Soft Sensors and Soft Circuits: Design, Implementation and Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: 31 December 2025 | Viewed by 338
Special Issue Editors
Interests: motion capture; wearable sensors; smart devices
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The rapid development of soft sensor and soft circuit technologies is redefining the boundaries of modern electronics and enabling the novel application of technologies in healthcare, wearable technology, robotics, and beyond. These innovations emphasize flexibility, adaptability, and integration, allowing for unprecedented interaction between technology and the human body or complex environments.
This Special Issue of Micromachines focuses on the design, implementation, and application of soft sensors and soft circuits, highlighting the transformative potential of these emerging technologies. Soft sensors, such as those integrated into e-textiles or wearable devices, offer robust solutions for monitoring physiological signals, environmental conditions, and mechanical deformation. Meanwhile, soft circuits, leveraging their flexible and conformal nature, allow seamless integration into unconventional form factors, creating pathways for innovative applications in wearable health monitoring, human–machine interfaces, and flexible robotics.
This Special Issue invites researchers, engineers, and industry professionals to share their latest findings, insights, and innovations. By showcasing interdisciplinary approaches and novel methodologies, this collection will contribute to shaping the future of soft sensor and circuit technologies, promoting new applications in the field and pushing the boundaries of what is possible.
We welcome the submission of articles that address challenges, propose novel solutions, and present the innovative implementation of soft sensors and circuits. Contributions can include original research, review articles, and case studies that reflect the latest trends and advancements in this dynamic field.
Dr. Lei Jing
Dr. Tomohito Sekine
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- e-textiles
- e-skin
- soft robotics
- wearable sensors
- flexible and stretchable electronics
- human–machine interfaces
- conductive polymers
- self-healing sensors
- hydrogel-based sensors
- skin-mountable devices
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