Search Results (776)

Silver-coated copper (Cu@Ag) core–shell nanoparticles are promising interconnect materials for electronic packaging due to their high conductivity, oxidation resistance, and reduced use of precious metals. However, the key factors governing their sintering behavior and mechanical performance are not fully understood. In this study, molecular dynamics simulations were performed to examine the effects of sintering pressure (300–700 MPa), temperature (500–700 K), particle size, and silver shell thickness on atomic diffusion, microstructural evolution, and mechanical properties. Results show that higher pressure improves particle contact, accelerates densification, and strengthens interfacial bonding, with optimal performance achieved at 600–700 MPa. Elevated temperatures enhance atomic mobility, promoting neck growth and pore elimination, with the most active diffusion observed between 650 K and 700 K. Particle size and shell thickness also affect sintering: the Ag6Cu3 configuration exhibits the highest atomic mobility and a balanced combination of strength and ductility. Moderately thick silver shells facilitate surface diffusion and interfacial interdiffusion, while mechanisms such as the Kirkendall effect and local plastic relaxation reduce defect density, yielding stable sintered structures. These findings provide atomic-scale insights into the sintering mechanisms of Cu@Ag nanoparticle solder pastes and offer guidance for optimizing processing parameters in high-performance electronic packaging applications. Full article

This article presents a novel compact high-Q bandpass filter (BPF) utilizing a 3-D stacked stripline configuration. T-shaped stepped impedance resonators (SIRs) are employed to achieve miniaturization. By folding the filter geometry from an inline arrangement into a U-shape along the broadside direction, both broadside and edge coupling structures are realized, enabling various cross-coupling schemes for flexible placement of transmission zeros (TZs). A comprehensive analysis of both electric and magnetic coupling structures is conducted to support the overall filter design. To validate the concept, a tenth-order general Chebyshev BPF prototype centered at 3.485 GHz with a 1 dB bandwidth of 380 MHz is designed, fabricated, and measured. The filter is constructed by vertically soldering two patterned sheet metal layers together with three stacked cavities. Despite having an electrical size of only 0.58 × 0.23 × 0.19 λ_g³, the filter exhibits a high unloaded Q-factor (Q_u) of 1200, along with up to six TZs and a spurious-free frequency range extending to 12 GHz. Measured results show an insertion loss of 0.58 dB at the center frequency and a return loss of better than 20 dB within the passband, demonstrating favorable agreement with simulations. Featuring solid electrical performance, the proposed filter is ideally suited for 5G and 5G-Advanced (5G-A) communication base stations. Full article

This study investigates the effects of three group IV two-dimensional (2D) materials (graphene, silicene, and germanene) on the sintering process and tensile properties of copper nanoparticle pastes for electronic packaging. Using atomic-scale simulations, we constructed models of pure copper and composite pastes, tracking particle rearrangement, neck formation, and pore closure under identical sintering conditions, followed by uniaxial tensile testing. All composites formed continuous copper networks, with densification rates increasing in the order: graphene < silicene < germanene. The yield strength of the pure copper paste was 2.41 GPa and increased to 2.96, 4.39, and 5.46 GPa with graphene, silicene, and germanene, respectively, corresponding to gains of about 23%, 82%, and 127% relative to pure copper. Increasing the sintering temperature led to a monotonic increase in the tensile strength of the germanene composite, with the highest value being obtained at 650 K. Dislocation and stress field analyses revealed that silicene and germanene strengthen the material by promoting pronounced plastic accommodation in neck regions, whereas graphene mainly redistributes strain along the interfaces and produces a more moderate increase in strength. These findings demonstrate that the strength and deformation mode of copper nano-solder joints can be effectively tuned by selecting the type of 2D filler and optimizing the sintering temperature. Full article

A ceramic-packaged, dual-layer-stacked System-in-Package (SiP) architecture combines the hermeticity of ceramic substrates with the superior radio frequency (RF) performance of organic substrates to meet the demands for high-density integration, cost-effectiveness, and high performance. This study investigates the issues of thermal mismatch, solder joint contamination, and void formation during the large-area eutectic bonding of the lower organic substrate using Pb70In30 solder through simulation and an experimental approach. The results indicate that: (a) the post-bonding warpage of the organic substrate can be reduced to under 80 µm by optimizing its copper layer thickness, dielectric layer thickness, and cavity/slot distribution, and (b) flux pretreatment can be employed to reduce the Pb70In30 solder in an N₂/H₂ mixture at a eutectic temperature of 285 °C and a pressure of 1.5 kPa effectively promotes solder spreading, prevents solder joint contamination, and yields a void formation percentage below 10%, a shear strength of 23.66 MPa, and solder overflow exceeding 90%, thereby satisfying the requirements for reliable large-area eutectic bonding. These findings offer guidance for the packaging process design of ceramic-packaged, dual-layer-stacked SiPs. Full article

This study investigates the occurrence, sources, and health risks of PTEs in residential vacuum dusts from the city of Thessaloniki, Greece. A total of 20 dust samples were collected and analyzed for their chemical, mineralogical, and morphological characteristics using pXRF, XRD, and SEM-EDS techniques. The results revealed elevated concentrations of Zn (623 mg kg⁻¹), Mn (392 mg kg⁻¹), Cu (204 mg kg⁻¹), and Cr (185 mg kg⁻¹) exceeding crustal averages and global urban soil baselines. Notably, Cr and Mn levels were among the highest recorded for non-industrial urban settings. Source apportionment identified distinct geogenic and anthropogenic contributors, including construction materials, outdoor soil resuspension, and indoor alloy-related sources such as stainless steel and soldering components. Health risk assessment based on USEPA models showed ingestion as the dominant exposure route, particularly for children. Chromium and As were identified as the main non-carcinogenic and carcinogenic contributors, with children’s hazard index (HI) values exceeding safety thresholds (HI = 1.04) in some cases. The cancer risk (CR) for Cr ranged from 2.49 × 10⁻⁵ to 6.55 × 10^−5, not exceeding the acceptable limit (10⁻⁴). The findings highlight the multifaceted nature of indoor dust contamination in urban environments and underscore the need for continued monitoring and targeted mitigation to protect vulnerable populations. Full article

This study examines the design, manufacturing, and testing of planar PCB inductors (spiral and toroid), including multilayer PCB toroid configurations. These inductors are intended for environments with strong magnetic fields, such as high-energy physics experiments and medical applications, where traditional inductors with ferromagnetic cores are unsuitable. Twelve inductor samples were manufactured and tested. The focus was on maximizing inductance and evaluating performance in a high-frequency DC-DC step-down converter. Key parameters measured included inductance, resistance, thermal performance, electromagnetic interference (EMI), and frequency-dependent behavior in multilayer PCB implementations. The results showed that planar spiral inductors handled higher currents and achieved better efficiency, reaching up to 74.86%. Planar toroid inductors were more tolerant of added shielding, maintaining their inductance, while multilayer toroid designs exhibited reduced DC resistance but increased frequency dependence and sensitivity to parasitic effects. Overall, planar inductors were found to be viable for applications where ferromagnetic cores are unsuitable. Further optimization of geometry, layer configuration, and manufacturing processes could enhance their performance. Full article

Ensuring the reliability of solder joints is essential for stable operation in electric vehicle chargers, particularly for components assembled using surface-mount technology. Therefore, we developed a defect inspection system for welding joint defects using a Faster Region-based Convolutional Neural Network model to classify results as insufficient defect, shifting defect, and normal (pin-qualified) on voltage control IC pins. The model was trained on 72,000 pin samples and achieved a training accuracy of 99.93%. Evaluation of 65,700 pin samples resulted in an accuracy of 98.89%. The experimental results demonstrate that the system provides stable recognition of reflective solder joints, reliably identifies critical pin-level defects, and is suitable for deployment in practical inspection environments. Full article

Microstructural and morphological effects of cobalt (Co), nickel (Ni), and cerium (Ce) microalloying on the SAC305 lead-free solder alloy were investigated, with emphasis on the solidification behavior under slow cooling conditions. Although the individual effects of these elements have been previously reported, their combined influence remains scarcely addressed. Thermal behavior, elemental composition, and surface integrity of the solder joints were analyzed. The addition of Co, Ni, and Ce resulted in a significant shift of the onset temperature during cooling, indicating reduced undercooling. Microalloying led to a transformation of the intermetallic layer (IML) morphology from scalloped to planar, and a 60% reduction in the number of shrinkage voids. The average β-Sn grain size decreased by 37.5%, while the eutectic area increased from 32% to 38%. The substitution of Cu atoms by Co and Ni within the Cu₆Sn₅ lattice formed thermodynamically stable (Cu,Co,Ni)₆Sn₅ phases. These findings demonstrate that the synergistic effect of Co, Ni, and Ce microadditives effectively refines the microstructure, suppresses undercooling, and enhances the overall reliability of SAC305 solder joints. Full article

In automated production lines for automotive chargers, solder joint inspection is critical due to the widespread adoption of automotive electronics and electric vehicles. This study establishes a You Only Look Once Version 8 (YOLOv8)-based single-pin solder joint classification model for an 8-pin automotive voltage regulator IC. Solder joints were categorized into four types: normal, misalignment, insufficient fillet, and cold joint. The model achieved a single-pin training accuracy of 0.987 (4000 samples) and a test accuracy of 0.973 (4800 samples), while overall IC-level evaluation exceeded 0.90. Normal and cold joint categories were detected with the highest reliability, whereas occasional misclassifications occurred in the insufficient fillet and misalignment categories. These results demonstrate that the proposed method is feasible for efficient and accurate detection of solder joint defects, providing a practical approach to support automated inspection and ensure consistent production quality. Full article

This work presents a finite element investigation of the thermo-mechanical response of a SiC-based power module subjected to spatially non-uniform thermal gradients during active power cycling. The multilayer package, including die, solder, and encapsulant, was modeled by elastoplastic constitutive laws to capture stress and strain evolution in time and space. Two scenarios were considered: a time–space variability with fixed gradients (an initial non-uniform temperature distribution was uniformly varied in time) and a time–space variability with time-dependent gradients (an initial non-uniform temperature was non-uniformly varied in time). Results highlight critical stress concentrations at the SiC/solder interface, with plastic strains up to 5% in the solder. This study underlines the importance of transient gradient modeling for reliability assessment and fatigue life prediction of power modules. Full article

The application of microalloying technology has significantly improved the mechanical properties, oxidation resistance, and corrosion resistance of the Sn-9Zn-xAl-series solder. The effects of Al addition on microstructural evolution and service-related performance of the solders were systematically investigated using a combination of characterization techniques, including scanning electron microscopy/energy-dispersive X-ray spectroscopy (SEM/EDX), differential scanning calorimetry (DSC), tensile testing, spreading testing, thermogravimetry (TG), and potentiodynamic polarization measurements. Microstructural characterization reveals that an optimal content of Al reacts with the Sn-Zn matrix to form AlZnSn intermetallic compounds (IMCs), which effectively refines the Zn-rich precipitates and eutectic lamellar structure. Concomitantly, the formation of second-phase strengthening contributes to a significant enhancement in the tensile strength of the solder alloys. Specifically, the Sn-9Zn-0.8Al solder exhibits a tensile strength of 87 MPa, corresponding to a 37% increment compared to the base Sn-9Zn alloy, whereas the elongation is reduced to 14.1%. Moreover, the in situ-formed Al₂O₃ passive film provides effective protection for the solder matrix, inhibiting oxidation induced by oxygen atoms and corrosion caused by chlorine ions, thereby remarkably improving the oxidation and corrosion resistance of the alloy. Collectively, these findings demonstrate that Al microalloying can substantially enhance the strength, oxidation resistance, and corrosion resistance of Sn-9Zn solder; however, a trade-off between wettability and ductility needs to be carefully considered for practical applications. Full article

Controlling thermodynamic properties is critical for the rational design and development of advanced lead-free solders, especially in high-temperature applications. Au–Sn-based alloys have emerged as promising candidates for high-performance electronic packaging, yet reliable thermodynamic descriptions of their multicomponent systems remain limited. The Modified Molecular Interaction Volume Model (M-MIVM) provides a effective approach for characterizing strongly asymmetric liquid alloys that are typical in Au–Sn-based systems. This work focuses on the thermodynamic modeling of Au–Sn-containing ternary and quaternary solder systems within a physically consistent and computationally efficient framework. The study aims to support the database development, composition design, and optimization of next-generation high-temperature lead-free solders. Full article

Welding copper (Cu) and aluminum (Al) is highly demanded for lightweight and cost-effective manufacturing. However, it faces significant challenges. First, substantial differences in physical properties may lead to high residual stresses and distortion. Second, brittle intermetallic compounds (IMCs) readily form at the interface, severely compromising the joint’s mechanical properties and electrical conductivity. Third, the native oxide film on Al impedes effective wetting and bonding. Therefore, effective control over the interfacial microstructure of the welded joint is essential. This review provides a critical analysis and comparison of several typical welding techniques, including laser welding (LW), friction stir welding (FSW), ultrasonic welding (UW), brazing and soldering, and welding–brazing. These analyses focus on their process characteristics, joint microstructures, and corresponding formation mechanisms. Furthermore, this review synthesizes key strategies for enhancing joint quality, including process parameter optimization, introduction of functional interlayers, and external assistance, aimed at optimizing joint microstructure and minimizing defects. Based on the analysis, this work provides comparative insights into process selection and microstructure control, and highlights future directions: advancing novel methods such as magnetic pulse welding and transient liquid phase bonding; developing intelligent real-time process control to suppress brittle IMCs and associated defects; promoting sustainable practices and establishing standardized performance evaluation; and systematically investigating long-term reliability to support the industrial application of robust Cu/Al joints. Full article

Low-Temperature Co-Fired Ceramic (LTCC)-based mechanical sensors are inherently limited by the thickness and rigidity of multilayer ceramic stacks, which restrict miniaturization and mechanical compliance. To overcome these constraints, this work presents a hybrid LTCC/Kapton^® platform enabling high-sensitivity mechanical sensing through mechanically tunable RF passive components. The proposed approach integrates a flexible polyimide membrane, bonded onto an LTCC substrate at low temperatures using selectively electroplated indium pillars that simultaneously define the air gap and provide mechanical fixation. Inductance tuning is achieved via metal-shielding proximity effects, whereas capacitance tuning relies on force-controlled air-gap modulation in a metal–insulator–metal configuration. The fabrication process ensures precise gap control, high compliance, and structural robustness without requiring deformable ceramic membranes. Experimental characterization, including three-dimensional surface profiling and impedance measurements, demonstrates a 48% inductance tuning range with a sensitivity of 0.715 nH/mN and a 36% capacitance tuning range with a sensitivity of 47.3 fF/mN at 1 MHz. The proposed hybrid platform provides a compact and scalable solution for high-sensitivity sensors and mechanically reconfigurable RF components suitable for harsh-environment and adaptive electronics applications. Full article

Given the rising global demand for environmentally sustainable energy sources, solar photovoltaic (PV) power generation has emerged as a pivotal component of the energy transition. In PV systems, power conversion efficiency is degraded and operational lifespan reduced due to the presence of defective modules. Consequently, achieving accurate and efficient defect detection during PV module manufacturing is critical to ensuring product quality and reliability. To address this challenge, we propose MambaVSS-YOLOv11n, an electroluminescence (EL) image-based multi-defect detection method for PV modules. Our study utilizes a dataset containing six types of defects—Broken Gate, Cold Solder Joint, Black Spot, Scratch, Microcrack, and Suction Mark—to construct 692 labeled EL images of defective PV modules. The model integrates the Vision State Space (VSS) module from Mamba and optimizes the C3k2 Bottleneck structure to enhance fine-grained feature extraction, while employing Space-to-Depth Convolutional (SPD-Conv) Layer for downsampling to improve computational efficiency. Additionally, to address YOLOv11n’s limited generalization capability for small objects and complex backgrounds, we adopt the Inner Mask Distance Penalized Intersection over the Union (Inner-MDPIoU) loss function, which enhances detection accuracy and mitigates the impact of low-quality samples. Experimental results demonstrate that compared to YOLOv11n, MambaVSS-YOLOv11n reduces the number of parameters by 18.1%, while improving mAP@0.5 to 0.869 and mAP@0.5:0.95 to 0.637. This achieves model lightweighting while enhancing detection performance. These findings indicate that the model is well-suited for real-time defect detection in PV module production lines, providing PV manufacturers with a lightweight yet accurate and reliable solution for PV module defect inspection. Full article