Sign in to use this feature.

Years

Between: -

Subjects

remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline

Journals

remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline

Article Types

Countries / Regions

remove_circle_outline
remove_circle_outline
remove_circle_outline
remove_circle_outline

Search Results (960)

Search Parameters:
Keywords = MEMS devices

Order results
Result details
Results per page
Select all
Export citation of selected articles as:
15 pages, 5506 KiB  
Article
Polyimide-Based Flexible Microelectrode Array for Non-Invasive Transcorneal Electrical Stimulation
by Víctor Manuel Carpio-Verdín, Natiely Hernández-Sebastián, Bernardino Barrientos-García, Silvia Solis-Ortiz, Erik R. Bojorges-Valdez, Francisco López-Huerta, Carlos Ismael Mares-Castro and Wilfrido Calleja-Arriaga
Sensors 2025, 25(16), 5198; https://doi.org/10.3390/s25165198 - 21 Aug 2025
Viewed by 20
Abstract
Transcorneal electrical stimulation (TES) is a promising treatment for several retinal degenerative diseases (RDDs). TES involves the application of a controlled electrical current to the anterior surface of the cornea, aimed at activating the retina and posterior ocular structures. Dawson–Trick–Litzkow (DTL) and ERG-JET [...] Read more.
Transcorneal electrical stimulation (TES) is a promising treatment for several retinal degenerative diseases (RDDs). TES involves the application of a controlled electrical current to the anterior surface of the cornea, aimed at activating the retina and posterior ocular structures. Dawson–Trick–Litzkow (DTL) and ERG-JET electrodes are among the most widely used for TES. However, their continuous metallic surface design limits spatial resolution and the ability to perform selective ES. In this work, we present the development of a transcorneal electrical stimulation (TES) electrode that, unlike conventional electrodes, enables spatially selective TES. The proposed electrode design consists of an array of 20 independent microelectrodes distributed across the central and paracentral regions of the cornea. The fabrication process combines surface micromachining and flexible electronics technologies, employing only three structural materials: aluminum (Al), titanium (Ti), and polyimide (PI). This material selection is critical for achieving a simplified, reproducible, and low-cost fabrication process. The fabricated electrode was validated through electrical and electrochemical testing. The results show a relatively high electrical conductivity of Al/Ti structures, low electrochemical impedance values—ranging from 791 kΩ to 1.75 MΩ for the clinically relevant frequency range (11 to 30 Hz)—and a high charge storage capacity of 1437 mC/cm2. The electrode capacity for electrical signal transmission was demonstrated through in vitro testing. Finally, the applicability of the TES electrode for electroretinogram (ERG) recording was evaluated by measuring its optical transmittance across the visible wavelength range. Full article
Show Figures

Figure 1

29 pages, 688 KiB  
Review
Heart Failure Readmission Prevention Strategies—A Comparative Review of Medications, Devices, and Other Interventions
by Remzi Oguz Baris and Corey E. Tabit
J. Clin. Med. 2025, 14(16), 5894; https://doi.org/10.3390/jcm14165894 - 21 Aug 2025
Viewed by 36
Abstract
Heart failure readmissions remain a major challenge for healthcare systems, contributing significantly to morbidity, mortality, and increased healthcare costs. Despite advancements in medical and device-based therapies, rehospitalization rates remain high, particularly within the first 30 days of discharge. This review aims to evaluate [...] Read more.
Heart failure readmissions remain a major challenge for healthcare systems, contributing significantly to morbidity, mortality, and increased healthcare costs. Despite advancements in medical and device-based therapies, rehospitalization rates remain high, particularly within the first 30 days of discharge. This review aims to evaluate the primary factors associated with HF readmissions and discuss evidence-based strategies to reduce these rates. The review examines the efficacy of pharmacological therapies and their impact on readmission rates, highlighting key interventions such as diuretics, beta-blockers, ACE inhibitors, ARBs, ARNIs, SGLT2 inhibitors, and intravenous iron supplementation. Additionally, device-based interventions, including CardioMEMS, LVADs, CRT-P/D, ICDs, Furoscix, and the ReDS vest, are critically evaluated for their role in the early detection and management of decompensation. Non-pharmacological strategies are also underscored, such as dietary modifications, exercise, cardiac rehabilitation, and structured follow-up programs. By synthesizing current evidence, this review provides a comprehensive analysis of heart failure readmission factors and proposes multidisciplinary, patient-centered strategies to improve outcomes and reduce hospitalizations. Full article
(This article belongs to the Special Issue Clinical Management of Patients with Heart Failure—2nd Edition)
Show Figures

Figure 1

43 pages, 3473 KiB  
Review
Biochips on the Move: Emerging Trends in Wearable and Implantable Lab-on-Chip Health Monitors
by Nikolay L. Kazanskiy, Pavel A. Khorin and Svetlana N. Khonina
Electronics 2025, 14(16), 3224; https://doi.org/10.3390/electronics14163224 - 14 Aug 2025
Viewed by 703
Abstract
Wearable and implantable Lab-on-Chip (LoC) biosensors are revolutionizing healthcare by enabling continuous, real-time monitoring of physiological and biochemical parameters in non-clinical settings. These miniaturized platforms integrate sample handling, signal transduction, and data processing on a single chip, facilitating early disease detection, personalized treatment, [...] Read more.
Wearable and implantable Lab-on-Chip (LoC) biosensors are revolutionizing healthcare by enabling continuous, real-time monitoring of physiological and biochemical parameters in non-clinical settings. These miniaturized platforms integrate sample handling, signal transduction, and data processing on a single chip, facilitating early disease detection, personalized treatment, and preventive care. This review comprehensively explores recent advancements in LoC biosensing technologies, emphasizing their application in skin-mounted patches, smart textiles, and implantable devices. Key innovations in biocompatible materials, nanostructured transducers, and flexible substrates have enabled seamless integration with the human body, while fabrication techniques such as soft lithography, 3D printing, and MEMS have accelerated development. The incorporation of nanomaterials significantly enhances sensitivity and specificity, supporting multiplexed and multi-modal sensing. We examine critical application domains, including glucose monitoring, cardiovascular diagnostics, and neurophysiological assessment. Design considerations related to biocompatibility, power management, data connectivity, and long-term stability are also discussed. Despite promising outcomes, challenges such as biofouling, signal drift, regulatory hurdles, and public acceptance remain. Future directions focus on autonomous systems powered by AI, hybrid wearable–implantable platforms, and wireless energy harvesting. This review highlights the transformative potential of LoC biosensors in shaping the future of smart, patient-centered healthcare through continuous, minimally invasive monitoring. Full article
(This article belongs to the Special Issue Lab-on-Chip Biosensors)
Show Figures

Figure 1

64 pages, 20332 KiB  
Review
Reviewing a Decade of Structural Health Monitoring in Footbridges: Advances, Challenges, and Future Directions
by JP Liew, Maria Rashidi, Khoa Le, Ali Matin Nazar and Ehsan Sorooshnia
Remote Sens. 2025, 17(16), 2807; https://doi.org/10.3390/rs17162807 - 13 Aug 2025
Viewed by 271
Abstract
Aging infrastructure is a growing concern worldwide, with many bridges exceeding 50 years of service, prompting questions about their structural integrity. Over the past decade, the deterioration of bridges has driven extensive research into Structural Health Monitoring (SHM), a tool for early detection [...] Read more.
Aging infrastructure is a growing concern worldwide, with many bridges exceeding 50 years of service, prompting questions about their structural integrity. Over the past decade, the deterioration of bridges has driven extensive research into Structural Health Monitoring (SHM), a tool for early detection of structural deterioration, with particular emphasis on remote-sensing technologies. This review combines a scientometric analysis and a state-of-the-art review to assess recent advancements in the field. From a dataset of 702 publications (2014–2024), 171 relevant papers were analyzed, covering key SHM aspects including sensing devices, data acquisition, processing, damage detection, and reporting. Results show a 433% increase in publications, with the United States leading in output (28.65%), and Glisic, B., with collaborators forming the largest research cluster (11.7%). Accelerometers are the most commonly used sensors (50.88%), and data processing dominates the research focus (50.29%). Key challenges identified include cost (noted in 17.5% of studies), data corruption, and WSN limitations, particularly energy supply. Trends show a notable growth in AI applications (400%), and increasing interest in low-cost, crowdsource-based SHM using smartphones, MEMS, and cameras. These findings highlight both progress and future opportunities in SHM of footbridges. Full article
Show Figures

Figure 1

23 pages, 3226 KiB  
Article
Advanced Flow Detection Cell for SPEs for Enhancing In Situ Water Monitoring of Trace Levels of Cadmium
by Giulia Mossotti, Davide Girelli, Matilde Aronne, Giulio Galfré, Andrea Piscitelli, Luciano Scaltrito, Sergio Ferrero and Valentina Bertana
Water 2025, 17(16), 2384; https://doi.org/10.3390/w17162384 - 12 Aug 2025
Viewed by 381
Abstract
An advanced anodic stripping voltammetry (ASV)-based Micro Electro Mechanical System (MEMS) sensor for cadmium (Cd) detection is presented in this study, which is cost-effective and efficient for in situ water monitoring, providing a crucial early warning mechanism, streamlining environmental monitoring, and facilitating timely [...] Read more.
An advanced anodic stripping voltammetry (ASV)-based Micro Electro Mechanical System (MEMS) sensor for cadmium (Cd) detection is presented in this study, which is cost-effective and efficient for in situ water monitoring, providing a crucial early warning mechanism, streamlining environmental monitoring, and facilitating timely intervention to safeguard public health and environmental safety. The rationale behind this work is to address the critical need for an in situ monitoring system for cadmium (Cd) in freshwater sources, particularly those adjacent to agricultural fields. Cd(II) is a highly toxic heavy metal that poses a significant threat to agricultural ecosystems and human health due to its rapid bioaccumulation in plants and subsequent entry into the food chain. The developed analytic device is composed of a commercial mercury salt-modified graphite screen-printed electrode (SPE) with a custom-designed innovative polydimethylsiloxane (PDMS) flow detection cell. The flow cell was prototyped using 3D printing and replica moulding, with its design and performance validated through COMSOL Multiphysics simulations to optimize inflow conditions and ensure maximum analyte dispersion on the working electrode surface. Chemical detection was performed using square wave voltammetry, demonstrating a linear response for Cd(II) concentrations of 0 to 20 µg/L. The system exhibited robust analytical performance, enabling 25–30 daily analyses with consistent sensitivity within the Limit of Detection (LoD) set by the law of 3 µg/L. Full article
Show Figures

Figure 1

16 pages, 2030 KiB  
Article
Study on Comb-Drive MEMS Acceleration Sensor Used for Medical Purposes: Monitoring of Balance Disorders
by Michał Szermer and Jacek Nazdrowicz
Electronics 2025, 14(15), 3033; https://doi.org/10.3390/electronics14153033 - 30 Jul 2025
Viewed by 422
Abstract
This article presents a comprehensive modeling and simulation framework for a capacitive MEMS accelerometer integrated with a sigma-delta analog-to-digital converter (ADC), with a focus on applications in wearable health and motion monitoring devices. The accelerometer used in the system is connected to a [...] Read more.
This article presents a comprehensive modeling and simulation framework for a capacitive MEMS accelerometer integrated with a sigma-delta analog-to-digital converter (ADC), with a focus on applications in wearable health and motion monitoring devices. The accelerometer used in the system is connected to a smartphone equipped with dedicated software and will be used to assess the risk of falling, which is crucial for patients with balance disorders. The authors designed the accelerometer with special attention paid to the specification required in a system, where the acceleration is ±2 g and the frequency is 100 Hz. They investigated the sensor’s behavior in the DC, AC, and time domains, capturing both the mechanical response of the proof mass and the resulting changes in output capacitance due to external acceleration. A key component of the simulation is the implementation of a second-order sigma-delta modulator designed to digitize the small capacitance variations generated by the sensor. The Simulink model includes the complete signal path from analog input to quantization, filtering, decimation, and digital-to-analog reconstruction. By combining MEMS+ modeling with MATLAB-based system-level simulations, the workflow offers a fast and flexible alternative to traditional finite element methods and facilitates early-stage design optimization for MEMS sensor systems intended for real-world deployment. Full article
(This article belongs to the Special Issue Wearable Sensors for Human Position, Attitude and Motion Tracking)
Show Figures

Figure 1

19 pages, 5970 KiB  
Article
Interface Material Modification to Enhance the Performance of a Thin-Film Piezoelectric-on-Silicon (TPoS) MEMS Resonator by Localized Annealing Through Joule Heating
by Adnan Zaman, Ugur Guneroglu, Abdulrahman Alsolami, Liguan Li and Jing Wang
Micromachines 2025, 16(8), 885; https://doi.org/10.3390/mi16080885 - 29 Jul 2025
Viewed by 370
Abstract
This paper presents a novel approach employing localized annealing through Joule heating to enhance the performance of Thin-Film Piezoelectric-on-Silicon (TPoS) MEMS resonators that are crucial for applications in sensing, energy harvesting, frequency filtering, and timing control. Despite recent advancements, piezoelectric MEMS resonators still [...] Read more.
This paper presents a novel approach employing localized annealing through Joule heating to enhance the performance of Thin-Film Piezoelectric-on-Silicon (TPoS) MEMS resonators that are crucial for applications in sensing, energy harvesting, frequency filtering, and timing control. Despite recent advancements, piezoelectric MEMS resonators still suffer from anchor-related energy losses and limited quality factors (Qs), posing significant challenges for high-performance applications. This study investigates interface modification to boost the quality factor (Q) and reduce the motional resistance, thus improving the electromechanical coupling coefficient and reducing insertion loss. To balance the trade-off between device miniaturization and performance, this work uniquely applies DC current-induced localized annealing to TPoS MEMS resonators, facilitating metal diffusion at the interface. This process results in the formation of platinum silicide, modifying the resonator’s stiffness and density, consequently enhancing the acoustic velocity and mitigating the side-supporting anchor-related energy dissipations. Experimental results demonstrate a Q-factor enhancement of over 300% (from 916 to 3632) and a reduction in insertion loss by more than 14 dB, underscoring the efficacy of this method for reducing anchor-related dissipations due to the highest annealing temperature at the anchors. The findings not only confirm the feasibility of Joule heating for interface modifications in MEMS resonators but also set a foundation for advancements of this post-fabrication thermal treatment technology. Full article
(This article belongs to the Special Issue MEMS Nano/Micro Fabrication, 2nd Edition)
Show Figures

Figure 1

18 pages, 2661 KiB  
Article
Resonator Width Optimization for Enhanced Performance and Bonding Reliability in Wideband RF MEMS Filter
by Gwanil Jeon, Minho Jeong, Shungmoon Lee, Youngjun Jo and Nam-Seog Kim
Micromachines 2025, 16(8), 878; https://doi.org/10.3390/mi16080878 - 29 Jul 2025
Viewed by 260
Abstract
This research investigates resonator width optimization for simultaneously enhancing electrical performance and mechanical reliability in wideband RF MEMS filters through systematic evaluation of three configurations: 0% (L1), 60% (L2), and 100% (L3) matching ratios between cap and bottom wafers using Au-Au thermocompression bonding. [...] Read more.
This research investigates resonator width optimization for simultaneously enhancing electrical performance and mechanical reliability in wideband RF MEMS filters through systematic evaluation of three configurations: 0% (L1), 60% (L2), and 100% (L3) matching ratios between cap and bottom wafers using Au-Au thermocompression bonding. The study demonstrates that resonator width alignment significantly influences both electromagnetic field coupling and bonding interface integrity. The L3 configuration with complete width matching achieved optimal RF performance, demonstrating 3.34 dB insertion loss across 4.5 GHz bandwidth (25% fractional bandwidth), outperforming L2 (3.56 dB) and L1 (3.10 dB), while providing enhanced electromagnetic wave coupling and minimized contact resistance. Mechanical reliability testing revealed superior bonding strength for the L3 configuration, withstanding up to 7.14 Kgf in shear pull tests, significantly exceeding L1 (4.22 Kgf) and L2 (2.24 Kgf). SEM analysis confirmed uniform bonding interfaces with minimal void formation (~180 nm), while Q-factor measurements showed L3 achieved optimal loaded Q-factor (QL = 3.31) suitable for wideband operation. Comprehensive environmental testing, including thermal cycling (−50 °C to +145 °C) and humidity exposure per MIL-STD-810E standards, validated long-term stability across all configurations. This investigation establishes that complete resonator width matching between cap and bottom wafers optimizes both electromagnetic performance and mechanical bonding reliability, providing a validated framework for developing high-performance, reliable RF MEMS devices for next-generation communication, radar, and sensing applications. Full article
(This article belongs to the Special Issue CMOS-MEMS Fabrication Technologies and Devices, 2nd Edition)
Show Figures

Figure 1

14 pages, 966 KiB  
Article
Investigation of the Thermal Conductance of MEMS Contact Switches
by Zhiqiang Chen and Zhongbin Xie
Micromachines 2025, 16(8), 872; https://doi.org/10.3390/mi16080872 - 28 Jul 2025
Viewed by 354
Abstract
Microelectromechanical system (MEMS) devices are specialized electronic devices that integrate the benefits of both mechanical and electrical structures. However, the contact behavior between the interfaces of these structures can significantly impact the performance of MEMS devices, particularly when the surface roughness approaches the [...] Read more.
Microelectromechanical system (MEMS) devices are specialized electronic devices that integrate the benefits of both mechanical and electrical structures. However, the contact behavior between the interfaces of these structures can significantly impact the performance of MEMS devices, particularly when the surface roughness approaches the characteristic size of the devices. In such cases, the contact between the interfaces is not a perfect face-to-face interaction but occurs through point-to-point contact. As a result, the contact area changes with varying contact pressures and surface roughness, influencing the thermal and electrical performance. By integrating the CMY model with finite element simulations, we systematically explored the thermal conductance regulation mechanism of MEMS contact switches. We analyzed the effects of the contact pressure, micro-hardness, surface roughness, and other parameters on thermal conductance, providing essential theoretical support for enhancing reliability and optimizing thermal management in MEMS contact switches. We examined the thermal contact, gap, and joint conductance of an MEMS switch under different contact pressures, micro-hardness values, and surface roughness levels using the CMY model. Our findings show that both the thermal contact and gap conductance increase with higher contact pressure. For a fixed contact pressure, the thermal contact conductance decreases with rising micro-hardness and root mean square (RMS) surface roughness but increases with a higher mean asperity slope. Notably, the thermal gap conductance is considerably lower than the thermal contact conductance. Full article
Show Figures

Figure 1

24 pages, 74760 KiB  
Article
The Application of Mobile Devices for Measuring Accelerations in Rail Vehicles: Methodology and Field Research Outcomes in Tramway Transport
by Michał Urbaniak, Jakub Myrcik, Martyna Juda and Jan Mandrysz
Sensors 2025, 25(15), 4635; https://doi.org/10.3390/s25154635 - 26 Jul 2025
Viewed by 562
Abstract
Unbalanced accelerations occurring during tram travel have a significant impact on passenger comfort and safety, as well as on the rate of wear and tear on infrastructure and rolling stock. Ideally, these dynamic forces should be monitored continuously in real-time; however, traditional systems [...] Read more.
Unbalanced accelerations occurring during tram travel have a significant impact on passenger comfort and safety, as well as on the rate of wear and tear on infrastructure and rolling stock. Ideally, these dynamic forces should be monitored continuously in real-time; however, traditional systems require high-precision accelerometers and proprietary software—investments often beyond the reach of municipally funded tram operators. To this end, as part of the research project “Accelerometer Measurements in Rail Passenger Transport Vehicles”, pilot measurement campaigns were conducted in Poland on tram lines in Gdańsk, Toruń, Bydgoszcz, and Olsztyn. Off-the-shelf smartphones equipped with MEMS accelerometers and GPS modules, running the Physics Toolbox Sensor Suite Pro app, were used. Although the research employs widely known methods, this paper addresses part of the gap in affordable real-time monitoring by demonstrating that, in the future, equipment equipped solely with consumer-grade MEMS accelerometers can deliver sufficiently accurate data in applications where high precision is not critical. This paper presents an analysis of a subset of results from the Gdańsk tram network. Lateral (x) and vertical (z) accelerations were recorded at three fixed points inside two tram models (Pesa 128NG Jazz Duo and Düwag N8C), while longitudinal accelerations were deliberately omitted at this stage due to their strong dependence on driver behavior. Raw data were exported as CSV files, processed and analyzed in R version 4.2.2, and then mapped spatially using ArcGIS cartograms. Vehicle speed was calculated both via the haversine formula—accounting for Earth’s curvature—and via a Cartesian approximation. Over the ~7 km route, both methods yielded virtually identical results, validating the simpler approach for short distances. Acceleration histograms approximated Gaussian distributions, with most values between 0.05 and 0.15 m/s2, and extreme values approaching 1 m/s2. The results demonstrate that low-cost mobile devices, after future calibration against certified accelerometers, can provide sufficiently rich data for ride-comfort assessment and show promise for cost-effective condition monitoring of both track and rolling stock. Future work will focus on optimizing the app’s data collection pipeline, refining standard-based analysis algorithms, and validating smartphone measurements against benchmark sensors. Full article
(This article belongs to the Collection Sensors and Actuators for Intelligent Vehicles)
Show Figures

Figure 1

12 pages, 5844 KiB  
Article
Through Silicon MEMS Inspection with a Near-Infrared Laser Scanning Setup
by Manuel J. L. F. Rodrigues, Inês S. Garcia, Joana D. Santos, Filipa C. Mota, Filipe S. Alves and Diogo E. Aguiam
Sensors 2025, 25(15), 4627; https://doi.org/10.3390/s25154627 - 25 Jul 2025
Viewed by 311
Abstract
The inspection of encapsulated MEMS devices typically relies on destructive methods which compromise the structural integrity of samples. In this work, we present the concept and preliminary experimental validation of a laser scanning setup to non-destructively inspect silicon-encapsulated microstructures by measuring small variations [...] Read more.
The inspection of encapsulated MEMS devices typically relies on destructive methods which compromise the structural integrity of samples. In this work, we present the concept and preliminary experimental validation of a laser scanning setup to non-destructively inspect silicon-encapsulated microstructures by measuring small variations of transmitted light intensity in the near-infrared spectrum. This method does not require any particular sample preparation or damage, and it is based on the higher degree of transparency of silicon in the near-infrared and the transmission contrast resulting from the Fresnel reflections observed at the interfaces between the different materials of the MEMS device layers. We characterise the small feature resolving performance of the laser scanning setup using standard targets, and experimentally demonstrate the inspection of a MEMS latching device enclosed within silicon covers, comparing the contrast measurements with theoretical predictions. Full article
(This article belongs to the Special Issue Optical Sensors for Industry Applications)
Show Figures

Graphical abstract

23 pages, 3210 KiB  
Article
Design and Optimization of Intelligent High-Altitude Operation Safety System Based on Sensor Fusion
by Bohan Liu, Tao Gong, Tianhua Lei, Yuxin Zhu, Yijun Huang, Kai Tang and Qingsong Zhou
Sensors 2025, 25(15), 4626; https://doi.org/10.3390/s25154626 - 25 Jul 2025
Viewed by 369
Abstract
In the field of high-altitude operations, the frequent occurrence of fall accidents is usually closely related to safety measures such as the incorrect use of safety locks and the wrong installation of safety belts. At present, the manual inspection method cannot achieve real-time [...] Read more.
In the field of high-altitude operations, the frequent occurrence of fall accidents is usually closely related to safety measures such as the incorrect use of safety locks and the wrong installation of safety belts. At present, the manual inspection method cannot achieve real-time monitoring of the safety status of the operators and is prone to serious consequences due to human negligence. This paper designs a new type of high-altitude operation safety device based on the STM32F103 microcontroller. This device integrates ultra-wideband (UWB) ranging technology, thin-film piezoresistive stress sensors, Beidou positioning, intelligent voice alarm, and intelligent safety lock. By fusing five modes, it realizes the functions of safety status detection and precise positioning. It can provide precise geographical coordinate positioning and vertical ground distance for the workers, ensuring the safety and standardization of the operation process. This safety device adopts multi-modal fusion high-altitude operation safety monitoring technology. The UWB module adopts a bidirectional ranging algorithm to achieve centimeter-level ranging accuracy. It can accurately determine dangerous heights of 2 m or more even in non-line-of-sight environments. The vertical ranging upper limit can reach 50 m, which can meet the maintenance height requirements of most transmission and distribution line towers. It uses a silicon carbide MEMS piezoresistive sensor innovatively, which is sensitive to stress detection and resistant to high temperatures and radiation. It builds a Beidou and Bluetooth cooperative positioning system, which can achieve centimeter-level positioning accuracy and an identification accuracy rate of over 99%. It can maintain meter-level positioning accuracy of geographical coordinates in complex environments. The development of this safety device can build a comprehensive and intelligent safety protection barrier for workers engaged in high-altitude operations. Full article
(This article belongs to the Section Electronic Sensors)
Show Figures

Figure 1

15 pages, 6406 KiB  
Communication
Design and Static Analysis of MEMS-Actuated Silicon Nitride Waveguide Optical Switch
by Yan Xu, Tsen-Hwang Andrew Lin and Peiguang Yan
Micromachines 2025, 16(8), 854; https://doi.org/10.3390/mi16080854 - 25 Jul 2025
Viewed by 444
Abstract
This article aims to utilize a microelectromechanical system (MEMS) to modulate coupling behavior of silicon nitride (Si3N4) waveguides to perform an optical switch based on a directional coupling (DC) mechanism. There are two states of the switch. First state, [...] Read more.
This article aims to utilize a microelectromechanical system (MEMS) to modulate coupling behavior of silicon nitride (Si3N4) waveguides to perform an optical switch based on a directional coupling (DC) mechanism. There are two states of the switch. First state, a Si3N4 wire is initially positioned up suspended in the air. In the second state, this wire will be moved down to be placed between two arms of the DC waveguides, changing the coupling behavior to achieve bar and cross states of the optical switch function. In the future, the MEMS will be used to move this wire down. In this work, we present simulations of the two static states to optimize the DC structure parameters. Based on the simulated results, the device size is 8.8 μm × 55 μm. The insertion loss is calculated to be approximately 0.24 dB and 0.33 dB, the extinction ratio is approximately 24.70 dB and 25.46 dB, and the crosstalk is approximately −24.60 dB and −25.56 dB, respectively. In the C band of optical communication, the insertion loss ranges from 0.18 dB to 0.47 dB. As such, this device will exhibit excellent optical switch performance and provide advantages in many integrated optics-related optical systems applications. Furthermore, it can be used in optical communications, data centers, LiDAR, and so on, enhancing important reference value for such applications. Full article
Show Figures

Figure 1

18 pages, 4345 KiB  
Article
Single-Thermocouple Suspended Microfluidic Thermal Sensor with Improved Heat Retention for the Development of Multifunctional Biomedical Detection
by Lin Qin, Xiasheng Wang, Chenxi Wu, Yuan Ju, Hao Zhang, Xin Cheng, Yuanlin Xia, Cao Xia, Yubo Huang and Zhuqing Wang
Sensors 2025, 25(15), 4532; https://doi.org/10.3390/s25154532 - 22 Jul 2025
Viewed by 361
Abstract
Thermal sensors are widely used in medical, industrial and other fields, where the requirements for high sensitivity and portability continues to increase. Here we propose a suspended bridge structure fabricated using MEMS, which effectively shrinks the size and reduces heat loss. This study [...] Read more.
Thermal sensors are widely used in medical, industrial and other fields, where the requirements for high sensitivity and portability continues to increase. Here we propose a suspended bridge structure fabricated using MEMS, which effectively shrinks the size and reduces heat loss. This study reviews current sensor-related theories of heat conduction, convective heat transfer and thermal radiation. Heat loss models for suspended and non-suspended bridge structures are established, and finite element analysis is conducted to evaluate their thermal performance. The thermal performance of the suspended bridge structure is further validated through infrared temperature measurements on the manufactured sensor device. Theoretical calculations demonstrate that the proposed suspension bridge structure reduces heat loss by 88.64% compared with traditional designs. Benefiting from this improved heat retention, which was also confirmed by infrared thermography, the thermal sensor fabricated based on the suspension bridge structure achieves an ultra-high sensitivity of 0.38 V/W and a fast response time of less than 200 ms, indicating a high accuracy in thermal characterization. The correlation coefficient obtained for the sensor output voltage and input power of the sensor is approximately 1.0. Based on this design, multiple microfluidic channels with suspended bridge structures can be integrated to realize multi-component detection, which is important for the development of multifunctional biomedical detection. Full article
(This article belongs to the Section Biomedical Sensors)
Show Figures

Figure 1

22 pages, 1787 KiB  
Article
Buffer pH-Driven Electrokinetic Concentration of Proteins in a Straight Microfluidic Channel
by Diganta Dutta, Xavier Palmer, Debajit Chakraborty and Lanju Mei
Surfaces 2025, 8(3), 52; https://doi.org/10.3390/surfaces8030052 - 18 Jul 2025
Viewed by 459
Abstract
We present a buffer-pH-modulated electrokinetic concentration strategy in MEMS microchannels that harnesses simple pH shifts to neutralize and charge proteins, reversibly “pausing” them at a planar electric-gate electrode by tuning to their isoelectric point (pI) and mobilizing them with slight pH offsets under [...] Read more.
We present a buffer-pH-modulated electrokinetic concentration strategy in MEMS microchannels that harnesses simple pH shifts to neutralize and charge proteins, reversibly “pausing” them at a planar electric-gate electrode by tuning to their isoelectric point (pI) and mobilizing them with slight pH offsets under an applied field. This synergistic coupling of dynamic pH control and electrode-gated focusing, which requires only buffer composition changes, enables rapid and tunable protein capture and release across diverse channel geometries for lab-on-chip, preparative, and point-of-care diagnostics. Moreover, it dovetails with established MEMS biomedical platforms ranging from diagnostics to drug delivery and microsurgery to gene and cell-manipulation devices. Future work on tailored electrode coatings and optimized channel profiles will further boost selectivity, speed, and integration in sub-100 µm MEMS devices. Full article
Show Figures

Figure 1

Back to TopTop