Novel Flexible Electronic/Semiconductor Materials and Devices: Recent Research and Applications

Dear Colleagues,

The global proliferation of smart living and intelligent cities is transforming societies worldwide, where accelerated communication speeds and diverse electronic devices substantially elevate quality of life. Concurrently, multifunctional electronics in increasingly varied form factors are permeating all facets of life and work. Flexible, adaptable electronic systems with reduced carbon footprints are poised to constitute a growing market segment. These developments generate significant demand for high-performance flexible electronics, particularly semiconductor-based flexible devices. Among these, heterojunction-integrated flexible devices play a pivotal role in delivering exceptional performance, reliability, and operational durability.

Realizing advanced flexible electronics necessitates an integrated methodology combining nanotechnology, semiconductor materials, micro/nano-fabrication processes, and related disciplines. This Special Issue therefore seeks to consolidate recent advances in novel flexible electronic materials, device architectures, and their emerging applications. We invite submissions of original research articles (full-length papers), concise communications, and comprehensive reviews that detail innovative methodologies for developing flexible electronic/semiconductor materials and devices.

Dr. Dan Han
Dr. Yijie Gu
Dr. Hui Zheng
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.