3 Results Found

Advanced Search

Select all

Results per page

Select all

Article

7 Citations

6,173 Views

13 Pages

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

Meng-Kai Shih,
Yu-Hao Liu,
Calvin Lee and
C. P. Hung

Materials2023, 16(12), 4291;https://doi.org/10.3390/ma16124291

-

9 June 2023

Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packag...

Full Article

Article

2 Citations

3,357 Views

10 Pages

Flexible Temperature Control Solution for Integrated Circuits Testing—Silicon Creations Thermal Elephant

Andrzej Laczewski and
Krzysztof Kasiński

Electronics2022, 11(22), 3766;https://doi.org/10.3390/electronics11223766

-

16 November 2022

Both scientific and industrial applications require temperature stabilization and enforcement for testing purposes. In this study, we present a solution capable of handling socket-based IC test systems enabling packages from QFN up to FCBGA, or even...

Full Article

Article

10 Citations

3,869 Views

10 Pages

The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages

Hyun-Seok Choi,
Jeong-Hyun Park and
Jong-Hee Lee

Polymers2023, 15(14), 3083;https://doi.org/10.3390/polym15143083

-

18 July 2023

This study suggests promising candidates as highly thermally conductive adhesives for advanced semiconductor packaging processes such as flip chip ball grid array (fcBGA), flip chip chip scale package (fcCSP), and package on package (PoP). To achieve...

Full Article