Search Results (67)

The optical, electrical, and material properties of In–Zn–O (IZO) films were optimized by adjusting the deposition power and annealing temperature. Films deposited at 125 W and annealed at 300 °C exhibited the best performance, with the lowest resistivity (1.43 × 10⁻³ Ω·cm), highest mobility (11.12 cm²/V·s), and highest carrier concentration (4.61 × 10²⁰ cm⁻³). The average transmittance and optical energy gap were 82.57% and 3.372 eV, respectively. The electrical characteristics of amorphous In-Ga-Zn-O (a-IGZO) thin-film transistors (TFTs) using IZO source-drain (S–D) electrodes with various sputtering powers and annealing temperatures were investigated. The optimal sputtering power of 125 W and annealing temperature of 300 °C for the IZO S–D electrodes resulted in the highest field-effect mobility (~12.31 cm²/V·s) and on current (~2.09 × 10⁻⁶ A). This improvement is attributed to enhanced carrier concentration and mobility, which result from the high In/Zn ratio, the larger grain size, and low RMS roughness in the IZO films. The parasitic contact resistance (R_SD) and channel resistance (R_CH) were analyzed using the total resistance method. R_SD decreased with increasing IZO S–D sputtering power, while R_CH reached a minimum at 125 W. Both resistances decreased significantly as the annealing temperature increased from 200 °C to 300 °C. Full article

A two-step annealing treatment was applied on a fully transparent amorphous InGaZnO4 (a-IGZO) top-gate thin-film transistor (TG-TFT) to improve the device performance. The electrical properties and stabilities of a-IGZO TG TFTs were significantly improved as the first-annealing temperature increased from 150 °C to 350 °C with a 300 °C second-annealing treatment. The a-IGZO TG-TFT with the 300 °C first-annealing treatment demonstrated the overall best performance, which has a mobility of 13.05 cm²/(V·s), a threshold voltage (V_th) of 0.33 V, a subthreshold swing of 130 mV/dec, and a I_on/I_off of 1.73 × 10⁸. The V_th deviation (ΔV_th) was −0.032 V and −0.044 V, respectively, after a 7200 s positive and negative bias stress under the gate bias voltage V_G = ±3 V and V_D = 0.1 V. The Photoluminescence spectra results revealed that the distribution and the density of defects in a-IGZO films were changed after the first-annealing treatment, whereas the X-ray photoelectron spectroscopy results displayed that contents of the oxygen vacancy and Ga-O bond varied in annealed a-IGZO films. In addition, a-IGZO TG-TFTs had achieved a transmittance of over 90%. Research on the effects of the first-annealing treatment will contribute to the fabrication of highly stable top-gate TFTs in the fields of transparent flexible electronics. Full article

Inductively coupled plasma–reactive etching (ICP-RIE) of InGaZnO (IGZO) thin films was studied with variations in gas mixtures of hydrochloride (HCl) and argon (Ar). The dry etching characteristics of the IGZO films were investigated according to radiofrequency bias power, gas mixing ratio, and chamber pressure. The IGZO film showed an excellent etch rate of 83.2 nm/min from an optimized etching condition such as a plasma power of 100 W, process pressure of 3 mTorr, and HCl ratio of 75% (HCl:Ar at 30 sccm:10 sccm). In addition, this ICP-RIE etching condition with a high HCl composition ratio at a moderate RIE power of 100 W showed a low etched pattern skew and low photoresist damage on the IGZO patterns. It also provided excellent surface morphology of the SiO₂ film underneath after the entire dry etching of the IGZO layer. The IGZO thin film as an active layer was successfully patterned under the ICP-RIE dry etching under the HCl-Ar gas mixture, affording an excellent electrical characteristic in the resultant top-gate IGZO thin-film transistor. Full article

Uncrystallized indium-gallium-zinc-oxide (InGaZnO) thin-film transistors (TFTs) combined with an aluminum nitride (AlN) dielectric have been used to promote performance and steadiness. However, the high deposition temperature of AlN films limits their application in InGaZnO flexible TFTs. In this work, AlN layers were deposited via low-temperature plasma-enhanced atomic layer deposition (PEALD), and InGaZnO films were fabricated via high-power impulse magnetron sputtering (HIPIMS). The band alignment of the AlN/InGaZnO heterojunction was studied using the X-ray photoemission spectrum and ultraviolet visible transmittance spectrum. It was found that the AlN/InGaZnO system exhibited a staggered band alignment with a valence band offset ΔE_v of −1.25 ± 0.05 eV and a conduction band offset ΔE_c of 4.01 ± 0.05 eV. The results imply that PEALD AlN could be more useful for surface passivation than a gate dielectric to promote InGaZnO device reliability under atmospheric exposure. Full article

Amorphous indium gallium zinc oxide (a-IGZO) is becoming an increasingly important technological material. Transport in this material is conceptualized as the heavy disorder of the material causing a conduction or mobility band-edge that randomly varies and undulates in space across the entire system. Thus, transport is envisioned as being dominated by percolation physics as carriers traverse this varying band-edge landscape of “hills” and “valleys”. It is then something of a missed opportunity to model such a system using only a compact approach—despite this being the primary focus of the existing literature—as such a system can easily be faithfully reproduced as a true microscopic TCAD model with a real physically varying potential. Thus, in this work, we develop such a “microscopic” TCAD model of a-IGZO and detail a number of key aspects of its implementation. We then demonstrate that it can accurately reproduce experimental results and consider the issue of the addition of non-conducting band-tail states in a numerically efficient manner. Finally, two short studies of 3D effects are undertaken to illustrate the utility of the model: specifically, the cases of variation effects as a function of device size and as a function of surface roughness scattering. Full article

In this paper, the effect of a buffer layer created using different hydrogen-containing ratios of reactive gas on the electrical properties of a top-gate In-Ga-Zn-O thin-film transistor was thoroughly investigated. The interface roughness between the buffer layer and active layer was characterized using atomic force microscopy and X-ray reflection. The results obtained using Fourier transform infrared spectroscopy show that the hydrogen content of the buffer layer increases with the increase in the hydrogen content of the reaction gas. With the increase in the hydrogen-containing materials in the reactive gas, field effect mobility and negative bias illumination stress stability improve nearly twofold. The reasons for these results are explained using technical computer-aided design simulations. Full article

Defect annihilation of the IGZO/SiO₂ layer is of great importance to enhancing the bias stress stabilities of bottom-gate coplanar thin-film transistors (TFTs). The effects of annealing temperatures (T_a) on the structure of the IGZO/SiO₂ layer and the stabilities of coplanar IGZO TFTs were investigated in this work. An atomic depth profile showed that the IGZO/SiO₂ layer included an IGZO layer, an IGZO/SiO₂ interfacial mixing layer, and a SiO₂ layer. Higher T_a had only one effect on the IGZO layer and SiO₂ layer (i.e., strengthening chemical bonds), while it had complex effects on the interfacial mixing layer—including weakening M-O bonds (M: metallic elements in IGZO), strengthening damaged Si-O bonds, and increasing O-related defects (e.g., H₂O). At higher T_a, IGZO TFTs exhibited enhanced positive bias temperature stress (PBTS) stabilities but decreased negative bias temperature stress (NBTS) stabilities. The enhanced PBTS stabilities were correlated with decreased electron traps due to the stronger Si-O bonds near the interfacial layer. The decreased NBTS stabilities were related to increased electron de-trapping from donor-like defects (e.g., weak M-O bonds and H₂O) in the interfacial layer. Our results suggest that although higher T_a annihilated the structural damage at the interface from ion bombardment, it introduced undesirable defects. Therefore, to comprehensively improve electrical stabilities, controlling defect generation (e.g., by using a mild sputtering condition of source/drain electrodes and oxides) was more important than enhancing defect annihilation (e.g., through increasing T_a). Full article

Bottom-gate thin-film transistors (TFTs) with n-type amorphous indium-gallium-zinc oxide (a-IGZO) active channels and indium-tin oxide (ITO) source/drain electrodes were fabricated. Then, an ultraviolet (UV) nanosecond pulsed laser with a wavelength of 355 nm was scanned to locally anneal the active channel at various laser powers. After laser annealing, negative shifts in the threshold voltages and enhanced on-currents were observed at laser powers ranging from 54 to 120 mW. The energy band gap and work function of a-IGZO extracted from the transmittance and ultraviolet photoelectron spectroscopy (UPS) measurement data confirm that different energy band structures for the ITO electrode/a-IGZO channel were established depending on the laser annealing conditions. Based on these observations, the electron injection mechanism from ITO electrodes to a-IGZO channels was analyzed. The results show that the selective laser annealing process can improve the electrical performance of the a-IGZO TFTs without any thermal damage to the substrate. Full article

This study focuses on InGaZnO-based synaptic devices fabricated using reactive radiofrequency sputtering deposition with highly uniform and reliable multilevel memory states. Electron trapping and trap generation behaviors were examined based on current compliance adjustments and constant voltage stressing on the ITO/InGaZnO/ITO memristor. Using O₂ + N₂ plasma treatment resulted in stable and consistent cycle-to-cycle memory switching with an average memory window of ~95.3. Multilevel resistance states ranging from 0.68 to 140.7 kΩ were achieved by controlling the V_RESET within the range of −1.4 to −1.8 V. The modulation of synaptic weight for short-term plasticity was simulated by applying voltage pulses with increasing amplitudes after the formation of a weak conductive filament. To emulate several synaptic behaviors in InGaZnO-based memristors, variations in the pulse interval were used for paired-pulse facilitation and pulse frequency-dependent spike rate-dependent plasticity. Long-term potentiation and depression are also observed after strong conductive filaments form at higher current compliance in the switching layer. Hence, the ITO/InGaZnO/ITO memristor holds promise for high-performance synaptic device applications. Full article

The effect of the channel interface of top-gate InGaZnO (IGZO) thin film transistors (TFTs) on the electrical properties caused by exposure to various wet chemicals such as deionized water, photoresist (PR), and strippers during the photolithography process was studied. Contrary to the good electrical characteristics of TFTs including a protective layer (PL) to avoid interface damage by wet chemical processes, TFTs without PL showed a conductive behavior with a negative threshold voltage shift, in which the ratio of Ga and Zn on the IGZO top surface reduced due to exposure to a stripper. In addition, the wet process in photolithography increased oxygen vacancy and oxygen impurity on the IGZO surface. The photo-patterning process increased donor-like defects in IGZO due to organic contamination on the IGZO surface by PR, making the TFT characteristics more conductive. The introduction of ozone (O₃) annealing after photo-patterning and stripping of IGZO reduced the increased defect states on the surface of IGZO due to the wet process and effectively eliminated organic contamination by PR. In particular, by controlling surface oxygens on top of the IGZO surface excessively generated with O₃ annealing using UV irradiation of 185 and 254 nm, IGZO TFTs with excellent current–voltage characteristics and reliability could be realized comparable to IGZO TFTs containing PL. Full article

In this work, an electrical stability model based on surface potential is presented for amorphous In-Ga-Zn-O (a-IGZO) thin film transistors (TFTs) under positive-gate-bias stress (PBS) and light stress. In this model, the sub-gap density of states (DOSs) are depicted by exponential band tails and Gaussian deep states within the band gap of a-IGZO. Meanwhile, the surface potential solution is developed with the stretched exponential distribution relationship between the created defects and PBS time, and the Boltzmann distribution relationship between the generated traps and incident photon energy, respectively. The proposed model is verified using both the calculation results and experimental data of a-IGZO TFTs with various distribution of DOSs, and a consistent and accurate expression of the evolution of transfer curves is achieved under PBS and light illumination. Full article

An analytical surface-potential-based drain current model for amorphous indium–gallium–zinc–oxide (a-InGaZnO) thin film transistors (TFTs) is proposed by introducing an effective charge density approach in this paper. This approach gives two initial approximate values of the effective state density and the effective thermal voltage by using the dominant state of the free charge density in total charge density, and then obtains a high-precision one-exponent equivalent transformation for three-exponent total charge density. Based on this approach, we have solved the problem that the physical meaning of the transition area in the regional method is not clear and a one-piece analytical surface potential solution to Poisson’s equation is successfully derived. Furthermore, the drain current is also explicitly derived from the charge sheet model and I-V characteristics of a-InGaZnO TFTs are reproduced from the above obtained model. Finally, accurate and effective surface-potential model and drain current model are obtained and verified by experimental data, respectively. Good verification results prove that the proposed model could become an accurate and suitable tool for being embedded into a circuit simulation. Full article

Modern applications of Internet of Things (IoT) devices require cheap and effective methods of measurement of physical quantities. Cheap IoT devices with sensor functionalities can detect a lack or excess of substances in everyday life or industry processes. One possible use of tension sensors in IoT applications is the automated replenishment process of fast moving consumer goods (FMCG) on shop shelves or home retail automation that allows for quick ordering of FMCG, where the IoT system is a part of smart packaging. For those reasons, a growing demand for cheap and tiny tension sensors has arisen. In this article, we propose a solution of a small flexible tension sensor fabricated in an amorphous InGaZnO (a-IGZO) thin-film process that can be integrated with other devices, e.g., near-field communications (NFC) or a barcode radio frequency identification (RFID) tag. The sensor was designed to magnify the slight internal changes in material properties caused by mechanical stress. These changes affect the dynamic electrical properties of specially designed inverters for a pair of ring oscillators, in which the frequencies become stress-dependent. In the article, we discuss and explain the approach to the optimum design of a ring oscillator that manifests the highest sensitivity to mechanical stress. Full article

The preparation of thin-film transistors (TFTs) with InGaZnO (IGZO) channels using sol–gel technology has the advantages of simplicity in terms of process and weak substrate selectivity. We prepared a series of TFT devices with a top contact and bottom gate structure, in which the top contact was divided into rectangular and circular structures of drain/source electrodes. The field-effect performance of TFT devices with circular pattern drain/source electrodes was better than that with a traditional rectangular structure on both substrates. The uniform distribution of the potential in the circular electrode structure was more conducive to the regulation of carriers under the same channel length at different applied voltages. In addition, with the development of transparent substrate devices, we also constructed a hafnium oxide (HfO₂) insulation layer and an IGZO active layer on an indium tin oxide conductive substrate, and explored the effect of circular drain/source electrodes on field-effect properties of the semitransparent TFT device. The IGZO deposited on the HfO₂ dielectric layer by spin-coating can effectively reduce the surface roughness of the HfO₂ layer and optimize the scattering of carriers at the interface in TFT devices. Full article