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Advanced Devices and Materials for Printed Flexible Electronics

This special issue belongs to the section “Electronic Sensors“.

Special Issue Information

Dear Colleagues,

Printed electronics have emerged as a key technology used in sensors and various electronic devices since it combines electronics manufacturing with text and graphics printing. This combination allows for the production of high-quality electronics that are thin, flexible, lightweight, highly economical, and environmentally friendly.

The development of these devices is possible through a combination of various advanced polymers with new coating and printing techniques capable of working at low temperatures, compatible with the polymeric substrates. Printing technologies allow for manufacturing on non-planar surfaces otherwise impossible with old-fashioned fabrication techniques.

The rapid development of this field has been stimulated by the continuous evolution of large-scale electronic applications with many applications in flat-panel displays, medical image sensors, electronic paper, etc. Printed technologies are the main platform for flexible electronics, the advancement of which has spanned the past few years, ranging from the development of flexible solar cell arrays and flexible organic light-emitting diode displays to fully flexible electronic devices.

Today, the demand for cost-effective, flexible, and smart products is a decisive factor in the choice of printed electronics manufacturing technologies. In recent years, interest in flexible electronic systems used on non-planar surfaces has grown considerably in areas such as aerospace, automobiles, biomedical, robotics, and health.

Currently, research on printed and flexible electronics faces many issues, including materials, print process, interfacing, and integration. Solutions regarding low-cost and high-volume production problems may vary depending on the application.

This Special Issue seeks papers dealing with the development of novel printed and flexible devices that push the technology further and set new application frames. Moreover, the scope of this issue focuses on the presentation of new advance materials that can be implemented in any aspect of printed and flexible devices (active-functional materials, substrates, sensing, passivation, packaging, etc.).

Topics of interest include, but are not limited to, the following:

  • Flexible device for applications in wearables, IoT, health, etc.;
  • Flexible lighting and displays;
  • 3D printing electronics in system integration of functional products and solutions;
  • Sensors, biosensors, and e-textiles;
  • Intelligent and smart packaging, safety, and security;
  • Advanced functional materials (carbon nanotubes; encapsulation materials; graphene; OLED display materials; quantum dots; silver; copper; carbon conductive inks; substrates such as PET, PEN, paper, and others; transparent conductive films; etc.);
  • Flexible organic and printed electronics and photonics;
  • Printing processes; and
  • Flexible and printed batteries.

Prof. Dr. Grigoris Kaltsas
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • printed flexible electronics
  • advanced functional materials
  • printing processes
  • flexible electronic devices and sensors
  • wearables
  • flexible system development and integration
  • printed systems design and simulation

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Sensors - ISSN 1424-8220