This study aims to identify and evaluate packaging elements in the food industry, taking into account various business areas/disciplines. The research was conducted with a sample of 1219 customers. An initial pool of 43 packaging items was developed,...
28 October 2022
Tobacco products are hazardous to public health and are one of the greater public health threats facing the world to date. Although international research on tobacco packaging has been thorough and comprehensive, the risk perception of visual element...
The obesity epidemic has evolved into a significant problem globally and poses a serious threat to the health of society. Despite increasing international research on obesity food packaging, the health value of visual elements in weight loss suppleme...
While packaging design plays a vital role in experience-oriented markets, how multiple visual elements influence purchase intention through brand experience remains unclear. This study addresses this gap by employing innovative orthogonal experiments...
In this paper, an innovative modeling approach for Li-ion battery packs is proposed by considering intrinsic cell unbalances and packaging elements. The proposed modeling method shows that the accurate battery pack model can be achieved if the overal...
As one of the world’s most widely used packaging materials, paper obtains its properties from its major component: wood. Variations in the species of wood result in variations in the paper’s mechanical properties. The pulp and paper produ...
The steadily increasing demand for downgauging to reduce costs in packaging steel applications requires the development of high-strength packaging steel grades to meet strength requirements. At the same time, the demand for a simulative, computer-aid...
Piezoresistive silicon pressure sensor samples were thermally cycled after being consecutively packaged to three different levels. These started with the absolute minimum to allow measurement of the output and with each subsequent level incorporating...
Corrugated paperboards are used for packaging because of their high strength-to-weight ratio, recyclability, and biodegradability. Corrugated paperboard consists of a liner and a corrugated medium and has an orthotropic sandwich structure with unique...
We designed a 3D geometrical model of a metal-oxide gas sensor and its custom packaging and used it in finite element modeling (FEM) analysis for obtaining temperature and heat flux distribution. The 3D computer simulation, performed with GetDP softw...
The aim of this research is to optimize the corrugated fibreboard (CFB) boxes recommended by the Bureau of Indian Standards (BIS) for packaging apples and suggest improvements for the same with the help of finite element modelling technique. The moti...
This paper presents a simulation based on the boundary element method for the optimization of the thermomechanical behavior of three-dimensional microchip-dissipator packaging when the heat generation produced is medium-low. Starting from a basic arc...
This paper introduces a novel approach to address thermal management challenges in system-in-package (SiP) technology, which is a significant concern in various advanced technologies. The main objective is to assess the electrical and thermal perform...
During retrovirus assembly, Gag packages unspliced viral RNA as the virion genome. Genome packaging is usually specific with occasional exceptions of cross-packaging RNA from distantly related retroviruses. For example, HIV-1 Gag can efficiently pack...
Disgust associated with insect consumption is a significant challenge faced by the insect-based food industry. One cost-effective approach that managers can employ to increase consumer acceptance is by enhancing packaging design. The packaging repres...
This research is in response to the question of which aspects of package design are more relevant to consumers, when purchasing educational toys. Neuromarketing techniques are used, and we propose a methodology for predicting which areas attract the...
The development of fan-out packaging technology for fine-pitch and high-pin-count applications is a hot topic in semiconductor research. To reduce the package footprint and improve system performance, many applications have adopted packaging-on-packa...
Food packaging is a crucial domain of green design and serves as an important channel for conveying green concepts to consumers. Effective packaging design not only achieves environmental sustainability but also fosters green awareness among consumer...
A molded expanded polystyrene (EPS) cushion is a flexible, closed-cell foam that can be molded to fit any packing application and is effective at absorbing shock. However, the packaging waste of EPS cushions causes pollution to landfills and the envi...
The prevalence of e-commerce has led to a significant increase in online shopping among consumers, resulting in a surge in returns due to discrepancies between received products and consumer expectations. To resolve this issue, many retailers resort...
The main objective of this paper is the identification and evaluation of packaging elements by the involved managers in the food industry. Primary research data was collected using a questionnaire that was completed by marketing and logistics manager...
With the development of power modules for high voltage, high temperature, and high power density, their size is becoming smaller, and the packaging insulation experiences higher electrical, thermal, and mechanical stress. Packaging insulation needs t...
New technological and packaging solutions are more and more being employed for power semiconductor switches in an automotive environment, especially the SiC- and GaN-based ones. In this framework, new front-end and back-end solutions have been develo...
This article presents an extended numerical approach for evaluating the dynamic response of corrugated cardboard transport packaging under simulated transport conditions. Building upon a simplified method previously introduced, this study integrates...
This study attempts to investigate the warpage behavior of a flip chip package-on-package (FCPoP) assembly during fabrication process. A process simulation framework that integrates thermal and mechanical finite element analysis (FEA), effective mode...
This work concerns the analysis of egg packages subjected to compression. Experimental investigations were carried out to determine the curves of compression and maximum loads. To compare packages accessible on the market, several different shapes of...
In 3D packaging memory devices, solder joints are critical links between the chip and the printed circuit board (PCB). Under severe working conditions, cracks inevitably occur due to thermal shock. If cracks grow in the solder joint, the chip will be...
In this paper, we present wafer-level packaging technology for surface acoustic wave (SAW) filters with higher long-term reliability and better electrical performance. This article focuses on the package structure, fabrication processes, and reliabil...
Due to the working principle of MEMS resonant accelerometers, their thermally induced frequency drift is an inevitable practical issue for their extensive application. This paper is focused on reducing the thermally induced packaging effects on the f...
Mechanical damage and bruising of fruit is a critical problem in the food industry. Minimizing brusing and damage can be achieved by designing energy-absorbing structures and packaging systems in order to ensure the long-term quality of fresh produce...
With the increasing demand for electronic products, the electronic package gradually developed toward miniaturization and high density. The most significant advantage of the Wafer-Level Package (WLP) is that it can effectively reduce the volume and f...
This paper presents the mechanical behaviors of different types of polyimide feedthroughs that are frequently used for implantable polymer encapsulation. Implantable packages of electronic devices often comprise circuits mounted on printed circuit bo...
This study investigates the impact of modeling the aluminum (Al) metallization layer as an integrated part of the chip model, versus as an individual component, on the results of electrical–thermal analysis of power semiconductor packages using...
High-power microelectronic packaging faces critical thermomechanical failures under rapid thermal cycling, primarily due to interfacial stress concentration and warping in conventional homogeneous heat sinks. To address this challenge, this study pro...
The finite element method is a widely used numerical method to analyze structures in virtual space. This method can be used in the packaging industry to determine the mechanical properties of corrugated boxes. This study aims to create and validate a...
In advanced microelectronic packaging, high thermo-mechanical loads arise on the solder interconnects. Accurate and efficient modeling of the mechanical behavior is crucial in the design of the package, and the simulation results can provide a basis...
Advancements in semiconductor packaging toward higher integration and interconnect density have increased the risk of structural defects—such as missing solder balls, pad delamination, and bridging—that can disrupt thermal conduction path...
This study proposes a building energy element technology system that addresses cooling loads, in response to rising average temperatures due to global warming caused by climate change. The study analyzes performance variations and energy-saving poten...
To enhance design efficiency, this study employs an effective prediction approach that utilizes validated finite element analysis (FEA) to generate simulation data and subsequently applies machine learning (ML) techniques to predict packaging reliabi...
Numerical modelling of corrugated paperboard is quite challenging due to its waved geometry and material non-linearity which is affected by the material properties of the individual paper sheets. Because of the complex geometry and material behaviour...
Current pallet design methodology frequently underestimates the load capacity of the pallet by assuming the payload is uniformly distributed and flexible. By considering the effect of payload characteristics and their interactions during pallet desig...
Linking the ferrite fraction in a dual-phase (DP) steel microstructure and its electromagnetic properties is critical in the effort to develop on-line measurement techniques for phase transformation using electromagnetic (EM) sensors. This paper deve...
Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gyroscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work,...
Post-harvest activities, which include sorting, loading, unloading, and transporting, are potential factors that cause mechanical damage and bruises to fresh produce. This would directly impact fruit shelf-life and, therefore, cause economic losses....
Tactile sensation is a crucial sensory pathway for humans to acquire information from the environment, and vibration feedback is one form of tactile feedback, offering advantages such as low cost, ease of integration, and high comfort. Avoiding mecha...
Health-oriented tourism has emerged as one of the fastest-growing niche tourism fields worldwide. Although there have been studies on the relationship between health and travel behavior, most have been from the perspective of travel motivation and ha...
In recent years, many electronic device industries have shown interest in using artificial intelligence (AI) to quickly estimate package warpage. Machine learning is one of the AI techniques which will give an express prediction on package warpage wi...
Side-channel attacks (SCAs) are powerful techniques used to recover keys from electronic devices by exploiting various physical leakages, such as power, timing, and heat. Although heat is one of the less frequently analyzed channels due to the high n...
Delamination is a critical failure mode in power electronics packages that can significantly impact their reliability and performance, due to the large amounts of electrical power managed by the most recent devices which induce remarkable thermomecha...
Nanocomposite materials are increasingly commonly used to ensure food safety and quality. Thanks to their unique properties, stemming from the presence of nanoparticles, they are used to develop advanced sensors and biosensors, e.g., for various harm...
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