Advances in Optical 3D Integration
A special issue of Photonics (ISSN 2304-6732).
Deadline for manuscript submissions: closed (30 April 2023) | Viewed by 3864
Special Issue Editor
Special Issue Information
Dear Colleagues,
Optical 3D integration is becoming a growing trend in photonic integrated circuits, similar to what we have observed in electronic integrated circuit development. It not only offers high degrees of integration but also bringing new functionalities to microsystems. Combining with nanoelectronics, 3D integrated photonics would enable novel applications in sensing, high-performance computing, light detection and ranging (LiDAR), artificial intelligence, etc.
In this special issue, we will discuss emerging technologies and applications in optical 3D integration. We welcome you to submit your work in form of reviews, articles and communications. Topics of interest include but are not limited to:
- Multilayer stacked photonic integrated circuits;
- 3D arbitrary photonics by ultrafast laser inscription;
- 3D printing for photonic integration;
- Novel fabrication process for optical 3D integration;
- Advanced 3D packaging techniques for electronic-photonic integration;
- Novel applications enabled by 3D electronic-photonic integrated circuits;
Prof. Dr. Yu Zhang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- Integrated optics
- Photonic integrated circuits
- Three-dimensional integrated circuits
- Nanofabrication
- Material integration
- Heterogenous integration.
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue polices can be found here.
