Search Results (57)

We report here a thorough study concerning the acylation reaction products of 8-hydroxyquinoline with 2-chloroacyl chloride, with new insights and clarifications in respect to the obtained products brought by NMR and X-ray studies. According to the reaction conditions we employed, three compounds could be obtained: 1-(2-chloro-2-oxoethyl)pyridin-1-ium chloride 10, 8-hydroxyquinoline hydrochloride 11, and the acylated product 8-(2-chloroacetoxy)quinolin-1-ium chloride 12. A certain influence of the catalyst and the used solvent was observed, and feasible explanations for product formations were furnished. The structure of the compounds was proved by using ¹H- and ¹³C-NMR spectra as well as single-crystal X-ray diffraction studies for compounds 12 and 11. According to X-ray crystallography, compounds 11 and 12 have a planar structure and exhibit an ionic crystal structure crystallized as a hydrochloride salt of the corresponding organic base. The crystal structures of both compounds are stabilized by intermolecular hydrogen bonds and π-π stacking interactions. In the crystals of compounds 11 and 12, the structural components are interconnected by a system of intermolecular hydrogen bonding, and a similar one-dimensional array is formed via hydrogen bonding and π-π stacking. The further assembling of the structure for 12 and 11 occurs with the formation of a three-dimensional supramolecular network. Full article

Molybdenum (Mo) is currently considered as a potential diffusion barrier material for copper (Cu) interconnects, and these interconnect structures are generally processed using the technique of chemical mechanical planarization (CMP). While a limited number of publications on Mo CMP are presently available, the considerations for mitigating CMP-induced galvanic corrosion of Mo have remained largely underexplored. Using a model CMP system in pH-neutral slurries of citric acid with silica abrasives, the present work demonstrates how Mo barrier lines in contact with Cu wires in the CMP environment can develop CMP defects of galvanic corrosion. Including imidazole in the slurry considerably reduces the galvanic current of this corrosion process. The mechanisms of galvanic inhibition and material removal are examined by employing strategic tribo-electrochemical measurements. Open-circuit potential and potentiodynamic polarization measurements performed under surface abrasion aid the characterization of CMP-enabling surface reactions. The slurry’s surface chemistry initiates the primary modes of material wear for CMP, and corrosion-induced propagation of subsurface wear mostly governs the measured material removal rates for both Mo and Cu. Although the Cu:Mo selectivity of material removal is affected as the galvanic corrosion of Mo is suppressed, this effect can be controlled by varying the slurry content of imidazole. Full article

As semiconductor devices continue to scale down and integrate more densely, the atomic-level planarization of metal interconnects and dielectric layers is critical. Consequently, the development of chemical mechanical planarization (CMP) materials must address both high polishing performance and environmental sustainability. In this study, γ-Fe₂O₃@SiO₂ core–shell abrasive particles were designed to overcome the performance and recyclability limitations of conventional SiO₂ abrasives. The γ-Fe₂O₃ core enables an efficient magnetic separation from spent slurry, while the tunable SiO₂ shell enhances the dispersion stability and modulates the polishing characteristics. When applied to the CMP of tungsten (W) thin films, the optimized γ-Fe₂O₃@SiO₂ abrasives achieved a higher removal rate and lower surface roughness than commercial SiO₂-based slurries. Notably, the abrasives maintained a high performance even after 10 reuse cycles through simple magnetic recovery. This demonstrates a highly efficient and sustainable design strategy for next-generation CMP materials. Full article

Neural interfaces created using thin-film fabrication rely primarily on conductive metal traces for electrical interconnects. Here, we explore the use of tantalum (Ta) metal interconnects as a replacement for noble-metal interconnects such as Au, Pt or Ir. Ta has been investigated previously for interconnect metallization in flexible silicon ribbon cables, but the structure and properties of tantalum for neural device metallization have not been extensively reported. In the present work, Ta metal was sputter-deposited onto amorphous silicon carbide (a-SiC), with and without a base titanium (Ti) adhesion layer, and investigated as interconnect metallization. In the absence of a Ti adhesion layer, resistivity measurements revealed a factor of six difference between Ta resistivity depending on the presence of the Ti base layer, with direct deposition on a-SiC nucleating high resistivity β-Ta (ρ = 197 ± 31 µΩ·cm, mean ± standard deviation) and Ta deposited on Ti nucleating low resistivity α-Ta (ρ = 35 ± 6 µΩ·cm). X-ray diffraction confirmed the existence of the two crystal structures. Ta feature sizes of 2 µm were created using photolithography and reactive ion etching (RIE). Finally, planar microelectrode array test structures using α-Ta and Au trace metallization with low-impedance ruthenium oxide (RuO_x) electrodes were fabricated and investigated by cyclic voltammetry (CV) and current pulsing in saline. These devices underwent 500 CV cycles between −0.6 and +0.6 V without evidence of degradation. In response to charge-balanced, biphasic current pulses at 4 nC/phase, a 21 mV increase in access voltage was observed with α-Ta metallization compared to Au. These results warrant further investigation of Ta as thin-film metallization interconnects for neural interface devices. Full article

Flexible supercapacitors have attracted significant attention as promising power sources for portable and wearable electronic devices. However, achieving simultaneous high power density, energy density and long-term cyclic stability in a simple device configuration remains a critical challenge. Herein, we report an all-solid-state flexible planar supercapacitor based on hierarchically structured cellulose nanofiber-carbon nanotube@manganese dioxide (CNF-CNT@MnO₂) composite aerogels. The electrode architecture is rationally designed by first dispersing CNTs within a hydrophilic CNF scaffold to form a conductive three-dimensional network, followed by in situ oxidative polymerization of MnO₂ onto the CNF-CNT fibrous skeleton. The hydrophilic CNFs network ensures thorough electrolyte penetration, the interconnected CNTs facilitate rapid electron transport, and the uniformly coated MnO₂ layer provides substantial pseudocapacitance. The aerogel electrode with a low density of 14.6 mg cm⁻³ and a high specific surface area of 214.4 m² g⁻¹ delivers a specific capacitance of 273.0 F g⁻¹ at 0.4 A g⁻¹. The assembled planar supercapacitor, incorporating gel electrolyte and a flexible hydrogel substrate, achieves an impressive areal capacitance of 885.0 mF cm⁻² at 2 mA cm⁻², energy density of 122.9 μWh cm⁻² and corresponding power density of 1000.0 μW cm⁻². The device exhibits excellent electrochemical stability, retaining 83.3% capacitance after 2500 charge–discharge cycles, and outstanding mechanical flexibility, with 96.3% capacitance retention after 200 repeated bending cycles. Furthermore, multiple devices can be connected in series or parallel to proportionally increase output voltage or current, meeting the practical power requirements of electronic applications. This work offers a viable pathway toward high-performance, durable energy storage solutions for next-generation wearable electronics. Full article

High-frequency 5G/6G communications demand copper foils combining sub-micron surface roughness (R_z < 0.6 μm) to minimize the skin effect with (111)-preferred orientation (for electromigration resistance), a balance challenging to achieve in conventional electrodeposition. This study quantifies the synergistic mechanism of a systematic series of additive formulations—from unary sodium 3-mercapto-1-propanesulfonate (MPS) to a quaternary MPS + polyethylene glycol (PEG) + Cl⁻ + gelatin (GEL) formulation—using electrochemical and microstructural analyses. While the ternary MPS + PEG + Cl⁻ system induced severe surface roughening (R_q = 449.5 nm) due to competitive adsorption, the introduction of high-concentration gelatin induced a kinetic bifurcation. It established a distinct “High-N/Low-D” regime—characterized by a 10⁴-fold reduction in diffusion coupled with a 10³-fold enhancement in nucleation, effectively suppressing the growth, reducing roughness from ~449.5 nm to ~81.3 nm via robust steric hindrance. However, this isotropic suppression simultaneously inhibited preferential crystal growth, leading to texture randomization. These findings kinetically quantify the intrinsic trade-off between extreme surface planarization and crystallographic orientation, providing a theoretical framework for designing high-performance interconnect materials. Full article

In this study, a high-fidelity, full-scale three-dimensional Computational Fluid Dynamics (CFD) model was developed to analyze the effects of U-type and Z-type interconnection configurations on flow and distribution uniformity within a 4 × 1 kW planar solid oxide fuel cell (SOFC) stack composed of 40 unit cells. Mesh independence was verified using the Richardson extrapolation method. The results reveal that on the anode (fuel inlet) side, the Z-type configuration exhibits significantly better flow and pressure uniformity than the U-type configuration and shows low sensitivity to variations in fuel utilization (${\mathrm{U}}_f$ = 0.3–0.8), maintaining stable flow distribution under different conditions. On the cathode (air inlet) side, however, the U-type configuration demonstrates superior flow stability at an air utilization rate of 0.3. Therefore, it is recommended to employ the Z-type configuration for the anode and the U-type configuration for the cathode to achieve more uniform gas distribution and enhanced operational stability. These findings provide valuable insights for optimizing the design and operation of solid oxide fuel cells (SOFCs) and offer guidance for the development of more efficient fuel cell systems. Full article

Metallic interconnects are key components in planar solid oxide fuel cell (SOFC) stacks. In the present study, we evaluated four Fe-Cr powder metallurgy (PM) alloy specimens, obtained from a domestic manufacturer, at nominal compositions (in wt%) of 5% Fe-95% Cr, 30% Fe-70% Cr, 50% Fe-50% Cr, and 78% Fe-22% Cr. These specimens were tested and evaluated for use in SOFC stack applications. The verification items included coefficient of thermal expansion measurements, high-temperature oxidation resistance and weight gain tests, mechanical strength tests, high-temperature sealant bonding and leakage rate measurements, and high-temperature electrical property (i.e., area-specific resistance) measurements. In addition, the specimens’ microstructures and elemental compositions were observed and analyzed. The test results indicate that the Fe content of the Fe-Cr powder metallurgy alloys influences various properties, while Cr also plays a significant role in high-temperature oxidation resistance. Among the four alloy specimens, the 78Fe-Cr alloy exhibited all of the aforementioned advantages, including a suitable coefficient of thermal expansion of 12.4 × 10⁻⁶/°C, excellent high-temperature oxidation resistance, a thermal weight-gain rate of 5.31 × 10⁻¹⁴ g²/cm⁴·s, a remarkably low high-temperature area-specific resistance of 7.04 mΩ·cm², and superior bonding and interfacial stability with the GC9 glass–ceramic sealant, achieving a very low leakage rate of 3.47 × 10⁻⁶ mbar·l/s/cm. These results indicate that the 78Fe-Cr powder metallurgy alloy performs excellently and is the most promising candidate for metallic interconnects in SOFC stack applications. Full article

The rapid expansion of broadband wireless communication systems, including 5G, satellite networks, and next-generation IoT platforms, has created a strong demand for antenna architectures capable of real-time beam control, compact integration, and broad frequency coverage. Traditional reflectarrays, while effective for narrowband applications, often face inherent limitations such as fixed beam direction, high insertion loss, and complex phase-shifting networks, making them less viable for modern adaptive and reconfigurable systems. Addressing these challenges, this work presents a novel wideband planar metasurface that operates as a polarization rotation reflective metasurface (PRRM), combining 90° polarization conversion with 1-bit reconfigurable phase modulation. The metasurface employs a mirror-symmetric unit cell structure, incorporating a cross-shaped patch with fan-shaped stub loading and integrated PIN diodes, connected through vertical interconnect accesses (VIAs). This design enables stable binary phase control with minimal loss across a significantly wide frequency range. Full-wave electromagnetic simulations confirm that the proposed unit cell maintains consistent cross-polarized reflection performance and phase switching from 3.83 GHz to 15.06 GHz, achieving a remarkable fractional bandwidth of 118.89%. To verify its applicability, the full-wave simulation analysis of a 16 × 16 array was conducted, demonstrating dynamic two-dimensional beam steering up to ±60° and maintaining a 3 dB gain bandwidth of 55.3%. These results establish the metasurface’s suitability for advanced beamforming, making it a strong candidate for compact, electronically reconfigurable antennas in high-speed wireless communication, radar imaging, and sensing systems. Full article

In order to apply Ga alloys to flexible and wearable electronic devices, it is crucial to verify the mechanical reliability of interconnections between Ga and various metal electrodes. This study investigated the phase transformation kinetics and microstructural evolution in the Ni/Ga couple. The diffusion reaction behavior between nickel and gallium was characterized from 323 K to 623 K for different annealing times. At temperatures lower than 323 K, no obvious intermetallic compound was identified after annealing, according to SEM observation. For reactions at temperatures higher than 423 K, the Ni₃Ga₇ phase was identified as the only reaction product formed, occurring in a planar morphology along the Ni/Ga interface. The activation energy for the growth of Ni₃Ga₇ was determined as 58.58 kJ/mol. The kinetic equation expressing the relationship between the thickness of interfacial intermetallic compound, annealing temperature, and time, is the following: $d=417174.55\exp \left(-{\displaystyle \frac{58579}{RT}}\right)t^{2.04-0.0024T}$. Full article

The manufacturing of integrated circuits involves multiple steps of chemical mechanical planarization (CMP) involving different materials. Mitigating CMP-induced defects is a main requirement of all CMP schemes. In this context, controlling galvanic corrosion is a particularly challenging task for planarizing device structures involving contact regions of different metals with dissimilar levels of corrosivity. Since galvanic corrosion occurs in the reactive environment of CMP slurries, an essential aspect of slurry engineering for metal CMP is to control the surface chemistries responsible for these bimetallic effects. Using a CMP system based on copper and cobalt (used in interconnects for wiring and blocking copper diffusion, respectively), the present work explores certain theoretical and experimental aspects of evaluating and controlling galvanic corrosion in barrier CMP. The limitations of conventional electrochemical tests for studying CMP-related galvanic corrosion are examined, and a tribo-electrochemical method for investigating these systems is demonstrated. Alkaline CMP slurries based on sodium percarbonate are used to planarize both Co and Cu samples. Galvanic corrosion of Co is controlled by using the metal-selective complex forming functions of malonic acid at the Co and Cu sample surfaces. A commonly used corrosion inhibitor, benzotriazole, is employed to further reduce the galvanic effects. Full article

The quality of shale oil reservoirs is a major factor determining shale oil production capacity. Research on shale oil reservoirs has primarily focused on lithology. However, there has been little research on lithofacies classification. Moreover, there is still a lack of research on potential reservoir differences between different lithofacies and their controlling factors. In this context, the present study aims to classify the lithofacies of shale oil reservoirs in the Paleogene Shahejie Formation of the Jiyang Depression using different methods, including rock core and thin section observations, scanning electron microscopy (SEM) analysis, and X-ray diffraction (XRD). In addition, the characteristics and genesis of the high-quality shale oil reservoirs were studied using three-dimensional micro-CT scanning, low-pressure nitrogen adsorption, high-pressure mercury injection, and core physical property testing. The results showed better physical properties of combined shale and lenticular crystal limestone (C1), continuous parallel planar calcareous mudstone and uncontinuous laminate mudstone (C2), and continuous parallel planar calcareous mudstone and laminate mudstone (C3) compared with those of the other lithofacies; C1 exhibited the best physical properties. These three combined lithofacies consisted mainly of interconnected pores with medium and large pore throats, as well as fractures; the pore size mainly ranged from nanometers to micrometers. The high-quality reservoir conditions in combined lithofacies are the result of both basic sedimentary lithofacies and diagenetic history. The results of the current study provide new ideas and a useful reference for future related studies on mud shale reservoirs. Full article

As urban environments become increasingly interconnected, the demand for precise and efficient pedestrian solutions in digitalized smart cities has grown significantly. This study introduces a scalable spatial visualization system designed to enhance interactions between individuals and the street in outdoor sidewalk environments. The system operates in two main phases: the spatial prior phase and the target localization phase. In the spatial prior phase, the system captures the user’s perspective using first-person visual data and leverages landmark elements within the sidewalk environment to localize the user’s camera. In the target localization phase, the system detects surrounding objects, such as pedestrians or cyclists, using high-angle closed-circuit television (CCTV) cameras. The system was deployed in a real-world sidewalk environment at an intersection on a university campus. By combining user location data with CCTV observations, a 4D+ virtual monitoring system was developed to present a spatiotemporal visualization of the mobile participants within the user’s surrounding sidewalk space. Experimental results show that the landmark-based localization method achieves a planar positioning error of 0.468 m and a height error of 0.120 m on average. With the assistance of CCTV cameras, the localization of other targets maintains an overall error of 0.24 m. This system establishes the spatial relationship between pedestrians and the street by integrating detailed sidewalk views, with promising applications for pedestrian navigation and the potential to enhance pedestrian-friendly urban ecosystems. Full article

The rise of artificial intelligence (AI) necessitates ultra-fast computing, with on-chip terahertz (THz) communication emerging as a key enabler. It offers high bandwidth, low power consumption, dense interconnects, support for multi-core architectures, and 3D circuit integration. However, transitioning between different waveguides remains a major challenge in THz systems. In this paper, we propose a THz band mode converter that converts from a rectangular waveguide (RWG) (WR-0.43) in ${\mathrm{TE}}_{10}$ mode to a substrate-integrated waveguide (SIW) in ${\mathrm{TE}}_{20}$ mode. The converter comprises a tapered waveguide, a widened waveguide, a zigzag antenna, and an aperture coupling slot. The zigzag antenna effectively captures the electromagnetic (EM) energy from the RWG, which is then coupled to the aperture slot. This coupling generates a quasi-slotline mode for the electric field (E-field) along the longitudinal side of the aperture, exhibiting odd symmetry akin to the SIW’s ${\mathrm{TE}}_{20}$ mode. Consequently, the ${\mathrm{TE}}_{20}$ mode is excited in the symmetrical plane of the SIW and propagates transversely. Our work details the mode transition principle through simulations of the EM field distribution and model optimization. A back-to-back RWG ${\mathrm{TE}}_{10}{\mathrm{-to-TE}}_{10}$ mode converter is designed, demonstrating an insertion loss of approximately 5 dB over the wide frequency range band of 2.15–2.36 THz, showing a return loss of 10 dB. An on-chip antenna is proposed which is fed by a single higher-order mode of the SIW, achieving a maximum gain of 4.49 dB. Furthermore, a balun based on the proposed converter is designed, confirming the presence of the ${\mathrm{TE}}_{20}$ mode in the SIW. The proposed mode converter demonstrates its feasibility for integration into a THz-band high-speed circuit due to its efficient mode conversion and compact planar design. Full article

In advanced microelectronic packaging, high thermo-mechanical loads arise on the solder interconnects. Accurate and efficient modeling of the mechanical behavior is crucial in the design of the package, and the simulation results can provide a basis for estimations of the reliability of the assembly. However, the accuracy of the simulation results depends on the accuracy of the modeled geometry and the modeling simplifications and assumptions employed to achieve computational cost-efficient calculations. In this work, finite element analysis (FEA) of a Fan Out—Wafer Level Packaging (FO-WLP) layout was carried out considering the following variations: modeling domain (2-D and pseudo-3-D) was defined for creating the efficient calculation framework, where soldering material (SAC 305 and SACQ), incorporation of intermetallic compound (IMC), bond pad edge geometry (sharp and blunt) were modeled for cycles of thermal load. Stress and strain analysis was carried out to evaluate the solder behavior for the parameter variations. Furthermore, fatigue indicators were evaluated. An efficient planar simulation framework with 2-D and pseudo-3-D meshed geometries provides a quick estimate for the lower and upper bound for the strain, stress and strain energy-related parameters, respectively. This calculation framework can be employed for extensive parameter studies solved rapidly at low computational costs. Full article