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Keywords = silicon photonic integrated chip

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33 pages, 17720 KB  
Review
Photonic Integrated Circuits: Research Advances and Challenges in Interconnection and Packaging Technologies
by Wenchao Tian, Yifan Wang, Haojie Dang, Huahua Hou and Yuanyuan Xi
Photonics 2025, 12(8), 821; https://doi.org/10.3390/photonics12080821 - 18 Aug 2025
Viewed by 539
Abstract
Silicon photonics, serving as a cornerstone technology in modern information technology, demonstrates significant application potential in critical scenarios such as high-speed data center interconnects and integrated optical communication systems. Facing the persistent demand for information processing capabilities in the post-Moore era, photonic chips [...] Read more.
Silicon photonics, serving as a cornerstone technology in modern information technology, demonstrates significant application potential in critical scenarios such as high-speed data center interconnects and integrated optical communication systems. Facing the persistent demand for information processing capabilities in the post-Moore era, photonic chips have emerged as a pivotal direction for overcoming the performance bottlenecks of traditional chips, leveraging their advantages of low power consumption, high speed, and high integration density. This review focuses specifically on the optical interconnection and packaging technologies for photonic chips. It comprehensively analyzes the research frontiers and key challenges in packaging technologies, encompassing efficient fiber-to-chip coupling techniques, chip-scale optical interconnection technologies, and 2D, 2.5D, and 3D stacked co-packaged optics technologies. By synthesizing and summarizing recent research advances, this paper aims to provide researchers in related fields with a systematic understanding of photonic integrated circuit technology. Furthermore, it seeks to offer insights for future technological breakthroughs in device optimization, packaging innovation, and system-level applications of photonic integrated circuits. Full article
(This article belongs to the Special Issue Photonic Integrated Circuits: Recent Advances and Future Perspectives)
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29 pages, 10437 KB  
Review
Neuromorphic Photonic On-Chip Computing
by Sujal Gupta and Jolly Xavier
Chips 2025, 4(3), 34; https://doi.org/10.3390/chips4030034 - 7 Aug 2025
Viewed by 650
Abstract
Drawing inspiration from biological brains’ energy-efficient information-processing mechanisms, photonic integrated circuits (PICs) have facilitated the development of ultrafast artificial neural networks. This in turn is envisaged to offer potential solutions to the growing demand for artificial intelligence employing machine learning in various domains, [...] Read more.
Drawing inspiration from biological brains’ energy-efficient information-processing mechanisms, photonic integrated circuits (PICs) have facilitated the development of ultrafast artificial neural networks. This in turn is envisaged to offer potential solutions to the growing demand for artificial intelligence employing machine learning in various domains, from nonlinear optimization and telecommunication to medical diagnosis. In the meantime, silicon photonics has emerged as a mainstream technology for integrated chip-based applications. However, challenges still need to be addressed in scaling it further for broader applications due to the requirement of co-integration of electronic circuitry for control and calibration. Leveraging physics in algorithms and nanoscale materials holds promise for achieving low-power miniaturized chips capable of real-time inference and learning. Against this backdrop, we present the State of the Art in neuromorphic photonic computing, focusing primarily on architecture, weighting mechanisms, photonic neurons, and training, while giving an overall view of recent advancements, challenges, and prospects. We also emphasize and highlight the need for revolutionary hardware innovations to scale up neuromorphic systems while enhancing energy efficiency and performance. Full article
(This article belongs to the Special Issue Silicon Photonic Integrated Circuits: Advancements and Challenges)
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16 pages, 2036 KB  
Article
Scalable Chemical Vapor Deposition of Silicon Carbide Thin Films for Photonic Integrated Circuit Applications
by Souryaya Dutta, Alex Kaloyeros, Animesh Nanaware and Spyros Gallis
Appl. Sci. 2025, 15(15), 8603; https://doi.org/10.3390/app15158603 - 2 Aug 2025
Viewed by 557
Abstract
Highly integrable silicon carbide (SiC) has emerged as a promising platform for photonic integrated circuits (PICs), offering a comprehensive set of material and optical properties that are ideal for the integration of nonlinear devices and solid-state quantum defects. However, despite significant progress in [...] Read more.
Highly integrable silicon carbide (SiC) has emerged as a promising platform for photonic integrated circuits (PICs), offering a comprehensive set of material and optical properties that are ideal for the integration of nonlinear devices and solid-state quantum defects. However, despite significant progress in nanofabrication technology, the development of SiC on an insulator (SiCOI)-based photonics faces challenges due to fabrication-induced material optical losses and complex processing steps. An alternative approach to mitigate these fabrication challenges is the direct deposition of amorphous SiC on an insulator (a-SiCOI). However, there is a lack of systematic studies aimed at producing high optical quality a-SiC thin films, and correspondingly, on evaluating and determining their optical properties in the telecom range. To this end, we have studied a single-source precursor, 1,3,5-trisilacyclohexane (TSCH, C3H12Si3), and chemical vapor deposition (CVD) processes for the deposition of SiC thin films in a low-temperature range (650–800 °C) on a multitude of different substrates. We have successfully demonstrated the fabrication of smooth, uniform, and stoichiometric a-SiCOI thin films of 20 nm to 600 nm with a highly controlled growth rate of ~0.5 Å/s and minimal surface roughness of ~5 Å. Spectroscopic ellipsometry and resonant micro-photoluminescence excitation spectroscopy and mapping reveal a high index of refraction (~2.7) and a minimal absorption coefficient (<200 cm−1) in the telecom C-band, demonstrating the high optical quality of the films. These findings establish a strong foundation for scalable production of high-quality a-SiCOI thin films, enabling their application in advanced chip-scale telecom PIC technologies. Full article
(This article belongs to the Section Materials Science and Engineering)
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10 pages, 2570 KB  
Article
Demonstration of Monolithic Integration of InAs Quantum Dot Microdisk Light Emitters and Photodetectors Directly Grown on On-Axis Silicon (001)
by Shuaicheng Liu, Hao Liu, Jihong Ye, Hao Zhai, Weihong Xiong, Yisu Yang, Jun Wang, Qi Wang, Yongqing Huang and Xiaomin Ren
Micromachines 2025, 16(8), 897; https://doi.org/10.3390/mi16080897 - 31 Jul 2025
Viewed by 606
Abstract
Silicon-based microcavity quantum dot lasers are attractive candidates for on-chip light sources in photonic integrated circuits due to their small size, low power consumption, and compatibility with silicon photonic platforms. However, integrating components like quantum dot lasers and photodetectors on a single chip [...] Read more.
Silicon-based microcavity quantum dot lasers are attractive candidates for on-chip light sources in photonic integrated circuits due to their small size, low power consumption, and compatibility with silicon photonic platforms. However, integrating components like quantum dot lasers and photodetectors on a single chip remains challenging due to material compatibility issues and mode field mismatch problems. In this work, we have demonstrated monolithic integration of an InAs quantum dot microdisk light emitter, waveguide, and photodetector on a silicon platform using a shared epitaxial structure. The photodetector successfully monitored variations in light emitter output power, experimentally proving the feasibility of this integrated scheme. This work represents a key step toward multifunctional integrated photonic systems. Future efforts will focus on enhancing the light emitter output power, improving waveguide efficiency, and scaling up the integration density for advanced applications in optical communication. Full article
(This article belongs to the Special Issue Silicon-Based Photonic Technology and Devices)
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14 pages, 23403 KB  
Article
Flexibly Reconfigurable Kerr Micro-Comb Based on Cascaded Si3N4 Micro-Ring Filters
by Jieyu Yang, Guang Chen, Lidan Lu, Jianzhen Ou, Chao Mei, Yingjie Xu, Wenbo Bo, Peng Wang, Xinyi Li and Lianqing Zhu
Photonics 2025, 12(7), 661; https://doi.org/10.3390/photonics12070661 - 30 Jun 2025
Viewed by 416
Abstract
In recent years, micro-combs, due to their compact structure and high efficiency, have proven to be a practical solution for optical sources. In this paper, an approach to flexibly modulating micro-combs is proposed, and a simulation platform based on Si3N4 [...] Read more.
In recent years, micro-combs, due to their compact structure and high efficiency, have proven to be a practical solution for optical sources. In this paper, an approach to flexibly modulating micro-combs is proposed, and a simulation platform based on Si3N4 micro-combs with highly integrated, tunable, and reconfigurable features is built. By means of the Lugiato–Lefever equation model, the dynamic evolution process of micro-combs is analyzed, and a micro-ring resonator is designed with a free spectral range of 7.24 nm, an effective mode area of 1.0829µm2, and coherent comb lines spanning over 125 THz. Cascaded silicon nitride micro-ring filters are utilized to obtain reconfigurable modulation effects for Kerr-frequency micro-combs. Due to the significance of flexibly controlled optical sources with high-repetition rates and multiple channels for system-on-chip, our proposal has potential in photonic integrated circuit systems, such as high-density photonic computing and large-capacity optical communications, in the future. Full article
(This article belongs to the Special Issue Photonic Integrated Circuits: Techniques, Insights and Devices)
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12 pages, 3981 KB  
Article
On-Chip Silicon Photonic Neural Networks Based on Thermally Tunable Microring Resonators for Recognition Tasks
by Huan Zhang, Beiju Huang, Chuantong Cheng, Biao Jiang, Lei Bao and Yiyang Xie
Photonics 2025, 12(7), 640; https://doi.org/10.3390/photonics12070640 - 24 Jun 2025
Viewed by 863
Abstract
Leveraging the human brain as a paradigm of energy-efficient computation, considerable attention has been paid to photonic neurons and neural networks to achieve higher computing efficiency and lower energy consumption. This study experimentally demonstrates on-chip silicon photonic neurons and neural networks based on [...] Read more.
Leveraging the human brain as a paradigm of energy-efficient computation, considerable attention has been paid to photonic neurons and neural networks to achieve higher computing efficiency and lower energy consumption. This study experimentally demonstrates on-chip silicon photonic neurons and neural networks based on thermally tunable microring resonators (MRRs) implement weighting and nonlinear operations. The weight component consists of eight cascaded MRRs thermally tuned within wavelength division multiplexing (WDM) architecture. The nonlinear response depends on the MRR’s nonlinear transmission spectrum, which is analogous to the rectified linear unit (ReLU) function. The matrix multiplication and recognition task of digits 2, 3, and 5 represented by seven-segment digital tube are successfully completed by using the photonic neural networks constructed by the photonic neurons based on the on-chip thermally tunable MRR as the nonlinear units. The power consumption of the nonlinear unit was about 5.65 mW, with an extinction ratio of about 25 dB between different digits. The proposed photonic neural network is CMOS-compatible, which makes it easy to construct scalable and large-scale multilayer neural networks. These findings reveal that there is great potential for highly integrated and scalable neuromorphic photonic chips. Full article
(This article belongs to the Special Issue Silicon Photonics: From Fundamentals to Future Directions)
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10 pages, 977 KB  
Communication
Tailorable Brillouin Light Scattering in Air-Slit Suspended Waveguide
by Yanzhao Wang, Hongrun Ren and Yunjie Teng
Photonics 2025, 12(6), 586; https://doi.org/10.3390/photonics12060586 - 9 Jun 2025
Viewed by 381
Abstract
Silicon-based optical waveguides exhibit high Brillouin gain, enabling the realization of Brillouin lasers directly on silicon substrates. These lasers hold significant promise for applications such as tunable-frequency laser emission, ultrafast pulse generation via mode-locking techniques, and other advanced photonic functionalities. However, a key [...] Read more.
Silicon-based optical waveguides exhibit high Brillouin gain, enabling the realization of Brillouin lasers directly on silicon substrates. These lasers hold significant promise for applications such as tunable-frequency laser emission, ultrafast pulse generation via mode-locking techniques, and other advanced photonic functionalities. However, a key challenge in silicon-based Brillouin lasers is the requirement for long waveguide lengths to achieve sufficient optical feedback and reach the lasing threshold. This study proposes a novel floating waveguide architecture designed to significantly enhance the Brillouin gain in silicon-based systems. Furthermore, we introduce a breakthrough method for achieving wide-range phonon frequency tunability, enabling precise control over stimulated Brillouin scattering (SBS) dynamics. By strategically engineering the waveguide geometry (shape and dimensions), we demonstrate a tunable SBS phonon laser, offering a versatile platform for on-chip applications. Additionally, the proposed waveguide system features adjustable operating frequencies, unlocking new opportunities for compact Brillouin devices and integrated microwave photonic signal sources. Full article
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13 pages, 5874 KB  
Article
Fano Resonance Mach–Zehnder Modulator Based on a Single Arm Coupled with a Photonic Crystal Nanobeam Cavity for Silicon Photonics
by Enze Shi, Guang Chen, Lidan Lu, Yingjie Xu, Jieyu Yang and Lianqing Zhu
Sensors 2025, 25(10), 3240; https://doi.org/10.3390/s25103240 - 21 May 2025
Viewed by 964
Abstract
Recently, Fano resonance modulators and photonic crystal nanobeam cavities (PCNCs) have attracted more and more attention due to their superior performance, such as high modulation efficiency and high extinction ratio (ER). In this paper, a silicon Fano resonance Mach–Zehnder modulator (MZM) based on [...] Read more.
Recently, Fano resonance modulators and photonic crystal nanobeam cavities (PCNCs) have attracted more and more attention due to their superior performance, such as high modulation efficiency and high extinction ratio (ER). In this paper, a silicon Fano resonance Mach–Zehnder modulator (MZM) based on a single arm coupled with a PCNC is theoretically analyzed, designed, and numerically simulated. By optimizing the coupling length, lattice constant, coupling gap, and the number of holes in the mirror/taper region, the ER of our MZM can achieve 34 dB. When the applied voltage of the MZM is biased at 4.3 V and the non-return-to-zero on–off keying (NRZ-OOK) signal at a data rate of 10 Gbit/s is modulated, the sharpest asymmetric resonant peak and the most remarkable Fano line shape can be obtained around a wavelength of 1550.68 nm. Compared with the traditional nanobeam cavities, along with the varying radii, our PCNC design has holes with a fixed radius of 90 nm, which is suitable to be fabricated by a 180 nm passive silicon photonic multi-project wafer (MPW). Therefore, our compacted lab-on-chip, resonance-based silicon photonic MZM that is coupled with a PCNC has the advantages of superior performance and easy fabrication, which provide support for photonic integrated circuit designs and can be beneficial to various silicon photonic application fields, including photonic computing, photonic convolutional neural networks, and optical communications, in the future. Full article
(This article belongs to the Special Issue Advances in Microwave Photonics)
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34 pages, 6501 KB  
Review
Integrated Photonic Biosensors: Enabling Next-Generation Lab-on-a-Chip Platforms
by Muhammad A. Butt, B. Imran Akca and Xavier Mateos
Nanomaterials 2025, 15(10), 731; https://doi.org/10.3390/nano15100731 - 13 May 2025
Cited by 2 | Viewed by 2563
Abstract
Integrated photonic biosensors are revolutionizing lab-on-a-chip technologies by providing highly sensitive, miniaturized, and label-free detection solutions for a wide range of biological and chemical targets. This review explores the foundational principles behind their operation, including the use of resonant photonic structures such as [...] Read more.
Integrated photonic biosensors are revolutionizing lab-on-a-chip technologies by providing highly sensitive, miniaturized, and label-free detection solutions for a wide range of biological and chemical targets. This review explores the foundational principles behind their operation, including the use of resonant photonic structures such as microring and whispering gallery mode resonators, as well as interferometric and photonic crystal-based designs. Special focus is given to the design strategies that optimize light–matter interaction, enhance sensitivity, and enable multiplexed detection. We detail state-of-the-art fabrication approaches compatible with complementary metal-oxide-semiconductor processes, including the use of silicon, silicon nitride, and hybrid material platforms, which facilitate scalable production and seamless integration with microfluidic systems. Recent advancements are highlighted, including the implementation of optofluidic photonic crystal cavities, cascaded microring arrays with subwavelength gratings, and on-chip detector arrays capable of parallel biosensing. These innovations have achieved exceptional performance, with detection limits reaching the parts-per-billion level and real-time operation across various applications such as clinical diagnostics, environmental surveillance, and food quality assessment. Although challenges persist in handling complex biological samples and achieving consistent large-scale fabrication, the emergence of novel materials, advanced nanofabrication methods, and artificial intelligence-driven data analysis is accelerating the development of next-generation photonic biosensing platforms. These technologies are poised to deliver powerful, accessible, and cost-effective diagnostic tools for practical deployment across diverse settings. Full article
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19 pages, 8444 KB  
Review
Hybrid Photonic Integrated Circuits for Wireless Transceivers
by Tianwen Qian, Ben Schuler, Y. Durvasa Gupta, Milan Deumer, Efstathios Andrianopoulos, Nikolaos K. Lyras, Martin Kresse, Madeleine Weigel, Jakob Reck, Klara Mihov, Philipp Winklhofer, Csongor Keuer, Laurids von Emden, Marcel Amberg, Crispin Zawadzki, Moritz Kleinert, Simon Nellen, Davide de Felipe, Hercules Avramopoulos, Robert B. Kohlhaas, Norbert Keil and Martin Schelladd Show full author list remove Hide full author list
Photonics 2025, 12(4), 371; https://doi.org/10.3390/photonics12040371 - 12 Apr 2025
Cited by 1 | Viewed by 1666
Abstract
Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer HHI. This work leverages hybrid integration technology, which combines indium phosphide (InP) active elements, silicon nitride (Si3N4) low-loss [...] Read more.
Recent advancements in hybrid photonic integrated circuits (PICs) for wireless communications are reviewed, with a focus on innovations developed at Fraunhofer HHI. This work leverages hybrid integration technology, which combines indium phosphide (InP) active elements, silicon nitride (Si3N4) low-loss waveguides, and high-efficient thermal-optical tunable polymers with micro-optical functions to achieve fully integrated wireless transceivers. Key contributions include (1) On-chip optical injection locking for generating phase-locked optical beat notes at 45 GHz, enabled by cascaded InP phase modulators and hybrid InP/polymer tunable lasers with a 3.8 GHz locking range. (2) Waveguide-integrated THz emitters and receivers, featuring photoconductive antennas (PCAs) with a 22× improved photoresponse compared to top-illuminated designs, alongside scalable 1 × 4 PIN-PD and PCA arrays for enhanced power and directivity. (3) Beam steering at 300 GHz using a polymer-based optical phased array (OPA) integrated with an InP antenna array, achieving continuous steering across 20° and a 10.6 dB increase in output power. (4) Demonstration of fully integrated hybrid wireless transceiver PICs combining InP, Si3N4, and polymer material platforms, validated through key component characterization, on-chip optical frequency comb generation, and coherent beat note generation at 45 GHz. These advancements result in compact form factors, reduced power consumption, and enhanced scalability, positioning PICs as an enabling technology for future high-speed wireless networks. Full article
(This article belongs to the Special Issue Advanced Technologies in Optical Wireless Communications)
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13 pages, 10030 KB  
Article
Advanced Fabrication of 56 Gbaud Electro-Absorption Modulated Laser (EML) Chips Integrated with High-Speed Silicon Photonic Substrates
by Liang Li, Yifan Xiao, Weiqi Wang, Chenggang Guan, Wengang Yao, Yuming Zhang, Xuan Chen, Qiang Wan, Chaoqiang Dong and Xinyuan Xu
Photonics 2025, 12(4), 329; https://doi.org/10.3390/photonics12040329 - 1 Apr 2025
Viewed by 831
Abstract
With the rapid growth of data center demand driven by AI, high-speed optical modules (such as 800G and 1.6T) have become critical components. Traditional 800G modules face issues such as complex processes and large sizes due to the separate packaging of EML chips, [...] Read more.
With the rapid growth of data center demand driven by AI, high-speed optical modules (such as 800G and 1.6T) have become critical components. Traditional 800G modules face issues such as complex processes and large sizes due to the separate packaging of EML chips, AlN substrates, and capacitors. This study proposes a high-speed EML module based on silicon integration, where resistors, capacitors, and AuSn soldering areas are integrated onto the silicon substrate, enabling the bonding of the EML chip, reducing packaging costs, and enhancing scalability. Key achievements include: the development of a 100G EML chip; the fabrication of a high-speed silicon integrated carrier; successful Chip-on-Carrier (COC) packaging and testing, with a laser output power of 10 mW, extinction ratio of 10 dB, and bandwidth greater than 40 GHz; and reliability verified through 500 h of aging tests. This study provides an expandable solution for next-generation high-speed optical interconnects. Full article
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4 pages, 162 KB  
Editorial
Silicon Photonics Devices and Integrated Circuits
by Wei Li and Duan Huang
Photonics 2025, 12(3), 187; https://doi.org/10.3390/photonics12030187 - 24 Feb 2025
Viewed by 2019
Abstract
The rapid evolution of integrated photonics has ushered in a transformative era for optical communication and information processing systems, with silicon-based optical chips emerging as a cornerstone technology [...] Full article
(This article belongs to the Special Issue Silicon Photonics Devices and Integrated Circuits)
12 pages, 4475 KB  
Article
Integrated Photonic Processor Implementing Digital Image Convolution
by Chensheng Wang, Wenhao Wu, Zhenhua Wang, Zhijie Zhang, Wei Xiong and Leimin Deng
Electronics 2025, 14(4), 709; https://doi.org/10.3390/electronics14040709 - 12 Feb 2025
Cited by 1 | Viewed by 1105
Abstract
Upon the advent of the big data era, information processing hardware platforms have undergone explosive development, facilitating unprecedented computational capabilities while significantly reducing energy consumption. However, conventional electronic computing hardware, despite significant upgrades in architecture optimization and chip scaling, still faces fundamental limitations [...] Read more.
Upon the advent of the big data era, information processing hardware platforms have undergone explosive development, facilitating unprecedented computational capabilities while significantly reducing energy consumption. However, conventional electronic computing hardware, despite significant upgrades in architecture optimization and chip scaling, still faces fundamental limitations in speed and energy efficiency due to Joule heating, electromagnetic crosstalk, and capacitance. A new type of information processing hardware is urgently needed for emerging data-intensive applications such as face identification, target tracking, and autonomous driving. Recently, integrated photonics computing architecture, which possesses remarkable compactness, wide bandwidth, low latency, and inherent parallelism, has harvested great attention due to its enormous potential to accelerate parallel data processing, such as digital image convolution. In this study, an integrated photonic processor based on a Mach-Zehnder interferometer (MZI) network is proposed and demonstrated. The processor, being scalable and compatible with complementary metal oxide semiconductors, facilitates mass production and seamless integration with other silicon-based optoelectronic devices. An experimental verification for digital image convolution is also performed, and the result deviations between our processor and a commercial 64-bit computer are less than 2.3%. Full article
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9 pages, 3269 KB  
Article
Modeling Dual-SiOxN Thin-Film Edge Coupler with Ultra-Low Loss and Large Alignment Tolerance
by Zhaozhen Chen, Xin Fu, Lei Zhang and Zhengsheng Han
Photonics 2025, 12(2), 136; https://doi.org/10.3390/photonics12020136 - 7 Feb 2025
Viewed by 1187
Abstract
High-performance facet couplers are essential components in the field of silicon nitride integrated photonic chips. In this work, a novel end-face coupling structure, using a double-layer SiOxN thin-film waveguide, is proposed. By precisely controlling the thickness and gap of the SiO [...] Read more.
High-performance facet couplers are essential components in the field of silicon nitride integrated photonic chips. In this work, a novel end-face coupling structure, using a double-layer SiOxN thin-film waveguide, is proposed. By precisely controlling the thickness and gap of the SiOxN layers, we achieve flexible tuning of the output mode field size. This structure offers exceptional performance, including ultra-low coupling loss (TE: 0.29 dB, TM: 0.31 dB), large 3 dB alignment tolerance (±2.5 μm), and near-zero polarization-dependent loss. The optimized design strikes a favorable balance between coupling efficiency and alignment tolerance, making it well-suited for a wide range of photonic applications. Full article
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14 pages, 9062 KB  
Article
Dual-Band High-Throughput and High-Contrast All-Optical Topology Logic Gates
by Jinying Zhang, Yulin Si, Yexiaotong Zhang, Bingnan Wang and Xinye Wang
Micromachines 2024, 15(12), 1492; https://doi.org/10.3390/mi15121492 - 13 Dec 2024
Cited by 3 | Viewed by 1346
Abstract
Optical computing offers advantages such as high bandwidth and low loss, playing a crucial role in signal processing, communication, and sensing applications. Traditional optical logic gates, based on nonlinear fibers and optical amplifiers, suffer from poor robustness and large footprints, hindering their on-chip [...] Read more.
Optical computing offers advantages such as high bandwidth and low loss, playing a crucial role in signal processing, communication, and sensing applications. Traditional optical logic gates, based on nonlinear fibers and optical amplifiers, suffer from poor robustness and large footprints, hindering their on-chip integration. All-optical logic gates based on topological photonic crystals have emerged as a promising approach for developing robust and monolithic optical computing systems. Expanding topological photonic crystal logic gates from a single operating band to dual bands can achieve high throughput, significantly enhancing parallel computing capabilities. This study integrates the topological protection offered by valley photonic crystals with linear interference effects to design and implement seven optical computing logic gates on a silicon substrate. These gates, based on dual-band valley photonic crystal topological protection, include OR, XOR, NOT, NAND, NOR, and AND. The robustness of the implemented OR logic gates was verified in the presence of boundary defects. The results demonstrate that multi-band parallel computing all-optical logic gates can be achieved using topological photonic crystals, and these gates exhibit high robustness. The all-optical logic gates designed in this study hold significant potential for future applications in optical signal processing, optical communication, optical sensing, and other related areas. Full article
(This article belongs to the Special Issue Photonic and Optoelectronic Devices and Systems, Second Edition)
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