Mechatronic Integrated Devices (MID): Materials, Technologies and Applications

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D:Materials and Processing".

Deadline for manuscript submissions: 30 November 2024 | Viewed by 678

Special Issue Editors

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Guest Editor
Hahn-Schickard, Allmandring 9B, 70569 Stuttgart, Germany
Interests: plating on plastics; 3D structuring; polymer technology; electronic assembly and interconnection technology

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Guest Editor
Institute for Micro Integration (IFM), University of Stuttgart, Allmandring 9b, 70569 Stuttgart, Germany
Interests: microtechnology; micromanufacturing; nanomanufacturing; microsystems technology; system integration; electronic packaging; electronic assembly and interconnection technology; sensors; reliability
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Guest Editor
Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen Nürnberg, Egerlandstr. 7-9, 91058 Erlangen, Germany
Interests: electronic packaging; automation technology; interconnection processes; additive manufacturing; electronic assembly

Special Issue Information

Dear Colleagues,

Mechatronic Integrated Devices, sometimes also called Molded Interconnect Devices (MID) integrate as spatial, i.e. three-dimensional, circuit carriers mechanical and electrical functions. Meanwhile, even optical, thermal, lighting, sensor and actuator functions can be integrated by appropriate technologies. MID already have many applications, e.g. as antennas in mobile devices, and mechatronic modules in the automotive and medical devices.

New materials as well as new processes have expanded the possible functionalization of spatial circuit carriers and thereby the range of applications. Futhermore, additive manufacturing processes, for example, open up new possibilities for the rapid realization of prototypes and the individualization of products.

This Special Issue is dedicated to recent advances in the research and development of MID. Therefore, papers that report recent findings and advances regarding new materials for MID, manufacturing technologies for the 3D base body, structuring and plating technologies for the 3D conductor tracks, assembly technologies for different components, and technologies for the integration of further functions are all welcome. Furthermore, papers that report applications underpinned by advances in material and process development are also very welcome. Finally, research work concerning the reliability of MID is addressed as well. In addition to original works, reviews are also welcome.

We look forward to receiving your submissions!

Dr. Wolfgang Eberhardt
Prof. Dr. André Zimmermann
Prof. Dr. Jörg Franke
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • materials for MID: thermoplastic, thermoset, ceramic, glass
  • additive manufacturing
  • metal plating
  • 3D structuring
  • coating based functionalization
  • digital printing
  • digital process chains
  • sustainable processes
  • functionalized electronic package
  • sensor integration
  • application of MID: HF engineering, medical technology, industrial engineering, automotive
  • reliability of MID

Published Papers (1 paper)

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22 pages, 2142 KiB  
Dielectric Properties of PEEK/PEI Blends as Substrate Material in High-Frequency Circuit Board Applications
by Tim Scherzer, Marius Wolf, Kai Werum, Holger Ruckdäschel, Wolfgang Eberhardt and André Zimmermann
Micromachines 2024, 15(6), 801; - 18 Jun 2024
Viewed by 242
Substrate materials for printed circuit boards must meet ever-increasing requirements to keep up with electronics technology development. Especially in the field of high-frequency applications such as radar and cellular broadcasting, low permittivity and the dielectric loss factor are key material parameters. In this [...] Read more.
Substrate materials for printed circuit boards must meet ever-increasing requirements to keep up with electronics technology development. Especially in the field of high-frequency applications such as radar and cellular broadcasting, low permittivity and the dielectric loss factor are key material parameters. In this work, the dielectric properties of a high-temperature, thermoplastic PEEK/PEI blend system are investigated at frequencies of 5 and 10 GHz under dried and ambient conditions. This material blend, modified with a suitable filler system, is capable of being used in the laser direct structuring (LDS) process. It is revealed that the degree of crystallinity of neat PEEK has a notable influence on the dielectric properties, as well as the PEEK phase structure in the blend system developed through annealing. This phenomenon can in turn be exploited to minimize permittivity values at 30 to 40 wt.-% PEI in the blend, even taking into account the water uptake present in thermoplastics. The dielectric loss follows a linear mixing rule over the blend range, which proved to be true also for PEEK/PEI LDS compounds. Full article
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