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Enhanced Pool Boiling via Binder-Jetting 3D-Printed Porous Copper Structures: CHF and HTC Investigation
by
Lilian Aketch Okwiri
Lilian Aketch Okwiri 1
,
Takeshi Mochizuki
Takeshi Mochizuki
Takeshi Mochizuki is a doctoral student at The University of Electro-Communications in Tokyo, Japan, [...]
Takeshi Mochizuki is a doctoral student at The University of Electro-Communications in Tokyo, Japan, conducting his research under the supervision of Professor Koji Enoki. He focuses on the characteristics of vapor–liquid two-phase flow in mini-channels, particularly those with complex or specialized structures such as wavy geometries. He aims to clarify heat transfer mechanisms by integrating methods from both thermal engineering and informatics.
2,
Kairi Koito
Kairi Koito 2,
Noriaki Fukui
Noriaki Fukui 2 and
Koji Enoki
Koji Enoki
Koji Enoki is an
Associate Professor at The University of Electro-Communications, Tokyo, Japan.
He [...]
Koji Enoki is an
Associate Professor at The University of Electro-Communications, Tokyo, Japan.
He received his Ph.D. from Kyushu University in 2013. His research interests
include high-performance phase-change heat transfer technologies,
thermal-hydraulic phenomena in porous materials, and heat and mass transfer
processes involving exothermic/endothermic reactions. He has co-authored more
than 140 refereed journal and conference publications and contributed to a
number of books. Furthermore, he holds 15 or more domestic and international
patents, with additional applications pending. His research efforts have been
recognized with Outstanding Contribution in Reviewing Awards from several top
journals in the thermal engineering field published by Elsevier, the JASRAE
Science Award, and other notable awards.
1,2,*
1
Joint Doctoral Program for Sustainability Research, The University of Electro-Communications, Tokyo 182-8585, Japan
2
Department of Mechanical and Intelligent Systems Engineering, The University of Electro-Communications, Tokyo 182-8585, Japan
*
Author to whom correspondence should be addressed.
Appl. Sci. 2025, 15(14), 7892; https://doi.org/10.3390/app15147892 (registering DOI)
Submission received: 13 May 2025
/
Revised: 10 June 2025
/
Accepted: 7 July 2025
/
Published: 15 July 2025
Abstract
The escalating heat flux densities in high-performance electronics necessitate superior thermal management. This study enhanced pool-boiling heat transfer, a method offering high heat removal capacity, by leveraging Binder Jetting 3D Printing (BJ3DP) to create complex porous copper structures without the need for chemical treatments. This approach enables a reliable utilization of phenomena like capillarity for improved performance. Three types of porous copper structures, namely Large Lattice, Small Lattice, and Staggered, were fabricated on pure copper substrates and tested via pool boiling of de-ionized and de-gassed water at atmospheric pressure. Compared to a plain polished copper surface, which exhibited a critical heat flux (CHF) of 782 kW/m2 at a wall superheat of 18 K, the 3D-printed porous copper surfaces showed significantly improved heat transfer performance. The Staggered surface achieved a conventional CHF of 2342.4 kW/m2 (a 199.7% enhancement) at a wall superheat of 24.6 K. Notably, the Large Lattice and Small Lattice structures demonstrated exceptionally stable boiling without reaching the typical catastrophic CHF within the experimental parameters. These geometries continued to increase in heat flux, reaching maximums of 2397.7 kW/m2 (206.8% higher at a wall superheat of 55.6 K) and 2577.2 kW/m2 (229.7% higher at a wall superheat of 39.5 K), respectively. Subsequently, a gradual decline in heat flux was observed with an increasing wall superheat, demonstrating an outstanding resistance to the boiling crisis. These improvements are attributed to the formation of distinct vapor–liquid pathways within the porous structures, which promotes the efficient rewetting of the heated surface through capillary action. This mechanism supports a highly efficient, self-sustaining boiling configuration, emphasizing the superior rewetting and vapor management capabilities of these 3D-printed porous structures, which extend the boundaries of sustained high heat flux performance. The porous surfaces also demonstrated a higher heat transfer coefficient (HTC), particularly at lower heat fluxes (≤ 750 kW/m2). High-speed digital camera visualization provided further insight into the boiling phenomenon. Overall, the findings demonstrate that these BJ3DP structured surfaces produce optimized vapor–liquid pathways and capillary-enhanced rewetting, offering significantly superior heat transfer performance compared to smooth surfaces and highlighting their potential for advanced thermal management.
Share and Cite
MDPI and ACS Style
Okwiri, L.A.; Mochizuki, T.; Koito, K.; Fukui, N.; Enoki, K.
Enhanced Pool Boiling via Binder-Jetting 3D-Printed Porous Copper Structures: CHF and HTC Investigation. Appl. Sci. 2025, 15, 7892.
https://doi.org/10.3390/app15147892
AMA Style
Okwiri LA, Mochizuki T, Koito K, Fukui N, Enoki K.
Enhanced Pool Boiling via Binder-Jetting 3D-Printed Porous Copper Structures: CHF and HTC Investigation. Applied Sciences. 2025; 15(14):7892.
https://doi.org/10.3390/app15147892
Chicago/Turabian Style
Okwiri, Lilian Aketch, Takeshi Mochizuki, Kairi Koito, Noriaki Fukui, and Koji Enoki.
2025. "Enhanced Pool Boiling via Binder-Jetting 3D-Printed Porous Copper Structures: CHF and HTC Investigation" Applied Sciences 15, no. 14: 7892.
https://doi.org/10.3390/app15147892
APA Style
Okwiri, L. A., Mochizuki, T., Koito, K., Fukui, N., & Enoki, K.
(2025). Enhanced Pool Boiling via Binder-Jetting 3D-Printed Porous Copper Structures: CHF and HTC Investigation. Applied Sciences, 15(14), 7892.
https://doi.org/10.3390/app15147892
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