Beyond Moore Technology and Devices
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".
Deadline for manuscript submissions: closed (25 March 2023) | Viewed by 8212
Special Issue Editor
Interests: 2D materials and devices; ferroelectric materials and devices; spintronics; quantum transport
Special Issue Information
Dear Colleagues,
Moore's law is an empirical observation made by Gordon Moore in 1965 that the number of transistors in a dense integrated circuit (IC) doubles about every two years. Moore's Law has propelled the development of the semiconductor industry for a half-century due to the advances in silicon electronics in miniaturization. As silicon devices reach atomic scale and fabrication costs continue to rise, Moore’s law is anticipated to flatten by 2025, giving rise to post-Moore technologies afterward. The development beyond Moore's evolving technology requires an investment in basic science, including material science and device physics, to explore candidate replacement materials, device structures and system architectures to foster the continued technology scaling. Thus, new chip materials, novel devices structure, new integration processes, and special system architecture have emerged as a fascinating field of research and development to move electronics beyond Moore’s Law. Accordingly, this Special Issue seeks to showcase research papers, communications, and review articles that focus on beyond Moore technology and devices including beyond silicon materials, new device structure, novel integration technology and alternative system architecture.
Dr. Xiaowei Wang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
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Keywords
- beyond silicon materials
- beyond CMOS devices
- novel integration process
- non-von neumann architecture
