Mechatronic Integrated Devices (MID): Materials, Technologies and Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".
Deadline for manuscript submissions: 30 November 2024 | Viewed by 1482
Special Issue Editors
Interests: plating on plastics; 3D structuring; polymer technology; electronic assembly and interconnection technology
Interests: microtechnology; micromanufacturing; nanomanufacturing; microsystems technology; system integration; electronic packaging; electronic assembly and interconnection technology; sensors; reliability
Special Issues, Collections and Topics in MDPI journals
Interests: electronic packaging; automation technology; interconnection processes; additive manufacturing; electronic assembly
Special Issue Information
Dear Colleagues,
Mechatronic Integrated Devices, sometimes also called Molded Interconnect Devices (MID) integrate as spatial, i.e. three-dimensional, circuit carriers mechanical and electrical functions. Meanwhile, even optical, thermal, lighting, sensor and actuator functions can be integrated by appropriate technologies. MID already have many applications, e.g. as antennas in mobile devices, and mechatronic modules in the automotive and medical devices.
New materials as well as new processes have expanded the possible functionalization of spatial circuit carriers and thereby the range of applications. Futhermore, additive manufacturing processes, for example, open up new possibilities for the rapid realization of prototypes and the individualization of products.
This Special Issue is dedicated to recent advances in the research and development of MID. Therefore, papers that report recent findings and advances regarding new materials for MID, manufacturing technologies for the 3D base body, structuring and plating technologies for the 3D conductor tracks, assembly technologies for different components, and technologies for the integration of further functions are all welcome. Furthermore, papers that report applications underpinned by advances in material and process development are also very welcome. Finally, research work concerning the reliability of MID is addressed as well. In addition to original works, reviews are also welcome.
We look forward to receiving your submissions!
Dr. Wolfgang Eberhardt
Prof. Dr. André Zimmermann
Prof. Dr. Jörg Franke
Guest Editors
Manuscript Submission Information
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Keywords
- materials for MID: thermoplastic, thermoset, ceramic, glass
- additive manufacturing
- metal plating
- 3D structuring
- coating based functionalization
- digital printing
- digital process chains
- sustainable processes
- functionalized electronic package
- sensor integration
- application of MID: HF engineering, medical technology, industrial engineering, automotive
- reliability of MID
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