Sign in to use this feature.

Years

Between: -

Subjects

remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline

Journals

remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline

Article Types

Countries / Regions

remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline

Search Results (1,405)

Search Parameters:
Keywords = PCB00

Order results
Result details
Results per page
Select all
Export citation of selected articles as:
19 pages, 1107 KiB  
Article
A Novel Harmonic Clocking Scheme for Concurrent N-Path Reception in Wireless and GNSS Applications
by Dina Ibrahim, Mohamed Helaoui, Naser El-Sheimy and Fadhel Ghannouchi
Electronics 2025, 14(15), 3091; https://doi.org/10.3390/electronics14153091 (registering DOI) - 1 Aug 2025
Abstract
This paper presents a novel harmonic-selective clocking scheme that facilitates concurrent downconversion of spectrally distant radio frequency (RF) signals using a single low-frequency local oscillator (LO) in an N-path receiver architecture. The proposed scheme selectively generates LO harmonics aligned with multiple RF bands, [...] Read more.
This paper presents a novel harmonic-selective clocking scheme that facilitates concurrent downconversion of spectrally distant radio frequency (RF) signals using a single low-frequency local oscillator (LO) in an N-path receiver architecture. The proposed scheme selectively generates LO harmonics aligned with multiple RF bands, enabling simultaneous downconversion without modification of the passive mixer topology. The receiver employs a 4-path passive mixer configuration to enhance harmonic selectivity and provide flexible frequency planning.The architecture is implemented on a printed circuit board (PCB) and validated through comprehensive simulation and experimental measurements under continuous wave and modulated signal conditions. Measured results demonstrate a sensitivity of 55dBm and a conversion gain varying from 2.5dB to 9dB depending on the selected harmonic pair. The receiver’s performance is further corroborated by concurrent (dual band) reception of real-world signals, including a GPS signal centered at 1575 MHz and an LTE signal at 1179 MHz, both downconverted using a single 393 MHz LO. Signal fidelity is assessed via Normalized Mean Square Error (NMSE) and Error Vector Magnitude (EVM), confirming the proposed architecture’s effectiveness in maintaining high-quality signal reception under concurrent multiband operation. The results highlight the potential of harmonic-selective clocking to simplify multiband receiver design for wireless communication and global navigation satellite system (GNSS) applications. Full article
(This article belongs to the Section Microwave and Wireless Communications)
16 pages, 1192 KiB  
Article
Application of the AI-Based Framework for Analyzing the Dynamics of Persistent Organic Pollutants (POPs) in Human Breast Milk
by Gordana Jovanović, Timea Bezdan, Snježana Herceg Romanić, Marijana Matek Sarić, Martina Biošić, Gordana Mendaš, Andreja Stojić and Mirjana Perišić
Toxics 2025, 13(8), 631; https://doi.org/10.3390/toxics13080631 - 27 Jul 2025
Viewed by 272
Abstract
Human milk has been used for over 70 years to monitor pollutants such as polychlorinated biphenyls (PCBs) and organochlorine pesticides (OCPs). Despite the growing body of data, our understanding of the pollutant exposome, particularly co-exposure patterns and their interactions, remains limited. Artificial intelligence [...] Read more.
Human milk has been used for over 70 years to monitor pollutants such as polychlorinated biphenyls (PCBs) and organochlorine pesticides (OCPs). Despite the growing body of data, our understanding of the pollutant exposome, particularly co-exposure patterns and their interactions, remains limited. Artificial intelligence (AI) offers considerable potential to enhance biomonitoring efforts through advanced data modelling, yet its application to pollutant dynamics in complex biological matrices such as human milk remains underutilized. This study applied an AI-based framework, integrating machine learning, metaheuristic hyperparameter optimization, explainable AI, and postprocessing, to analyze PCB-170 levels in breast milk samples from 186 mothers in Zadar, Croatia. Among 24 analyzed POPs, the most influential predictors of PCB-170 concentrations were hexa- and hepta-chlorinated PCBs (PCB-180, -153, and -138), alongside p,p’-DDE. Maternal age and other POPs exhibited negligible global influence. SHAP-based interaction analysis revealed pronounced co-behavior among highly chlorinated congeners, especially PCB-138–PCB-153, PCB-138–PCB-180, and PCB-180–PCB-153. These findings highlight the importance of examining pollutant interactions rather than individual contributions alone. They also advocate for the revision of current monitoring strategies to prioritize multi-pollutant assessment and focus on toxicologically relevant PCB groups, improving risk evaluation in real-world exposure scenarios. Full article
Show Figures

Figure 1

16 pages, 3829 KiB  
Article
Process Development for Concentrating Valuable Metals Present in the Non-Valorized Solid Fractions from Urban Mining
by Nour-Eddine Menad and Alassane Traoré
Metals 2025, 15(8), 834; https://doi.org/10.3390/met15080834 (registering DOI) - 26 Jul 2025
Viewed by 192
Abstract
Global resource consumption continues to grow each year, exerting increasing pressure on their availability. This trend could lead to a shortage of raw materials in the coming years. Aware of the risks associated with this situation, the European Union has implemented policies and [...] Read more.
Global resource consumption continues to grow each year, exerting increasing pressure on their availability. This trend could lead to a shortage of raw materials in the coming years. Aware of the risks associated with this situation, the European Union has implemented policies and strategies aimed at diversifying its supply sources, including waste recycling. In this context, the present study was conducted with the objective of developing innovative processes to concentrate valuable metals present in the non-recovered fractions of waste electrical and electronic equipment (WEEE). Three types of samples were studied: washing table residues (WTRs), printed circuit boards (PCBs), and powders from cathode-ray tube screens (CRT powders). Several separation techniques, based on the physical properties of the elements, were implemented, including electrostatic separation, magnetic separation, and density and gravity-based separations. The results obtained are promising. For WTRs and PCBs, the recovery rates of targeted metals (Cu, Al, Pb, Zn, Sn) reached approximately 91% and 80%, respectively. In addition to these metals, other valuable metals, present in significant quantities, deserve further exploration. Regarding CRT powders, the performances are also encouraging, with recovery rates of 54.7% for zinc, 57.1% for yttrium, and approximately 71% for europium. Although these results are satisfactory, optimizations are possible to maximize the recovery of these critical elements. The techniques implemented have demonstrated their effectiveness in concentrating target metals in the treated fractions. These results confirm that recycling constitutes a viable alternative to address resource shortages and secure part of the supplies needed for the European Union’s industry. Full article
Show Figures

Figure 1

26 pages, 12786 KiB  
Article
EMB System Design and Clamping Force Tracking Control Research
by Junyi Zou, Haojun Yan, Yunbing Yan and Xianping Huang
Modelling 2025, 6(3), 72; https://doi.org/10.3390/modelling6030072 - 25 Jul 2025
Viewed by 304
Abstract
The electromechanical braking (EMB) system is an important component of intelligent vehicles and is also the core actuator for longitudinal dynamic control in autonomous driving motion control. Therefore, we propose a new mechanism layout form for EMB and a feedforward second-order linear active [...] Read more.
The electromechanical braking (EMB) system is an important component of intelligent vehicles and is also the core actuator for longitudinal dynamic control in autonomous driving motion control. Therefore, we propose a new mechanism layout form for EMB and a feedforward second-order linear active disturbance rejection controller based on clamping force. This solves the problem of excessive axial distance in traditional EMB and reduces the axial distance by 30%, while concentrating the PCB control board for the wheels on the EMB housing. This enables the ABS and ESP functions to be integrated into the EMB system, further enhancing the integration of line control and active safety functions. A feedforward second-order linear active disturbance rejection controller (LADRC) based on the clamping force of the brake caliper is proposed. Compared with the traditional clamping force control methods three-loop PID and adaptive fuzzy PID, it improves the response speed, steady-state error, and anti-interference ability. Moreover, the LADRC has more advantages in parameter adjustment. Simulation results show that the response speed is increased by 130 ms, the overshoot is reduced by 9.85%, and the anti-interference ability is increased by 41.2%. Finally, the feasibility of this control algorithm was verified through the EMB hardware-in-the-loop test bench. Full article
Show Figures

Figure 1

15 pages, 734 KiB  
Article
The Influence of Electrostatic Separation Parameters on the Recovery of Metals from Pre-Crushed PCBs
by Antonio Manuel Lopez-Paneque, Victoria Humildad Gallardo García-Orta, Jose Maria Gallardo, Ranier Enrique Sepúlveda-Ferrer and Ernesto Chicardi
Metals 2025, 15(8), 826; https://doi.org/10.3390/met15080826 - 23 Jul 2025
Viewed by 215
Abstract
Electrostatic separation is a promising technology for the recovery of valuable metals from electronic waste, particularly from printed circuit boards (PCBs). This study explores the application of electrostatic separation for the selective recovery of metallic and non-metallic fractions from crushed PCBs (PCBs). The [...] Read more.
Electrostatic separation is a promising technology for the recovery of valuable metals from electronic waste, particularly from printed circuit boards (PCBs). This study explores the application of electrostatic separation for the selective recovery of metallic and non-metallic fractions from crushed PCBs (PCBs). The process exploits the differences in electrical properties between conductive metals and non-conductive polymers and ceramics, facilitating their separation through applied electric fields. The raw materials were pre-treated via mechanical comminution using shredders and hammer mills to achieve an optimal particle size distribution (<3 mm), which enhances separation efficiency. Ferrous materials were removed prior to electrostatic separation to improve process selectivity. Key operational parameters, including particle size, charge accumulation, environmental conditions, and separation efficiency, were systematically analysed. The results demonstrate that electrostatic separation effectively recovers high-value metals such as copper and gold while minimizing material losses. Additionally, the process contributes to the sustainability of e-waste recycling by enabling the recovery of non-metallic fractions for potential secondary applications. This work underscores the significance of electrostatic separation as a viable technique for e-waste management and highlights optimization strategies for enhancing its performance in large-scale recycling operations. Full article
Show Figures

Figure 1

18 pages, 3220 KiB  
Article
High-Throughput Microfluidic Electroporation (HTME): A Scalable, 384-Well Platform for Multiplexed Cell Engineering
by William R. Gaillard, Jess Sustarich, Yuerong Li, David N. Carruthers, Kshitiz Gupta, Yan Liang, Rita Kuo, Stephen Tan, Sam Yoder, Paul D. Adams, Hector Garcia Martin, Nathan J. Hillson and Anup K. Singh
Bioengineering 2025, 12(8), 788; https://doi.org/10.3390/bioengineering12080788 - 22 Jul 2025
Viewed by 443
Abstract
Electroporation-mediated gene delivery is a cornerstone of synthetic biology, offering several advantages over other methods: higher efficiencies, broader applicability, and simpler sample preparation. Yet, electroporation protocols are often challenging to integrate into highly multiplexed workflows, owing to limitations in their scalability and tunability. [...] Read more.
Electroporation-mediated gene delivery is a cornerstone of synthetic biology, offering several advantages over other methods: higher efficiencies, broader applicability, and simpler sample preparation. Yet, electroporation protocols are often challenging to integrate into highly multiplexed workflows, owing to limitations in their scalability and tunability. These challenges ultimately increase the time and cost per transformation. As a result, rapidly screening genetic libraries, exploring combinatorial designs, or optimizing electroporation parameters requires extensive iterations, consuming large quantities of expensive custom-made DNA and cell lines or primary cells. To address these limitations, we have developed a High-Throughput Microfluidic Electroporation (HTME) platform that includes a 384-well electroporation plate (E-Plate) and control electronics capable of rapidly electroporating all wells in under a minute with individual control of each well. Fabricated using scalable and cost-effective printed-circuit-board (PCB) technology, the E-Plate significantly reduces consumable costs and reagent consumption by operating on nano to microliter volumes. Furthermore, individually addressable wells facilitate rapid exploration of large sets of experimental conditions to optimize electroporation for different cell types and plasmid concentrations/types. Use of the standard 384-well footprint makes the platform easily integrable into automated workflows, thereby enabling end-to-end automation. We demonstrate transformation of E. coli with pUC19 to validate the HTME’s core functionality, achieving at least a single colony forming unit in more than 99% of wells and confirming the platform’s ability to rapidly perform hundreds of electroporations with customizable conditions. This work highlights the HTME’s potential to significantly accelerate synthetic biology Design-Build-Test-Learn (DBTL) cycles by mitigating the transformation/transfection bottleneck. Full article
(This article belongs to the Section Cellular and Molecular Bioengineering)
Show Figures

Graphical abstract

16 pages, 4284 KiB  
Article
Monitoring of Corrosion in Reinforced E-Waste Concrete Subjected to Chloride-Laden Environment Using Embedded Piezo Sensor
by Gaurav Kumar, Tushar Bansal and Dayanand Sharma
Constr. Mater. 2025, 5(3), 46; https://doi.org/10.3390/constrmater5030046 - 16 Jul 2025
Viewed by 443
Abstract
This study explores the use of embedded piezo sensor (EPS) employing the Electro-Mechanical Impedance (EMI) technique for real-time corrosion monitoring in reinforced E-waste concrete exposed to chloride-laden environments. With the growing environmental concerns over electronic waste (E-waste) and the demand for sustainable construction [...] Read more.
This study explores the use of embedded piezo sensor (EPS) employing the Electro-Mechanical Impedance (EMI) technique for real-time corrosion monitoring in reinforced E-waste concrete exposed to chloride-laden environments. With the growing environmental concerns over electronic waste (E-waste) and the demand for sustainable construction practices, printed circuit board (PCB) materials were incorporated as partial replacements for coarse aggregates in concrete. The experiment utilized M30-grade concrete mixes, substituting 15% of natural coarse aggregates with E-waste, aiming to assess both sustainability and structural performance without compromising durability. EPS configured with Lead Zirconate Titanate (PZT) patches were embedded into both conventional and E-waste concrete specimens. The EPS monitored the changes in the form of conductance and susceptance signatures across a 100–400 kHz frequency range during accelerated corrosion exposure over a 60-day period in a 3.5% NaCl solution. The corrosion progression was evaluated qualitatively through electrical impedance signatures, visually via rust formation and cracking, and quantitatively using the Root Mean Square Deviation (RMSD) of EMI signatures. The results showed that the EMI technique effectively captured the initiation and propagation stages of corrosion. E-waste concrete exhibited earlier and more severe signs of corrosion compared to conventional concrete, indicated by faster increases and subsequent declines in conductance and susceptance and higher RMSD values during the initiation phase. The EMI-based system demonstrated its capability to detect microstructural changes at early stages, making it a promising method for Structural Health Monitoring (SHM) of sustainable concretes. The study concludes that while the use of E-waste in concrete contributes positively to sustainability, it may compromise long-term durability in aggressive environments. However, the integration of EPS and EMI offers a reliable, non-destructive, and sensitive technique for real-time corrosion monitoring, supporting preventive maintenance and improved infrastructure longevity. Full article
Show Figures

Figure 1

17 pages, 7597 KiB  
Article
Screen-Printed 1 × 4 Quasi-Yagi-Uda Antenna Array on Highly Flexible Transparent Substrate for the Emerging 5G Applications
by Matthieu Egels, Anton Venouil, Chaouki Hannachi, Philippe Pannier, Mohammed Benwadih and Christophe Serbutoviez
Electronics 2025, 14(14), 2850; https://doi.org/10.3390/electronics14142850 - 16 Jul 2025
Viewed by 254
Abstract
In the Internet of Things (IoT) era, the demand for cost-effective, flexible, wearable antennas and circuits has been growing. Accordingly, screen-printing techniques are becoming more popular due to their lower costs and high-volume manufacturing. This paper presents and investigates a full-screen-printed 1 × [...] Read more.
In the Internet of Things (IoT) era, the demand for cost-effective, flexible, wearable antennas and circuits has been growing. Accordingly, screen-printing techniques are becoming more popular due to their lower costs and high-volume manufacturing. This paper presents and investigates a full-screen-printed 1 × 4 Quasi-Yagi-Uda antenna array on a high-transparency flexible Zeonor thin-film substrate for emerging 26 GHz band (24.25–27.55 GHz) 5G applications. As part of this study, screen-printing implementation rules are developed by properly managing ink layer thickness on a transparent flexible Zeonor thin-film dielectric to achieve a decent antenna array performance. In addition, a screen-printing repeatability study has been carried out through a performance comparison of 24 antenna array samples manufactured by our research partner from CEA-Liten Grenoble. Despite the challenging antenna array screen printing at higher frequencies, the measured results show a good antenna performance as anticipated from the traditional subtractive printed circuit board (PCB) manufacturing process using standard substrates. It shows a wide-band matched input impedance from 22–28 GHz (i.e., 23% of relative band-width) and a maximum realized gain of 12.8 dB at 27 GHz. Full article
Show Figures

Figure 1

29 pages, 8416 KiB  
Article
WSN-Based Multi-Sensor System for Structural Health Monitoring
by Fatih Dagsever, Zahra Sharif Khodaei and M. H. Ferri Aliabadi
Sensors 2025, 25(14), 4407; https://doi.org/10.3390/s25144407 - 15 Jul 2025
Viewed by 826
Abstract
Structural Health Monitoring (SHM) is an essential technique for continuously assessing structural conditions using integrated sensor systems during operation. SHM technologies have evolved to address the increasing demand for efficient maintenance strategies in advanced engineering fields, such as civil infrastructure, aerospace, and transportation. [...] Read more.
Structural Health Monitoring (SHM) is an essential technique for continuously assessing structural conditions using integrated sensor systems during operation. SHM technologies have evolved to address the increasing demand for efficient maintenance strategies in advanced engineering fields, such as civil infrastructure, aerospace, and transportation. However, developing a miniaturized, cost-effective, and multi-sensor solution based on Wireless Sensor Networks (WSNs) remains a significant challenge, particularly for SHM applications in weight-sensitive aerospace structures. To address this, the present study introduces a novel WSN-based Multi-Sensor System (MSS) that integrates multiple sensing capabilities onto a 3 × 3 cm flexible Printed Circuit Board (PCB). The proposed system combines a Piezoelectric Transducer (PZT) for impact detection; a strain gauge for mechanical deformation monitoring; an accelerometer for capturing dynamic responses; and an environmental sensor measuring temperature, pressure, and humidity. This high level of functional integration, combined with real-time Data Acquisition (DAQ) and precise time synchronization via Bluetooth Low Energy (LE), distinguishes the proposed MSS from conventional SHM systems, which are typically constrained by bulky hardware, single sensing modalities, or dependence on wired communication. Experimental evaluations on composite panels and aluminum specimens demonstrate reliable high-fidelity recording of PZT signals, strain variations, and acceleration responses, matching the performance of commercial instruments. The proposed system offers a low-power, lightweight, and scalable platform, demonstrating strong potential for on-board SHM in aircraft applications. Full article
Show Figures

Figure 1

21 pages, 7071 KiB  
Article
An Experimental Investigation into the Performance of Concrete and Mortar with Partial Replacement of Fine Aggregate by Printed Circuit Board (PCB) E-Waste
by Srinivasan Krishnan, Sai Gopal Krishna Bhagavatula, Jayanarayanan Karingamanna and Mini K. Madhavan
Recycling 2025, 10(4), 138; https://doi.org/10.3390/recycling10040138 - 12 Jul 2025
Viewed by 245
Abstract
The increasing accumulation of E-waste presents significant environmental challenges, particularly its disposal and resource management. The present study investigates the potential of printed circuit boards (PCBs) as a partial replacement for fine aggregates in cement mortar and concrete. The replacement levels of PCBs [...] Read more.
The increasing accumulation of E-waste presents significant environmental challenges, particularly its disposal and resource management. The present study investigates the potential of printed circuit boards (PCBs) as a partial replacement for fine aggregates in cement mortar and concrete. The replacement levels of PCBs ranged from 0 to 35 wt% in cement mortar and from 0 to 30 wt% in concrete, aiming to improve the qualities of both mixes. The specimens were cured for 7 and 28 days, respectively, followed by tests to evaluate the flowability and static mechanical properties. The performance of the developed mortar/concrete was analyzed under aggressive environmental conditions by conducting various durability tests. Properties such as acoustic and thermal conductivity were also evaluated to check the suitability of the developed material for its multifunctionality. Test results revealed that the optimal replacement percentages of fine aggregate by PCBs in mortar and concrete mixes were 25 wt% and 20 wt%, respectively. A decline in mechanical properties was observed after a further increase in replacement level. The results demonstrate the feasibility of E-waste integration in cement and mortar as a sustainable waste management solution. Full article
Show Figures

Figure 1

36 pages, 2877 KiB  
Article
Dual-Oriented Targeted Nanostructured SERS Label-Free Immunosensor for Detection, Quantification, and Analysis of Breast Cancer Biomarker Concentrations in Blood Serum
by Mohammad E. Khosroshahi, Christine Gaoiran, Vithurshan Umashanker, Hayagreev Veeru and Pranav Panday
Biosensors 2025, 15(7), 447; https://doi.org/10.3390/bios15070447 - 11 Jul 2025
Viewed by 361
Abstract
In clinical applications of surface-enhanced Raman spectroscopy (SERS) immunosensors, accurately determining analyte biomarker concentrations is essential. This study presents a non-invasive approach for quantifying various breast cancer biomarkers—including human epidermal growth factor receptor II (HER-II) (2+, 3+ (I), 3+ (II), 3+ (III), and [...] Read more.
In clinical applications of surface-enhanced Raman spectroscopy (SERS) immunosensors, accurately determining analyte biomarker concentrations is essential. This study presents a non-invasive approach for quantifying various breast cancer biomarkers—including human epidermal growth factor receptor II (HER-II) (2+, 3+ (I), 3+ (II), 3+ (III), and positive IV) and CA 15-3—using a directional, plasmonically active, label-free SERS sensor. Each stage of sensor functionalization, conjugation, and biomarker interaction was verified by UV–Vis spectroscopy. Atomic force microscopy (AFM) characterized the morphology of gold nanourchin (GNU)-immobilized printed circuit board (PCB) substrates. An enhancement factor of ≈ 0.5 × 105 was achieved using Rhodamine 6G as the probe molecule. Calibration curves were initially established using standard HER-II solutions at concentrations ranging from 1 to 100 ng/mL and CA 15-3 at concentrations from 10 to 100 U/mL. The SERS signal intensities in the 620–720 nm region were plotted against concentration, yielding linear sensitivity with R2 values of 0.942 and 0.800 for HER-II and CA15-3, respectively. The same procedure was applied to breast cancer serum (BCS) samples, allowing unknown biomarker concentrations to be determined based on the corresponding calibration curves. SERS data were processed using the filtfilt filter from scipy.signal for smoothing and then baseline-corrected with the Improved Asymmetric Least Squares (IASLS) algorithm from the pybaselines.Whittaker library. Principal Component Analysis (PCA) effectively distinguished the sample groups and revealed spectral differences before and after biomarker interactions. Key Raman peaks were attributed to functional groups including N–H (primary and secondary amines), C–H antisymmetric stretching, C–N (amines), C=O antisymmetric stretching, NH3+ (amines), carbohydrates, glycine, alanine, amides III, C=N stretches, and NH2 in primary amides. Full article
Show Figures

Figure 1

21 pages, 3406 KiB  
Article
ResNet-SE-CBAM Siamese Networks for Few-Shot and Imbalanced PCB Defect Classification
by Chao-Hsiang Hsiao, Huan-Che Su, Yin-Tien Wang, Min-Jie Hsu and Chen-Chien Hsu
Sensors 2025, 25(13), 4233; https://doi.org/10.3390/s25134233 - 7 Jul 2025
Viewed by 560
Abstract
Defect detection in mass production lines often involves small and imbalanced datasets, necessitating the use of few-shot learning methods. Traditional deep learning-based approaches typically rely on large datasets, limiting their applicability in real-world scenarios. This study explores few-shot learning models for detecting product [...] Read more.
Defect detection in mass production lines often involves small and imbalanced datasets, necessitating the use of few-shot learning methods. Traditional deep learning-based approaches typically rely on large datasets, limiting their applicability in real-world scenarios. This study explores few-shot learning models for detecting product defects using limited data, enhancing model generalization and stability. Unlike previous deep learning models that require extensive datasets, our approach effectively performs defect detection with minimal data. We propose a Siamese network that integrates Residual blocks, Squeeze and Excitation blocks, and Convolution Block Attention Modules (ResNet-SE-CBAM Siamese network) for feature extraction, optimized through triplet loss for embedding learning. The ResNet-SE-CBAM Siamese network incorporates two primary features: attention mechanisms and metric learning. The recently developed attention mechanisms enhance the convolutional neural network operations and significantly improve feature extraction performance. Meanwhile, metric learning allows for the addition or removal of feature classes without the need to retrain the model, improving its applicability in industrial production lines with limited defect samples. To further improve training efficiency with imbalanced datasets, we introduce a sample selection method based on the Structural Similarity Index Measure (SSIM). Additionally, a high defect rate training strategy is utilized to reduce the False Negative Rate (FNR) and ensure no missed defect detections. At the classification stage, a K-Nearest Neighbor (KNN) classifier is employed to mitigate overfitting risks and enhance stability in few-shot conditions. The experimental results demonstrate that with a good-to-defect ratio of 20:40, the proposed system achieves a classification accuracy of 94% and an FNR of 2%. Furthermore, when the number of defective samples increases to 80, the system achieves zero false negatives (FNR = 0%). The proposed metric learning approach outperforms traditional deep learning models, such as parametric-based YOLO series models in defect detection, achieving higher accuracy and lower miss rates, highlighting its potential for high-reliability industrial deployment. Full article
Show Figures

Figure 1

21 pages, 4010 KiB  
Article
PCES-YOLO: High-Precision PCB Detection via Pre-Convolution Receptive Field Enhancement and Geometry-Perception Feature Fusion
by Heqi Yang, Junming Dong, Cancan Wang, Zhida Lian and Hui Chang
Appl. Sci. 2025, 15(13), 7588; https://doi.org/10.3390/app15137588 - 7 Jul 2025
Viewed by 356
Abstract
Printed circuit board (PCB) defect detection faces challenges like small target feature loss and severe background interference. To address these issues, this paper proposes PCES-YOLO, an enhanced YOLOv11-based model. First, a developed Pre-convolution Receptive Field Enhancement (PRFE) module replaces C3k in the C3k2 [...] Read more.
Printed circuit board (PCB) defect detection faces challenges like small target feature loss and severe background interference. To address these issues, this paper proposes PCES-YOLO, an enhanced YOLOv11-based model. First, a developed Pre-convolution Receptive Field Enhancement (PRFE) module replaces C3k in the C3k2 module. The ConvNeXtBlock with inverted bottleneck is introduced in the P4 layer, greatly improving small-target feature capture and semantic understanding. The second key innovation lies in the creation of the Efficient Feature Fusion and Aggregation Network (EFAN), which integrates a lightweight Spatial-Channel Decoupled Downsampling (SCDown) module and three innovative fusion pathways. This achieves substantial parameter reduction while effectively integrating shallow detail features with deep semantic features, preserving critical defect information across different feature levels. Finally, the Shape-IoU loss function is incorporated, focusing on bounding box shape and scale for more accurate regression and enhanced defect localization precision. Experiments on the enhanced Peking University PCB defect dataset show that PCES-YOLO achieves a mAP50 of 97.3% and a mAP50–95 of 77.2%. Compared to YOLOv11n, it shows improvements of 3.6% in mAP50 and 15.2% in mAP50–95. When compared to YOLOv11s, it increases mAP50 by 1.0% and mAP50–95 by 5.6% while also significantly reducing the model parameters. The performance of PCES-YOLO is also evaluated against mainstream object detection algorithms, including Faster R-CNN, SSD, YOLOv8n, etc. These results indicate that PCES-YOLO outperforms these algorithms in terms of detection accuracy and efficiency, making it a promising high-precision and efficient solution for PCB defect detection in industrial settings. Full article
(This article belongs to the Section Computing and Artificial Intelligence)
Show Figures

Figure 1

20 pages, 6286 KiB  
Article
Near-Field Microwave Sensing for Chip-Level Tamper Detection
by Maryam Saadat Safa and Shahin Tajik
Sensors 2025, 25(13), 4188; https://doi.org/10.3390/s25134188 - 5 Jul 2025
Viewed by 362
Abstract
Stealthy chip-level tamper attacks, such as hardware Trojan insertions or security-critical circuit modifications, can threaten modern microelectronic systems’ security. While traditional inspection and side-channel methods offer potential for tamper detection, they may not reliably detect all forms of attacks and often face practical [...] Read more.
Stealthy chip-level tamper attacks, such as hardware Trojan insertions or security-critical circuit modifications, can threaten modern microelectronic systems’ security. While traditional inspection and side-channel methods offer potential for tamper detection, they may not reliably detect all forms of attacks and often face practical limitations in terms of scalability, accuracy, or applicability. This work introduces a non-invasive, contactless tamper detection method employing a complementary split-ring resonator (CSRR). CSRRs, which are typically deployed for non-destructive material characterization, can be placed on the surface of the chip’s package to detect subtle variations in the impedance of the chip’s power delivery network (PDN) caused by tampering. The changes in the PDN’s impedance profile perturb the local electric near field and consequently affect the sensor’s impedance. These changes manifest as measurable variations in the sensor’s scattering parameters. By monitoring these variations, our approach enables robust and cost-effective physical integrity verification requiring neither physical contact with the chips or printed circuit board (PCB) nor activation of the underlying malicious circuits. To validate our claims, we demonstrate the detection of various chip-level tamper events on an FPGA manufactured with 28 nm technology. Full article
(This article belongs to the Special Issue Sensors in Hardware Security)
Show Figures

Figure 1

13 pages, 3217 KiB  
Article
Geometry-Optimized VoltagePlanar Sensors Integrated into PCBs
by Nicolas E. Gonzalez, Joshua Cooper and Jane Lehr
Eng 2025, 6(7), 144; https://doi.org/10.3390/eng6070144 - 1 Jul 2025
Viewed by 247
Abstract
The recent advancements in high-frequency, high-power switching devices require the development of non-invasive, cost-effective sensors for signal diagnostics. In this context, planar sensors have emerged as promising candidates for voltage and current sensing due to their compatibility with printed circuit boards (PCBs). However, [...] Read more.
The recent advancements in high-frequency, high-power switching devices require the development of non-invasive, cost-effective sensors for signal diagnostics. In this context, planar sensors have emerged as promising candidates for voltage and current sensing due to their compatibility with printed circuit boards (PCBs). However, previously proposed voltage planar sensors exhibit trade-offs between high bandwidths and responsivity, limiting their usage to sub-GHz applications. This study introduces a planar voltage sensor that leverages geometric optimization using software-assisted design to enhance bandwidth without compromising sensitivity. The optimized sensors demonstrate an extended bandwidth response up to 4 GHz and accurate recovery of fast transient signals validated through experimental measurements, which represents a significant step forward in broadband sensing for high-power applications. Full article
(This article belongs to the Section Electrical and Electronic Engineering)
Show Figures

Figure 1

Back to TopTop