integrated electronic equipment, driving continuously increasing heat dissipation demands. Vapor compression refrigeration systems demonstrate stronger alignment with future aircraft thermal management trends, leveraging their superior volumetric cooling capacity, high energy efficiency, and independence from engine bleed air. This paper reviews global research progress on aircraft vapor compression refrigeration systems, covering performance optimization, dynamic characteristics, control strategies, fault detection, and international development histories and typical applications. Analysis identifies emerging challenges under large-temperature-range cooling requirements, with comparative assessment establishing zeotropic mixture auto-cascade vapor compression refrigeration systems as the optimal forward-looking solution. Finally, recognizing current research gaps, we propose future research directions for onboard auto-cascade vapor compression refrigeration systems: optimizing refrigerant mixtures for flight conditions, achieving efficient gas-liquid separation during variable overloads and attitude conditions, and developing model predictive control with intelligent optimization to ensure reliability. Full article

Microelectromechanical system (MEMS) devices are specialized electronic devices that integrate the benefits of both mechanical and electrical structures. However, the contact behavior between the interfaces of these structures can significantly impact the performance of MEMS devices, particularly when the surface roughness approaches the characteristic size of the devices. In such cases, the contact between the interfaces is not a perfect face-to-face interaction but occurs through point-to-point contact. As a result, the contact area changes with varying contact pressures and surface roughness, influencing the thermal and electrical performance. By integrating the CMY model with finite element simulations, we systematically explored the thermal conductance regulation mechanism of MEMS contact switches. We analyzed the effects of the contact pressure, micro-hardness, surface roughness, and other parameters on thermal conductance, providing essential theoretical support for enhancing reliability and optimizing thermal management in MEMS contact switches. We examined the thermal contact, gap, and joint conductance of an MEMS switch under different contact pressures, micro-hardness values, and surface roughness levels using the CMY model. Our findings show that both the thermal contact and gap conductance increase with higher contact pressure. For a fixed contact pressure, the thermal contact conductance decreases with rising micro-hardness and root mean square (RMS) surface roughness but increases with a higher mean asperity slope. Notably, the thermal gap conductance is considerably lower than the thermal contact conductance. Full article

The transition to electric mobility has significantly increased the demand for lithium-ion batteries, raising concerns about their end-of-life management. Therefore, this study presents the design, development and first implementation steps of a stationary energy storage system utilizing second-life electric vehicle (EV) batteries. These batteries, no longer suitable for traction applications due to a reduced state of health (SoH) below 80%, retain sufficient capacity for less demanding stationary applications. The proposed system is designed to be flexible and scalable, serving both research and commercial purposes. Key challenges include heterogeneous battery characteristics, safety considerations due to increased internal resistance and battery aging, and the need for flexible power electronics. An optimized dual active bridge (DAB) converter topology is introduced to connect several batteries in parallel and to ensure efficient bidirectional power flow over a wide voltage range. A first prototype, rated at 50 $\mathrm{k}$$\mathrm{W}$, has been built and tested in the laboratory. This study contributes to sustainable energy storage solutions by extending battery life cycles, reducing waste, and promoting economic viability for industrial partners. Full article

Polyimide, a class of high-performance polymers, is renowned for its exceptional thermal stability, mechanical strength, and chemical resistance. However, in the context of high-integration and high-frequency electronic packaging, polyimides face critical challenges including relatively high dielectric constants, inadequate thermal conductivity, and mechanical brittleness. Recent advances have focused on molecular design and composite engineering strategies to address these limitations. This review first summarizes the intrinsic properties of polyimides, followed by a systematic discussion of chemical synthesis, surface modification approaches, molecular design principles, and composite fabrication methods. We comprehensively examine both conventional polymerization synthetic routes and emerging techniques such as microwave-assisted thermal imidization and chemical vapor deposition. Special emphasis is placed on porous structure engineering via solid-template and liquid-template methods. Three key modification strategies are highlighted: (1) surface modifications for enhanced hydrophobicity, chemical stability, and tribological properties; (2) molecular design for optimized dielectric performance and thermal stability; and (3) composite engineering for developing high-thermal-conductivity materials with improved mechanical strength and electromagnetic interference (EMI) shielding capabilities. The dielectric constant of polyimide is reduced while chemical stability and wear resistance can be enhanced through the introduction of fluorine groups. Ultra-low dielectric constant and high-temperature resistance can be achieved by employing rigid monomers and porous structures. Furthermore, the incorporation of fillers such as graphene and boron nitride can endow the composite materials with high thermal conductivity, excellent EMI shielding efficiency, and improved mechanical properties. Finally, we discuss representative applications of polyimide and composites in electronic device packaging, EMI shielding, and thermal management systems, providing insights into future development directions. Full article

Thermal camouflage technologies manipulate heat fluxes to conceal objects from thermographic detection, offering potential solutions for thermal management in high-power-density electronics. Most reported approaches are aimed at scenarios where the target is not a heat source; however, any target with a non-zero temperature emits thermal radiation described by the Stefan–Boltzmann law since the thermal radiation of an object is proportional to the fourth power of its temperature (T⁴). To address this issue, this study proposes a thermal camouflage device that considers the influence of radiative thermal transfer from the target. The underlying principle involves maintaining synchronous heat transfer separately along both the device and background surfaces. Numerical simulation confirms the feasibility of this proposed thermal camouflage strategy. Moreover, by altering some parameters related to the target such as geometry, location, temperature, and surface emissivity, excellent performance can be achieved using this device. This work advances thermal management strategies for high-power electronics and infrared-sensitive systems, with applications in infrared stealth, thermal diagnostics, and energy-efficient heat dissipation. Full article

Incremental energy demand, environmental constraints, restrictions in the availability of energy resources, economic conditions, and political impact prompt the power sector toward deregulation. In addition to these impediments, electric power competition for power quality, reliability, availability, and cost forces utilities to maximize utilization of the existing infrastructure by flowing power on transmission lines near to their thermal limits. All these factors introduce problems related to power network stability, reliability, quality, congestion management, and security in restructured power systems. To overcome these problems, power-electronics-based FACTS devices are one of the beneficial solutions at present. In this review paper, the significant role of FACTS devices in restructured power networks and their technical benefits against various power system problems such as load frequency control, voltage stability, and congestion management will be presented. In addition, an extensive discussion about the comparison between different FACTS devices (series, shunt, and their combination) and comparison between various optimization techniques (classical, analytical, hybrid, and meta-heuristics) that support FACTS devices to achieve their respective benefits is presented in this paper. Generally, it is concluded that third-generation FACTS controllers are more popular to mitigate various power system problems (i.e., load frequency control, voltage stability, and congestion management). Moreover, a combination of multiple FACTS devices, with or without energy storage devices, is more beneficial compared to their individual usage. However, this is not commonly adopted in small power systems due to high installation or maintenance costs. Therefore, there is a trade-off between the selection and cost of FACTS devices to minimize the power system problems. Likewise, meta-heuristics and hybrid optimization techniques are commonly adopted to optimize FACTS devices due to their fast convergence, robustness, higher accuracy, and flexibility. Full article

Diamond is an attractive substrate candidate for GaN high-electron-mobility transistors (HEMT) to enhance heat dissipation due to its exceptional thermal conductivity. However, the thermal boundary resistance (TBR) at the GaN–diamond interface poses a significant bottleneck to heat transport, exacerbating self-heating and limiting device performance. In this work, TCAD simulations were employed to systematically investigate the effects of thermal boundary layer (TBL) thickness (d_TBL) and thermal conductivity (κ_TBL) on the electrothermal behavior of GaN-on-diamond HEMTs. Results show that increasing the TBL thickness (5–20 nm) or decreasing its thermal conductivity (0.1–1.0 W/(m·K)) leads to elevated hotspot temperatures and degraded electron mobility, resulting in a notable deterioration of I–V characteristics. The nonlinear dependence of device performance on κ_TBL is attributed to Fourier’s law, where heat flux is inversely proportional to thermal resistance. Furthermore, the co-analysis of substrate thermal conductivity and interfacial quality reveals that interface TBR has a more dominant impact on device behavior than substrate conductivity. Remarkably, devices with low thermal conductivity substrates and optimized interfaces can outperform those with high-conductivity substrates but poor interfacial conditions. These findings underscore the critical importance of interface engineering in thermal management of GaN–diamond HEMTs and provide a theoretical foundation for future work on phonon transport and defect-controlled thermal interfaces. Full article

This study investigates the performance of lattice-structured heat sinks based on BCCz unit cells in comparison to conventional straight-fin and pin-fin designs. Various lattice configurations were explored. Numerical simulations and experimental evaluations were carried out to analyze thermal resistance, pressure drop, and temperature distribution under different operating conditions. Among the designs, the BCCz configuration with a circular cross-section was identified as the most promising candidate for integration into the final heat sink demonstrator, offering reliable and consistent performance. A prototype using the BCCz lattice structure was additively manufactured, alongside a conventional design for comparison. The results highlight the superior heat dissipation capabilities of lattice structures, achieving up to a 100% improvement in thermal performance at high flow rates and up to 300% at low flow rates compared to a conventional straight-fin heat sink. However, the pressure drop generated by the lattice structures remains a challenge that must be addressed. This work underscores the potential of optimized lattice-based heat exchangers to meet the severe thermal management requirements of railway power electronics. Full article

The escalating heat flux densities in high-performance electronics necessitate superior thermal management. This study enhanced pool-boiling heat transfer, a method offering high heat removal capacity, by leveraging Binder Jetting 3D Printing (BJ3DP) to create complex porous copper structures without the need for chemical treatments. This approach enables a reliable utilization of phenomena like capillarity for improved performance. Three types of porous copper structures, namely Large Lattice, Small Lattice, and Staggered, were fabricated on pure copper substrates and tested via pool boiling of de-ionized and de-gassed water at atmospheric pressure. Compared to a plain polished copper surface, which exhibited a critical heat flux (CHF) of 782 kW/m² at a wall superheat of 18 K, the 3D-printed porous copper surfaces showed significantly improved heat transfer performance. The Staggered surface achieved a conventional CHF of 2342.4 kW/m² (a 199.7% enhancement) at a wall superheat of 24.6 K. Notably, the Large Lattice and Small Lattice structures demonstrated exceptionally stable boiling without reaching the typical catastrophic CHF within the experimental parameters. These geometries continued to increase in heat flux, reaching maximums of 2397.7 kW/m² (206.8% higher at a wall superheat of 55.6 K) and 2577.2 kW/m² (229.7% higher at a wall superheat of 39.5 K), respectively. Subsequently, a gradual decline in heat flux was observed with an increasing wall superheat, demonstrating an outstanding resistance to the boiling crisis. These improvements are attributed to the formation of distinct vapor–liquid pathways within the porous structures, which promotes the efficient rewetting of the heated surface through capillary action. This mechanism supports a highly efficient, self-sustaining boiling configuration, emphasizing the superior rewetting and vapor management capabilities of these 3D-printed porous structures, which extend the boundaries of sustained high heat flux performance. The porous surfaces also demonstrated a higher heat transfer coefficient (HTC), particularly at lower heat fluxes (≤750 kW/m²). High-speed digital camera visualization provided further insight into the boiling phenomenon. Overall, the findings demonstrate that these BJ3DP structured surfaces produce optimized vapor–liquid pathways and capillary-enhanced rewetting, offering significantly superior heat transfer performance compared to smooth surfaces and highlighting their potential for advanced thermal management. Full article

Thermal management reveals an increasing importance due to the changing demands in terms of the compactness and the performance of electronic devise. Polymers in general and thermosets specifically depict a low thermal conductivity, where filler systems are needed to improve performance and make polymers suitable for certain applications. So far, different influencing factors in terms of improving the thermal conductivity in thermosets, mainly through the use of single-filler systems, have been investigated in. To some extent, hybrid filler systems have been examined as well; however, the behavior itself in terms of the thermal conductivity as well as the mechanical properties is rather unknown. In terms of the applications, it is essential to understand the correlation between the thermal conductivity and the mechanical properties as this is the fundamental requirement to realize a proper dimensioning of samples in applications. Therefore, this paper investigates hybrid filler systems based on boron nitride (BN) and three different second fillers with varying ratios and in terms of both the improvement of the thermal conductivity and the mechanical properties. Copper (Cu) was shown to reach the best compromise within the hybrid materials. Furthermore, criteria of an improved thermal flow path and sufficient mechanical properties have been stated in general. Full article

Thermally conductive polymer composites are essential for effective heat dissipation in electronic packaging, where both thermal management and mechanical reliability are critical. Although diglycidyl ether of bisphenol-A (DGEBA)-based epoxies exhibit favorable properties, their intrinsically low thermal conductivity limits broader applications. Incorporating conductive fillers, such as expanded graphite (EG) and metal powders, enhances heat transport but often compromises mechanical strength due to poor filler–matrix compatibility. In this study, we address this trade-off by employing a titanate coupling agent to surface-modify aluminum (Al) fillers, thereby improving interfacial adhesion and dispersion within the DGEBA matrix. Our results show that incorporating 10 wt% untreated Al increases thermal conductivity from 7.35 to 9.60 W/m·K; however, this gain comes at the cost of flexural strength, which drops to 18.29 MPa. In contrast, titanate-modified Al (Ti@Al) not only preserves high thermal conductivity but also restores mechanical performance, achieving a flexural strength of 35.31 MPa (at 5 wt% Ti@Al) and increasing impact strength from 0.60 to 1.01 kJ/m². These findings demonstrate that interfacial engineering via titanate coupling offers a compelling strategy to overcome the thermal–mechanical trade-off in hybrid composites, enabling the development of high-performance materials for advanced thermal interface and structural applications. Full article

Fiber–aerogel composites have gained significant attention as high-performance thermal insulation materials due to their unique microstructure, which suppresses conductive, convective, and radiative heat transfer. At room temperature, silica aerogels in particular exhibit ultralow thermal conductivity (<0.02 W/m·K), which is two to three times lower than that of still air (0.026 W/m·K). Their brittle skeleton and high infrared transparency, however, restrict how well they insulate, particularly at high temperatures (>300 °C). Incorporating microscale fibers into the aerogel matrix enhances mechanical strength and reduces radiative heat transfer by increasing scattering and absorption. For instance, it has been demonstrated that adding glass fibers reduces radiative heat transmission by around 40% because of increased infrared scattering. This review explores the fundamental mechanisms governing radiative heat transfer in fiber–aerogel composites, emphasizing absorption, scattering, and extinction coefficients. We discuss recent advancements in fiber-reinforced aerogels, focusing on material selection, structural modifications, and predictive heat transfer models. Recent studies indicate that incorporating fiber volume fractions as low as 10% can reduce the thermal conductivity of composites by up to 30%, without compromising their mechanical integrity. Key analytical and experimental methods for determining radiative properties, including Fourier transform infrared (FTIR) spectroscopy and numerical modeling approaches, are examined. The emissivity and transmittance of fiber–aerogel composites have been successfully measured using FTIR spectroscopy; tests show that fiber reinforcement at high temperatures reduces emissivity by about 15%. We conclude by outlining the present issues and potential avenues for future research to optimize fiber–aerogel composites for high-temperature applications, including energy-efficient buildings (where long-term thermal stability is necessary), electronics thermal management systems, and aerospace (where temperatures may surpass 1000 °C), with a focus on improving the materials’ affordability and scalability for industrial applications. Full article

With the rapid development of wearable electronics, traditional rigid thermal management materials face limitations in flexibility, conformability, and multi-physics adaptability. Low-dimensional carbon materials such as graphene and carbon nanotubes combine ultrahigh thermal conductivity with outstanding mechanical compliance, making them promising building blocks for flexible thermal regulation. This review summarizes recent advances in integrating these materials into textile architectures, mapping the evolution of this emerging field. Key topics include phonon-dominated heat transfer mechanisms, strategies for modulating interfacial thermal resistance, and dimensional effects across scales; beyond these intrinsic factors, hierarchical textile configurations further tailor macroscopic performance. We highlight how one-dimensional fiber bundles, two-dimensional woven fabrics, and three-dimensional porous networks construct multi-directional thermal pathways while enhancing porosity and stress tolerance. As for practical applications, the performance of carbon-based textiles in wearable systems, flexible electronic packaging, and thermal coatings is also critically assessed. Current obstacles—namely limited manufacturing scalability, interfacial mismatches, and thermal performance degradation under repeated deformation—are analyzed. To overcome these challenges, future studies should prioritize the co-design of structural and thermo-mechanical properties, the integration of multiple functionalities, and optimization guided by data-driven approaches. This review thus lays a solid foundation for advancing carbon-based smart textiles toward next-generation flexible thermal management technologies. Full article

Rhizopus stolonifer causes soft rot disease in strawberry and is considered one of the most destructive pathogens affecting strawberries worldwide. This study investigated the efficacy of three atmospheric non-thermal plasmas (NTPs) consisting of gliding arc (GA), Tesla coil (TC) and dielectric barrier discharge (DBD) for controlling R. stolonifer infection. Fungal mycelial discs were exposed to these plasmas for 10, 15 or 20 min, whereas conidial suspensions were treated for 1, 3, 5 or 7 min. Morphological alterations following non-thermal plasma exposure were studied using scanning electron microscopy (SEM). Exposure to GA and DBD plasmas for 20 min completely inhibited mycelial growth. SEM analysis revealed significant structural damage to the mycelium, sporangia and sporangiospores of treated samples compared to untreated controls. Complete inhibition of sporangiospore germination was achieved with treatments for at least 3 min for all NTPs. Pathogenicity assays on strawberry fruit showed that 15 min exposure to any of the tested NTPs completely prevented the development of soft rot disease. Importantly, NTP treatments did not adversely affect the external or internal characteristics of treated strawberries. These findings suggest that atmospheric non-thermal plasmas offer an effective approach for controlling R. stolonifer infection in strawberries, potentially providing a non-chemical alternative for post-harvest disease management. Full article