Thin Film Fabrication and Integration Technology for the Next Generation of Electronics, Magnetism and Optics Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: 30 November 2025 | Viewed by 51
Special Issue Editor
Special Issue Information
Dear Colleagues,
We would like to invite you to submit to a Special Issue on “Thin Film Fabrication and Integration Technology for the Next Generation of Electronics, Magnetism and Optics Devices”. The unique structural feature of an ultra-thin material layer endows thin film devices with a range of distinctive physical, chemical, and biological properties, rendering them irreplaceable in various fields. The purpose of this Special Issue is to present the latest experimental and theoretical developments of advanced functional thin film devices. Authors are invited to submit their latest results, including original research papers and reviews. Topics of interest include, but are not limited to, the following:
- Latest theoretical and experimental studies in the field of advanced thin films for novel applications such as electrochemical devices (electrolyzers, fuel cells, batteries, and supercapacitors), emerging memory and computing devices, spintronic devices, sensor devices, and optoelectronic devices.
- Thin film fabrication technology: thin film depositions, surface micromachining, 3D printing, and additive manufacturing.
- Latest methods of thin film device simulation.
- Thin film device integration technology.
Dr. Liqian Wu
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thin film technology
- electrochemical devices
- emerging memory devices
- neuromorphic memory computing devices
- spintronic devices
- multifunctional sensor devices
- multifunctional optoelectronic devices
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue policies can be found here.
