Nanomaterials and Flexible Electronic Devices: Processing, Diagnostics and Applications

A special issue of Processes (ISSN 2227-9717). This special issue belongs to the section "Materials Processes".

Deadline for manuscript submissions: 30 November 2025 | Viewed by 16

Special Issue Editors


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Guest Editor
School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore
Interests: flexible electronic devices; laser processing; nanomaterials

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Guest Editor
School of Microelectronics Science and Technology, Sun Yat-sen University, Zhuhai 519082, China
Interests: novel memory devices and artificial intelligence applications; novel sensor devices and internet of things applications; nanomaterial devices and nano-micro laser processing

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Guest Editor
College of Electronics and Information Engineering, Sichuan University, Chengdu 610065, China
Interests: laser micro machining; machine vision; laser interferometry
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Special Issue Information

Dear Colleagues,

This Special Issue highlights the latest research and technological innovations in the fields of nanomaterials and flexible electronic devices, addressing their processing, diagnostic techniques, and cutting-edge applications. With rapid advancements in wearable electronics, artificial skin, and smart healthcare systems, flexible electronics have emerged as a transformative technology with a vast market potential. This Special Issue aims to gather high-quality contributions that explore novel materials, advanced fabrication methods, and emerging applications to overcome current limitations in flexibility, durability, and performance.

Areas of Interest Include (but are not limited to) the following:

  1. Novel Nanomaterials for Flexible Electronics
    • Functional nanomaterials (e.g., graphene, carbon nanotubes, MXenes, and conductive polymers) for flexible electrodes and sensors.
    • Hybrid nanocomposites that enhance mechanical compliance and electrical conductivity.
    • Self-healing and stretchable nanomaterials for durable wearable devices.
  2. Advanced Manufacturing and Processing Techniques
    • Scalable fabrication methods (inkjet printing, roll-to-roll, electrospinning, and laser direct writing) for flexible electronics.
    • 3D/4D printing of nanostructured materials for customized device architectures.
  3. Diagnostics and Performance Optimization
    • In situ characterization techniques (e.g., SEM, AFM, and Raman spectroscopy) for nanomaterial-based devices.
    • AI-driven optimization of material properties and device performance.
  4. Emerging Applications in Flexible Electronics
    • Wearable health monitors (e.g., strain/pressure/temperature sensors and ECG electrodes).
    • Energy-efficient flexible displays, transistors, and optoelectronic devices.
    • Self-powered systems (triboelectric nanogenerators, flexible batteries, and supercapacitors).
    • Smart packaging, human–machine interfaces, and neuromorphic computing devices.

This Special Issue seeks to bridge the gap between fundamental research and industrial applications, fostering interdisciplinary collaborations to accelerate the development of next-generation flexible electronics. We welcome original research articles, reviews, and short communications that contribute to the advancement of this dynamic field.

We look forward to your submissions.

Dr. Yongchao Yu
Dr. Ming Xiao
Dr. Shutong Wang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Processes is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • novel nanomaterials for flexible electronics
  • advanced manufacturing and processing techniques
  • diagnostics and performance optimization
  • emerging applications in flexible electronics

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Published Papers

This special issue is now open for submission.
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