Surface Modification Treatments of Metallic Materials (2nd Edition)

A special issue of Crystals (ISSN 2073-4352). This special issue belongs to the section "Crystalline Metals and Alloys".

Deadline for manuscript submissions: 22 July 2025 | Viewed by 343

Special Issue Editors

Shanxi Key Laboratory of Precision Machining, College of Mechanical and Vehicle Engineering, Taiyuan University of Technology, Taiyuan 030024, China
Interests: machining; surface strengthening processing; fatigue of materials; surface integrity
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Guest Editor
Manufacturing Laboratory, School of Engineering, The University of Tokyo, Tokyo 1138656, Japan
Interests: machining; surface integrity; vibration
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Guest Editor Assistant
State Key Laboratory of Mechanical System and Vibration, School of Mechanical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Interests: material processing; surface integrity; ultrasonic surface rolling; fatigue; microstructure; gear
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Special Issue Information

Dear Colleagues,

This new Special Issue of Crystals, Surface Modification Treatments of Metallic Materials (Second Edition), continues a previous collection (https://www.mdpi.com/journal/crystals/special_issues/4DZ269C2OB).

Crystalline metals and alloys with distinguished mechanical properties and fatigue resistance have been universally applied in critical components of the aviation industry. Fatigue failure is a common mode for aviation components owing to harsh service conditions. In general, the surface integrity of manufactured components is essential since it directly influences fatigue crack initiation and initial propagation. However, it is challenging to manufacture parts with high surface integrity due to the poor machinability of high-strength metallic materials. On the one hand, machining marks tend to become stress concentrators, which accelerates surface crack nucleation. On the other hand, machining-induced tensile residual stresses contribute to crack tip openings, which deteriorate the fatigue resistance of the parts. Therefore, the surface integrity of crystalline metals and alloys should be carefully improved by surface modification treatments, and it is essential to study distribution characteristics subjected to different surface modification treatments. To date, many surface modification treatments have emerged from both the scientific and engineering fields, and more attention has been paid to utilizing them to improve the fatigue properties of the parts.

This Special Issue of Crystals aims to provide a forum for original research works and review articles on current advances in the field of surface modification of metallic materials. Areas of interest include, but are not limited to, shot peening, deep rolling, laser shock peening, ultrasonic surface rolling, surface mechanical attrition treatment, ultrasonic impact treatment, micro-forging, mechanical machining, and applications for the surface modification of metallic materials. Submissions may investigate advanced surface modification techniques, surface integrity characterization, mechanical property evaluation, fatigue testing, simulation, and applications.

Dr. Yong Wang
Dr. Zongwei Ren
Guest Editors

Dr. Jiaqiang Dang
Guest Editor Assistant

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Keywords

  • surface modification
  • surface integrity
  • microstructure
  • residual stress
  • surface morphology
  • microhardness
  • metallic materials
  • mechanical property
  • fatigue
  • high-performance manufacturing

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Published Papers (1 paper)

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Research

14 pages, 8312 KiB  
Article
Influence of Reflow Cycles of the Pb–Free/Pb Hybrid Assembly Process on the IMCs Growth Interface of Micro-Solder Joints
by Xinyuan He, Qi Zhang, Qiming Cui, Yifan Bai, Lincheng Fu, Zicong Zhao, Chuanhang Zou and Yong Wang
Crystals 2025, 15(6), 516; https://doi.org/10.3390/cryst15060516 - 28 May 2025
Viewed by 233
Abstract
Under the dual impetus of environmental regulations and reliability requirements, the Pb–free/Pb hybrid assembly process in aerospace-grade ball grid array (BGA) components has become an unavoidable industrial imperative. However, constrained process compatibility during single or multiple reflow protocols amplifies structural heterogeneity in solder [...] Read more.
Under the dual impetus of environmental regulations and reliability requirements, the Pb–free/Pb hybrid assembly process in aerospace-grade ball grid array (BGA) components has become an unavoidable industrial imperative. However, constrained process compatibility during single or multiple reflow protocols amplifies structural heterogeneity in solder joints and accelerates dynamic microstructural evolution, thereby elevating interfacial reliability risks at solder joint interfaces. This paper systematically investigated phase composition, grain dimensions, thickness evolution, and crystallographic orientation patterns of interfacial intermetallic compounds (IMCs) in hybrid micro-solder joints under multiple reflows, employing electron backscatter diffraction (EBSD), scanning electron microscopy (SEM), and energy-dispersive X-ray spectroscopy (EDX). The result shows that the first reflow induces prismatic Cu6Sn5 grain formation driven by Pb aggregation zones and elevated Cu concentration gradients. Surface-protruding fine grains significantly increase kernel average misorientation (KAMave) of 0.68° while minimizing crystallographic orientation preference density (PFmax) of 15.5. Higher aspect ratios correlate with elongated grain morphology, consequently elevating grain size of 5.3 μm and IMC thickness of 5.0 μm. Subsequent reflows fundamentally alter material dynamics: Pb redistribution transitions from clustered to randomized spatial configurations, while grains develop pronounced in-plane orientation preferences that reciprocally influence Sn crystal alignment. The second reflow produces scallop-type grains with minimized dimensions of 4.0 μm and a thickness of 2.1 μm, with a KAMave of 0.37° and PFmax of 20.5. The third reflow initiates uniform growth of scalloped grains of 7.0 μm with a stable population density, whereas the fifth reflow triggers a semicircular grain transformation of 9.1 μm through conspicuous coalescence mechanisms. This work elucidates multiple reflow IMC growth mechanisms in Pb–free/Pb hybrid solder joints, providing critical theoretical and practical insights for optimizing hybrid technologies and reliability management strategies in high-reliability aerospace electronics. Full article
(This article belongs to the Special Issue Surface Modification Treatments of Metallic Materials (2nd Edition))
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