Search Results (87)

The rapid advancement of high-performance electronics has intensified the demand for wide-bandgap semiconductor materials capable of operating under high-power and high-temperature conditions. Among these, silicon carbide (SiC) has emerged as a leading candidate due to its superior thermal conductivity, chemical stability, and mechanical strength. However, the high cost and complexity of SiC wafer fabrication, particularly in slicing and exfoliation, remain significant barriers to its widespread adoption. Conventional methods such as wire sawing suffer from considerable kerf loss, surface damage, and residual stress, reducing material yield and compromising wafer quality. Additionally, techniques like smart-cut ion implantation, though capable of enabling thin-layer transfer, are limited by long thermal annealing durations and implantation-induced defects. To overcome these limitations, ultrafast laser-based processing methods, including laser slicing and stealth dicing (SD), have gained prominence as non-contact, high-precision alternatives for SiC wafer exfoliation. This review presents the current state of the art and recent advances in laser-based precision SiC wafer exfoliation processes. Laser slicing involves focusing femtosecond or picosecond pulses at a controlled depth parallel to the beam path, creating internal damage layers that facilitate kerf-free wafer separation. In contrast, stealth dicing employs laser-induced damage tracks perpendicular to the laser propagation direction for chip separation. These techniques significantly reduce material waste and enable precise control over wafer thickness. The review also reports that recent studies have further elucidated the mechanisms of laser–SiC interaction, revealing that femtosecond pulses offer high machining accuracy due to localized energy deposition, while picosecond lasers provide greater processing efficiency through multipoint refocusing but at the cost of increased amorphous defect formation. The review identifies multiphoton ionization, internal phase explosion, and thermal diffusion key phenomena that play critical roles in microcrack formation and structural modification during precision SiC wafer laser processing. Typical ultrafast-laser operating ranges include pulse durations from 120–450 fs (and up to 10 ps), pulse energies spanning 5–50 µJ, focal depths of 100–350 µm below the surface, scan speeds ranging from 0.05–10 mm/s, and track pitches commonly between 5–20 µm. In addition, the review provides quantitative anchors including representative wafer thicknesses (250–350 µm), typical laser-induced crack or modified-layer depths (10–40 µm and extending up to 400–488 µm for deep subsurface focusing), and slicing efficiencies derived from multi-layer scanning. The review concludes that these advancements, combined with ongoing progress in ultrafast laser technology, represent research opportunities and challenges in transformative shifts in SiC wafer fabrication, offering pathways to high-throughput, low-damage, and cost-effective production. This review highlights the comparative advantages of laser-based methods, identifies the research gaps, and outlines the challenges and opportunities for future research in laser processing for semiconductor applications. Full article

Intraocular lens (IOL) implantation is currently the most effective method for restoring vision following cataract surgery and is also used in cases of high myopia or hyperopia. However, IOL implantation eliminates accommodation, forcing patients to choose between corrected distance vision, requiring reading glasses for near tasks, or near vision supplemented by distance correction with spectacles. This limitation underscores the need for fully customized, patient-specific IOLs. To address this challenge, we performed femtosecond laser ablation experiments on polymethyl methacrylate (PMMA) IOLs using 200 fs pulses at 513 nm to investigate controlled surface modification. Laser-induced surface structuring offers a pathway to inscribe micron-scale patterns, including apodized features, in transparent polymers. To our knowledge, this is the first demonstration of femtosecond laser irradiation at 513 nm applied to IOL surfaces. Furthermore, this study is the first to combine scanning electron microscopy (SEM) and optical coherence tomography (OCT) as detection technologies to analyze and quantify ablation morphology and depth. The formation of smooth craters with minimal surrounding thermal damage highlights the potential of femtosecond laser processing as a promising tool for the development of customized, patient-tailored intraocular lenses. Full article

Wavelength separation coatings can effectively separate the fundamental frequency (1ω) and third harmonic (3ω) laser beams. However, the laser-induced damage threshold (LIDT) of the surface defect-free WS coatings for the 3ω laser is 1.68 J/cm² (obtained in the preliminary experiment), significantly lower than the ideal LIDT of the fused silica substrate (80 J/cm²). This is directly correlated with extrinsic defects such as nanoscale defects and nodular defects introduced during the coating manufacturing process. Moreover, the damage in WS coatings caused by extrinsic defects is a complex physical process involving multiple physical phenomena such as material melting, vaporization, and ejection. The mechanism by which extrinsic defects interact with lasers to form damage is not yet fully elucidated. To address this, a multi-physics coupling model considering photoelectric, thermal and stress was established to simulate the incident laser propagation within coatings, the temperature distribution and thermal stress distribution of the coating material. This model systematically investigates the influence of defect location, type, and size on the laser-induced damage process. It is found that when a 10 nm-diameter defect is located at the 32nd layer of the coatings, the light intensity enhancement factor (LIEF) for 3ω laser can reach up to 5 times that for the 1ω laser. The variation in thermal stress induced by changes in defect size is jointly determined by the defect-induced modulation effect and the interference effect realized by the coating. This work theoretically reveals the mechanism of extrinsic defects in the laser damage. It provides effective guidance for establishing control standards for extrinsic defects during the optical coating process. Full article

In this work, bismuthate glasses with compositions of 64Bi₂O₃-(25-x)Pb₃(BO₃)₂-11Ga₂O₃-xPbO (where x = 2, 7, 12, 17) were prepared by the melt-quenching method, and their density, thermodynamic stability, Raman spectra, X-ray photoelectron spectra, Verdet constant, and nanosecond laser-induced damage threshold (LIDT) were characterized. As the content of PbO increases, the thermodynamic stability and laser-induced damage threshold of the glass gradually decrease, which corresponds to the increase in the glass’s optical basicity, the rise in non-bridging oxygen content, and the valence state transition of Bi ions observed in structural studies. A relatively large Verdet constant was obtained in the glass with the composition of 64Bi₂O₃-8Pb₃(BO₃)₂-11Ga₂O₃-17PbO, with a value of −0.191 min·G⁻¹·cm⁻¹ at a wavelength of 633 nm, which is much larger than that of commercially diamagnetic glasses. In addition, the variation in the Verdet constant at 1064 nm between 20 and 80 °C is less than 0.4 × 10⁻⁵ K⁻¹, which indicates that these bismuthate glasses are good candidates for magneto-optical devices under thermally unstable conditions. Full article

This study systematically investigates the influence of laser pulse duration on cutting efficiency, heat-affected-zone (HAZ) formation, and mechanical integrity during carbon fiber-reinforced polymer (CFRP) laser cutting. Three distinct pulse-width lasers—picosecond, nanosecond, and quasi-continuous-wave (QCW)—are compared. Results show that pulse duration governs material removal mechanisms and HAZ extent: the nanosecond laser achieves the smallest HAZ and minimal porosity; the picosecond laser exhibits limited thermal accumulation due to low average power; and the QCW laser induces the largest HAZ (11.6 times that of the nanosecond laser) and significant porosity. Cutting efficiency scales inversely with pulse width, with single-hole processing times of 480.4 s for picosecond-laser cutting, 76.8 s for nanosecond-laser cutting, and 4.028 s for QCW-laser cutting, reflecting a transition from thermal ablation to mechanical spallation. Mechanical testing reveals that while tensile and flexural strengths vary by less than 5% across laser types, damage morphology and failure modes differ significantly. In situ digital image correlation (DIC) and 3D CT imaging show that longitudinal plies fail via fiber pull-out, whereas transverse plies fail via interfacial debonding. QCW-laser-cut specimens exhibit more uniform strain distribution and higher damage tolerance. An optimized process parameter is proposed: nanosecond-laser cutting at 200 W and 20 kHz achieves a HAZ of less than 50 µm and a cutting time of less than 80 s, offering the best balance between efficiency and quality. Full article

A finite element simulation was conducted to analyze the thermal damage caused by a 532nm nanosecond pulsed laser on a CCD detector. A three-dimensional model was developed to study the temperature field variations within the detector. The simulation was centered on the laser-induced temporal progression of thermal damage in the CCD. Results showed that higher laser fluence led to increased heat accumulation, resulting in the expansion of the thermal damage area. Different thermal damage patterns were observed in the light sensor region and the light-shielded region. In the light sensor region, the melting of the silicon substrate expanded more in the transverse direction compared to the longitudinal direction with increasing laser fluence, while damage in the light-shielded region extended from the edges towards the center as laser fluence increased. These distinct damage patterns were attributed to different energy deposition patterns and structural differences between the light sensor region and the light-shielded region. Full article

GHz-burst laser polishing is as a promising technique for improving the surface quality of metallic materials, offering key advantages over conventional methods. In this study, two distinct approaches are investigated: a single-step polishing process, and a double-step process consisting of an initial laser milling step followed by a finishing/polishing pass. This distinction is critical in evaluating the performance of GHz-burst regimes under different surface conditions and roughness levels. Initial proof-of-concept trials confirm that GHz-burst irradiation can significantly reduce the surface roughness with minimal thermal damage, provided that process parameters are carefully optimized. Further analysis of spot-to-spot overlap reveals that the deposited energy density plays a crucial role in achieving uniform surface quality without inducing surface defects. The number of passes is also studied, showing that while multiple passes can improve surface finish, the benefit strongly depends on the initial roughness state of the substrate. Scalability is demonstrated by increasing both the repetition rate and scan speed proportionally while maintaining processing quality across larger areas. These results support the viability of GHz-burst laser polishing for high-throughput manufacturing. Applications in aerospace, biomedical implants, and precision optics highlight the technique’s potential for industrial adoption in demanding surface finishing contexts. Full article

Facing challenges of low efficiency and severe wear in deep hard formations with conventional drilling bits, this study investigates the synergistic rock-breaking technology combining a pulsed CO₂ laser with mechanical bits. The background highlights the need for novel methods to enhance drilling speed in high-strength, abrasive strata where traditional bits struggle. The theoretical analysis explores the thermo-mechanical coupling mechanism, where pulsed laser irradiation rapidly heats the rock surface, inducing thermal stress cracks, micro-spallation, and strength reduction through mechanisms like mineral thermal expansion mismatch and pore fluid vaporization. This pre-damage layer facilitates subsequent mechanical fragmentation. The research employs finite element numerical simulations (using COMSOL Multiphysics with an HJC constitutive model and damage evolution criteria) to model the coupled laser–mechanical–rock interaction, capturing temperature fields, stress distribution, crack propagation, and assessing efficiency. The results demonstrate that laser pre-conditioning significantly achieves 90–120% higher penetration rates compared to mechanical-only drilling. The dominant spallation mechanism proves energy-efficient. Conclusions affirm the feasibility and significant potential of CO₂ laser-assisted drilling for deep formations, contingent on optimized laser parameters, composite bit design (incorporating laser transmission, multi-head layout, and environmental protection), and addressing challenges, like high in-situ stress and drilling fluid interference through techniques like gas drilling. Future work should focus on high-power laser downhole transmission, adaptive control, and rigorous field validation. Full article

Ultrafast laser welding of glass/metal heterostructures has found extensive applications in sensors, medical devices, and optical systems. However, achieving high-stability, high-quality welds under non-optical contact conditions remains challenging due to severe internal damage within glass materials. This study addresses thermal management through synergistic control of thermal accumulation effects and material ablation thresholds. Using the sapphire/Invar alloy system as a model for glass/metal welding, we investigated thermal accumulation effects during ultrafast laser ablation of Invar alloy through theoretical simulations. Under a repetition rate of 1 MHz, the femtosecond laser raised the lattice equilibrium temperature by 700 K within 10 microseconds, demonstrating that high repetition rate femtosecond lasers can induce effective heat accumulation in Invar alloy. Furthermore, ablation thresholds for both materials were determined across varying repetition rates via the D² method, with corresponding threshold curves systematically constructed. Finally, based on the simulation and ablation threshold calculation results, laser parameters were selected for ultrafast laser single point welding of sapphire and Invar alloy. The experimental results demonstrate effective thermal effect mitigation, achieving a maximum shear strength of 63.37 MPa. Comparative analysis against traditional scan welding further validates the superiority of our approach in thermal management. This work provides foundational theoretical and methodological guidance for ultrafast laser welding of glass/metal heterostructures. Full article

With the increasing complexity and integration density of System-in-Package (SiP) technologies, the demand for selective electromagnetic interference (EMI) shielding is growing. Conventional sputtering processes, while effective for conformal EMI shielding, lack selectivity and often require additional masking or post-processing steps. In this study, we propose a novel, laser-based approach for the selective removal of EMI shielding layers without physical masking. Numerical simulations were conducted to investigate the thermal and mechanical behavior of multilayer EMI shielding structures under two irradiation modes: full-area and laser scanning. The results showed that the laser scanning method induced higher interfacial shear stress, reaching up to 38.6 MPa, compared to full-area irradiation (12.5 MPa), effectively promoting delamination while maintaining the integrity of the underlying epoxy mold compound (EMC). Experimental validation using a nanosecond pulsed fiber laser confirmed that complete removal of the EMI shielding layer could be achieved at optimized laser powers (~6 W) without damaging the EMC, whereas excessive power (8 W) caused material degradation. The laser scanning speed was 50 mm/s, and the total laser irradiation time of the package was 0.14 s, which was very fast. This study demonstrates the feasibility of a non-contact, damage-free, and selective EMI shielding removal technique, offering a promising solution for next-generation semiconductor packaging. Full article

Experimental and simulation analysis was conducted on the effects of 532 nm nanosecond laser-induced thermal damage on the front-side illuminated CMOS detector. The study examined CMOS detector output images at different stages of damage, including point damage, line damage, and complete failure, and correlated these with microscopic structural changes observed through optical and scanning electron microscopy. A finite element model was used to study the thermal–mechanical coupling effect during laser irradiation. The results indicated that at a laser energy density of 78.9 mJ/cm², localized melting occurs within photosensitive units in the epitaxial layer, manifesting as an irreversible white bright spot appearing in the detector output image (point damage). When the energy density is further increased to 241.9 mJ/cm², metal routings across multiple pixel units melt, resulting in horizontal and vertical black lines in the output image (line damage). Upon reaching 2005.4 mJ/cm², the entire sensor area failed to output any valid image due to thermal stress-induced delamination of the silicon dioxide insulation layer, with cracks propagating to the metal routing and epitaxial layers, ultimately causing structural deformation and device failure (complete failure). Full article

To address the poor thermal performance and low output efficiency of conventional solid-state microchip lasers, this study proposes and implements a bonded Nd:YAG/Cr⁴⁺:YAG laser based on fiber splitter pumping. Experimental results demonstrate that at a 4.02 mJ pump pulse energy and a 100 Hz repetition rate, the system achieves four linearly polarized output beams with an average pulse energy of 0.964 mJ, a repetition rate of 100 Hz, and an optical-to-optical conversion efficiency of 23.98%. The energy distribution ratios for the upper-left, lower-left, upper-right, and lower-right beams are 22.61%, 24.46%, 25.50%, and 27.43%, with pulse widths of 2.184 ns, 2.193 ns, 2.205 ns, and 2.211 ns, respectively. As the optical axis distance increases, the far-field spot pattern transitions from a single circular profile to four fully separated spots, where the lower-right beam exhibits beam quality factors of M_x² = 1.181 and M_y² = 1.289. Simulations at a 293.15 K coolant temperature and a 4.02 mJ pump energy reveal that split pumping reduces the volume-averaged temperature rise in Nd:YAG by 28.81% compared to single-beam pumping (2.57 K vs. 3.61 K), decreases the peak temperature rise by 66.15% (6.97 K vs. 20.59 K), and suppresses peak-to-peak temperature variation by 78.6% (1.34 K vs. 6.26 K). Compared with existing multi-beam generation methods, the fiber splitter approach offers integrated advantages—including compact size, low cost, high energy utilization, superior beam quality, and elevated damage thresholds—and thus shows promising potential for automotive multi-point ignition, multi-beam single-photon counting LiDAR, and laser-induced breakdown spectroscopy (LIBS) online analysis. Full article

The laser damage resistance of optical films holds significant practical importance, as it largely determines both the maximum power output of laser systems and the overall stability of the entire optical assembly. A comprehensive investigation was conducted to examine the influence of both single additives—acetylacetone (ACAC) and diethanolamine (DEA)—and dual-additive systems, specifically ACAC combined with polyethylene glycol 200 (PEG 200) and DEA combined with PEG 200, on TiO₂ film properties and their laser-induced damage behavior under 1064 nm irradiation. It demonstrated that the films fabricated using ACAC exhibited smoother surfaces. Nevertheless, the sol prepared with DEA was more stable, resulting in films with superior optical properties and an enhanced laser-induced damage threshold (LIDT). The incorporation of dual additives further improved the films’ LIDT. Specifically, the film with DEA and PEG 200 achieved the highest LIDT, reaching 21.5 J/cm². Moreover, all films exhibited defect-induced damage, yet distinct damage morphologies were observed across different samples. The single-additive films predominantly displayed stress-type damage patterns, whereas the dual-additive films manifested melting-type damage characteristics. Furthermore, through a combination of experiments and calculations, it was revealed that the reasons why the film with DEA and PEG 200 achieved the highest LIDT were twofold: first, the high thermal conductivity of DEA reduced the maximum temperature at the defect center within the film; second, the long molecular chains of PEG 200 created a looser film structure that better mitigated damage caused by stress and expansion during laser irradiation. This study presents a promising approach to enhancing the LIDT through the strategic selection of additives with high thermal conductivity while simultaneously incorporating organic compounds with long molecular chains to develop effective dual-additive films. Full article

This study is based on the laser-induced thermal-crack propagation (LITP) technology, focusing on the issues of deviation and thermal damage during the transverse crack propagation process, with the aim of achieving high-purity, non-destructive, and high-precision cutting of glass. A 50 W, 1064 nm fiber laser is used for S-pattern scanning cutting of soda–lime glass. A moving heat source model is established and analyzed via MATLAB R2022a numerical simulation. Combined with the ABAQUS 2019 software, the relationships among temperature field, stress field, crack propagation, and deviation during laser-induced thermal crack cutting are deeply explored. Meanwhile, laser thermal fracture experiments are also carried out. A confocal microscope detects glass surface morphology, cross-sectional roughness and hardness under different heat flux densities (HFLs), determining the heat flux density threshold affecting the glass surface quality. Through a comprehensive study of theory, simulation, and experiments, it is found that with an increase in the HFL value of the material, the laser-induced thermal crack propagation can be divided into four stages. When the heat flux density value is in the range of 47.2 to 472 W/m², the glass substrate has good cross-sectional characteristics. There is no ablation phenomenon, and the surface roughness of the cross-section is lower than 0.15 mm. The hardness decreases by 9.19% compared with the reference value. Full article

Laser-induced periodic surface structures (LIPSSs) produced via ultrafast laser-induced oxidation offer a promising route for high-quality nanostructuring, with reduced thermal damage compared to conventional ablation-based methods. However, the influence of laser repetition frequency on the formation and morphology of oxidized LIPSSs remains insufficiently explored. In this study, we systematically investigate the effects of varying the femtosecond laser repetition frequency from 1 kHz to 100 kHz while keeping the total pulse number constant on the oxidation-induced LIPSSs formed on amorphous silicon films. Scanning electron microscopy and Fourier analysis reveal a transition between two morphological regimes with increasing repetition frequency: at low frequencies, the long inter-pulse intervals result in irregular, disordered oxidation patterns; at high frequencies, closely spaced pulses promote the formation of highly ordered, periodic surface structures. Statistical measurements show that the laser-modified area decreases with frequency, while the LIPSS period remains relatively stable and the ridge width exhibits a peak at 10 kHz. Finite-difference time-domain (FDTD) and finite-element simulations suggest that the observed patterns result from a dynamic balance between light-field modulation and oxidation kinetics, rather than thermal accumulation. These findings advance the understanding of oxidation-driven LIPSS formation dynamics and provide guidance for optimizing femtosecond laser parameters for precise surface nanopatterning. Full article