Low-Dimensional Materials: Thermal Characterization, Thermal Devices, and Thermal Management

Dear Colleagues,

The rapid advancement in electronics, optoelectronics, and energy-storage technologies has spurred an unprecedented demand for efficient thermal management solutions. As devices become increasingly compact and powerful, traditional bulk materials often fall short in effectively dissipating heat, leading to thermal bottlenecks that compromise performance and reliability. Low-dimensional materials, including 1D, 2D, and quasi-2D materials, have emerged as promising candidates with which to address these challenges due to their exceptional thermal properties. These materials exhibit unique thermal conductivities, anisotropic heat transfer characteristics, and interfacial transport behaviors, making them suitable for next-generation thermal management applications. This Special Issue aims to provide a comprehensive overview of the latest advancements in thermal issues in low-dimensional materials, including thermal characterization, thermal devices, and thermal management applications. It seeks to bring together cutting-edge research that advances both fundamental understanding and practical applications of these materials in various thermal devices as well as thermal management scenarios. The scope of the Special Issue encompasses a wide range of topics, including, but not limited to,

• Theoretical and experimental studies on the thermal properties of 1D and 2D materials;
• Advances in the synthesis of low-dimensional materials with tuned thermal properties;
• Interface engineering in low-dimensional material heterostructures to optimize heat dissipation;
• Novel applications of low-dimensional materials in thermal interface materials (TIMs), heat spreaders, and thermoelectric devices;
• Multiscale modeling and simulation approaches to predict thermal behavior in low-dimensional systems;
• Integration strategies of low-dimensional materials in electronics, optoelectronics, and energy devices for improved thermal management.

We are soliciting high-quality original research papers, comprehensive review articles, and perspective pieces that provide deep insights into these areas. We particularly encourage interdisciplinary submissions that bridge material science, physics, engineering, and applied mathematics, pushing the frontiers of thermal devices as well as thermal management technologies and paving the way for future innovations.

Prof. Dr. Xiangjun Liu
Prof. Dr. Yunshan Zhao
Dr. Yucheng Xiong
Guest Editors

Manuscript Submission Information

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