Microwave Components and Devices: Emerging Technologies and Applications

Dear Colleagues,

We are pleased to announce a Topic focused on "Microwave Components and Devices: Emerging Technologies and Applications". This timely topic addresses the rapid evolution and increasing sophistication of microwave technology in our interconnected world. The scope encompasses fundamental research in passive and active microwave components, novel design methodologies, advanced manufacturing techniques, and cutting-edge applications across various sectors. We welcome original research contributions in areas including, but not limited to, the following: metamaterial-based microwave devices, reconfigurable RF components, millimeter-wave and terahertz devices, integrated microwave circuits, AI-enabled component design, 5G/6G communication components, microwave sensors for IoT applications, energy-efficient amplifiers, smart antenna systems, and quantum-enabled microwave devices. Of particular interest are works that bridge the gap between theoretical innovations and practical implementations, as well as research addressing current challenges in size reduction, power efficiency, bandwidth enhancement, and system integration. Additionally, we encourage submissions exploring emerging applications in areas such as biomedical devices, automotive radar systems, satellite communications, and industrial sensing.

Potential topics include the following:

• Advanced passive components (filters, couplers, circulators);
• Novel active devices and circuits;
• Metamaterial and metasurface applications;
• RF MEMS and reconfigurable components;
• Integrated millimeter-wave and terahertz devices;
• Machine learning approaches in component design;
• Green RF technologies and energy-efficient solutions;
• Advanced packaging and interconnect solutions;
• Quantum-enhanced microwave systems;
• High-power microwave components;
• Biomedical microwave devices and sensors;
• Novel manufacturing techniques for microwave components;
• Electromagnetic modeling and simulation advances;
• System-level integration and optimization;
• Reliability and testing methodologies.

We look forward to receiving your valuable contributions to this exciting field of research.

Dr. Sensong An
Dr. Bowen Zheng
Topic Editors