Topical Advisory Panel for section 'D3: 3D Printing and Additive Manufacturing'

Please see the section webpage for more information on this section.


Department of Mechanical Engineering, The University of Texas Permian Basin, Odessa, TX 79765, USA
Interests: smart materials; 3D printer sensors; mechanics of 3D printed composites; 3D printed metals; actuators; soft materials
School of System Design and Intelligent Manufacturing (SDIM), Southern University of Science and Technology, Shenzhen 518055, China
Interests: additive manufacturing; composites; modelling; design optimisation; metamaterials
Special Issues, Collections and Topics in MDPI journals

Institute of Mechanical Engineering, Faculty of Mechanical Engineering, Bialystok University of Technology, 15-351 Bialystok, Poland
Interests: UAV design; CAD; CAx; lattice structures; topology optimization; fibre composites; UGV and UAV collaboration; new applications for UAVs; AM techniques; 3D printing drones parts
Special Issues, Collections and Topics in MDPI journals
Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Hong Kong 999077, China
Interests: advanced manufacturing; piezoelectric/ferroelectric; sensing and energy harvesting; biomaterials
Special Issues, Collections and Topics in MDPI journals

School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea
Interests: solution process; soft electronics; stretchable conductor; fiber electronics

Department of Precision and Microsystems Engineering (PME), Faculty of Mechanical, Maritime and Materials Engineering (3mE), Delft University of Technology, Mekelweg 2, 2628 CD Delft, The Netherlands
Interests: nano patterning; liquid metals; microfluidics; MEMS
Smart Manufacturing Thrust, Systems Hub, The Hong Kong University of Science and Technology (Guangzhou), Guangzhou 511458, China
Interests: micro/nanoscale 3D printing; optoelectronics; micro/nanorobots; wearable devices
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