- Article
High-Density Patterned Array Bonding through Void-Free Divinyl Siloxane Bis-Benzocyclobutene Bonding Process
- Nam Woon Kim,
- Hyeonjeong Choe,
- Muhammad Ali Shah,
- Duck-Gyu Lee and
- Shin Hur
Divinylsiloxane-bis-benzocyclobutene (DVS-BCB) has attracted significant attention as an intermediate bonding material, owing to its excellent properties. However, its applications are limited, due to damage to peripheral devices at high curing tempe...