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Recent Research on Thermal-Conductivity Polymers

A special issue of Molecules (ISSN 1420-3049). This special issue belongs to the section "Macromolecular Chemistry".

Deadline for manuscript submissions: 30 September 2026 | Viewed by 121

Special Issue Editors


E-Mail Website
Guest Editor
Tecnologico de Monterrey, Escuela de Ingeniería y Ciencias, Av. Gral. Ramón Corona No 2514, Colonia Nuevo México, Zapopan 45121, Mexico
Interests: polymers; composites; nanomaterials; heat transport; thermal conductivity
Mechanical & Industrial Engineering Department, University of Massachusetts Amherst, Amherst, MA 01003, USA
Interests: polymers; polymer engineering; heat transport; advanced manufacturing; devices
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

We are pleased to announce this Special Issue, dedicated to recent advances in polymer-based materials with enhanced thermal conductivity, a topic of growing importance for thermal management in electronics, energy devices, and advanced manufacturing. While polymers traditionally exhibit low intrinsic thermal conductivity, recent progress in molecular design, composite engineering, and processing strategies has led to substantial improvements in heat transport performance.

Contributions in this issue address the use of high-thermal-conductivity fillers, as well as approaches to reduce interfacial thermal resistance and tailor phonon transport pathways. We also highlight emerging concepts, including anisotropic thermal transport, bio-inspired and hierarchical architectures, and multifunctional polymer systems that combine thermal, mechanical, and electrical functionalities.

By bringing together fundamental studies and scalable fabrication strategies, this Special Issue aims to provide a comprehensive overview of current trends and identify key challenges and opportunities for designing next-generation thermally conductive polymers for high-performance applications.

Dr. Luis Marcelo Lozano-Sánchez
Dr. Yanfei Xu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Molecules is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermally conductive polymers
  • thermal management
  • polymer composites
  • phonon transport
  • high thermal conductivity fillers
  • anisotropic heat transfer
  • interface engineering
  • advanced manufacturing

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Published Papers

This special issue is now open for submission.
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