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Micromachines
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MEMS Ultrasonic Transducers, 2nd Edition
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MEMS Ultrasonic Transducers, 2nd Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A：Physics".

Deadline for manuscript submissions: 30 October 2026 | Viewed by 4305

Special Issue Editor

Prof. Dr. Xiaohua Jian

E-Mail Website
Guest Editor
School of Materials Science and Intelligent Engineering, Nanjing University, Suzhou 215163, China
Interests: micro high-frequency transducer; micromachined piezocomposite; ultrasound equipment development; biomedical ultrasound imaging and therapy and wearable sensors
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Ultrasonic transducers are widely used in medical imaging, industrial non-destructive testing, ultrasonic microscopes, ultrasonic radars, underwater ultrasound, ultrasonic measurement, and other fields. Due to the disadvantages of traditional ultrasonic transducers based on bulk piezoelectric materials, such as large size, difficult processing, low bandwidth, high frequency, and high cost for array probes, their application in many fields is limited. In response to the above urgent needs, MEMS technology has injected new impetus into the development and application of ultrasonic transducers and realized a high-performance miniature ultrasonic transducer array with low power consumption, miniaturization, and integrated integration while reducing the cost of mass production. MEMS ultrasonic transducers are expected to push the application of ultrasound technology to a new level, realizing its application in emerging fields such as smartphones, automotive electronics, smart homes, autonomous driving, robotics, and medical devices, including ultrasound fingerprint recognition sensors, human–computer interaction, ultrasound imaging devices for home diagnosis, and ultrasound wearable devices.

In this Special Issue, original research articles and reviews are welcome. Research areas may include (but not limited to) the following:

  1. Piezoelectric micromachined ultrasonic transducers (PMUT).
  2. Capacitive micromachined ultrasonic transducers (CMUT).
  3. Micromachined ultrasonic transducers.
  4. Thin-film transducers.
  5. MEMS vector hydrophones.
  6. MEMS pressure sensors.
  7. MEMS transducer structure design and simulation.
  8. Micromachined 1-3 piezocomposite.
  9. Applications of MEMS transducers.

We look forward to receiving your contributions.

Prof. Dr. Xiaohua Jian
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • PMUT
  • CMUT
  • miniature ultrasound transducers
  • thin-film transducer
  • hydrophone
  • ultrasound imaging
  • ultrasound testing
  • wearable ultrasound

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Related Special Issue

Published Papers (3 papers)

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Research

19 pages, 3469 KB  
Article
An MEM-DMD-Enabled Ghost Imaging System Enhanced by a Hybrid CNN-GAN for High-Resolution Imaging Under Scattering Media
by Zeenat Akhter, Rehmat Iqbal, Giedrius Janusas, Sigita Urbaite and Arvydas Palevicius
Micromachines 2026, 17(5), 598; https://doi.org/10.3390/mi17050598 - 14 May 2026
Viewed by 160
Abstract
This paper presents a Micro-Electro-Mechanical Systems digital micromirror device (MEMS-DMD)-enabled ghost imaging (GI) framework for high-resolution imaging under scattering conditions. Unlike conventional ghost imaging systems that rely on fixed illumination patterns, the proposed approach exploits the high-speed programmability of a DMD to implement [...] Read more.
This paper presents a Micro-Electro-Mechanical Systems digital micromirror device (MEMS-DMD)-enabled ghost imaging (GI) framework for high-resolution imaging under scattering conditions. Unlike conventional ghost imaging systems that rely on fixed illumination patterns, the proposed approach exploits the high-speed programmability of a DMD to implement adaptive illumination strategies, enabling dynamic selection of informative patterns during data acquisition. This hardware-enabled pattern selection strategy improves sampling efficiency and reconstruction stability under the modeled fog conditions considered here. A hybrid convolutional neural network–generative adversarial network (CNN–GAN) model is employed as an inversion tool to reconstruct high-quality images from compressed bucket measurements. The proposed system achieves substantial improvements in reconstruction quality, with 23–40% gains in PSNR and 18–26% in SSIM compared to traditional ghost imaging methods, while reducing the number of required measurements by up to 60%. Additional performance gains are achieved through adaptive pattern selection enabled by the MEMS-DMD. The results demonstrate that integrating programmable MEMS hardware with learning-based reconstruction provides an effective solution for imaging under scattering conditions, with potential applications in remote sensing, environmental monitoring, and surveillance. Full article
(This article belongs to the Special Issue MEMS Ultrasonic Transducers, 2nd Edition)
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19 pages, 5205 KB  
Article
High-Frequency Ultrasound Focusing Using Low-Cost PMMA and PDMS Acoustic Lenses
by Mohammadamir Ghasemishabankareh, Zeyuan Hui, Francesc Torres and Núria Barniol
Micromachines 2026, 17(4), 414; https://doi.org/10.3390/mi17040414 - 28 Mar 2026
Viewed by 1559
Abstract
This study presents a high-frequency ultrasound lens system that uses simply fabricated and low-cost acoustic lenses made from PMMA and PDMS materials. These lenses are designed for higher-frequency operation around 20 MHz, providing suitability for demanding high-frequency ultrasonic applications. They were designed and [...] Read more.
This study presents a high-frequency ultrasound lens system that uses simply fabricated and low-cost acoustic lenses made from PMMA and PDMS materials. These lenses are designed for higher-frequency operation around 20 MHz, providing suitability for demanding high-frequency ultrasonic applications. They were designed and fabricated specifically for integration with a PMUT array, ensuring proper compatibility with array-based high-frequency ultrasonic imaging. Both Fresnel and convex lens designs were evaluated through axial and lateral beam measurements, along with pulse–echo testing in the focal region. The results show that the PMMA and PDMS lenses can produce a well-defined focus and a stable echo response despite their simple and low-cost fabrication. This demonstrates the feasibility of low-cost materials for high-frequency ultrasonic focusing in PMUT array applications. Full article
(This article belongs to the Special Issue MEMS Ultrasonic Transducers, 2nd Edition)
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14 pages, 3931 KB  
Article
Design and Fabrication of Air-Coupled CMUT for Non-Contact Temperature Measurement Applications
by Xiaobo Rui, Yongshuai Ma, Chenghao He, Chi Zhang, Zhuochen Wang and Hui Zhang
Micromachines 2025, 16(9), 1008; https://doi.org/10.3390/mi16091008 - 31 Aug 2025
Viewed by 1141
Abstract
Compared with traditional piezoelectric transducers, Capacitive Micromachined Ultrasonic Transducers (CMUTs) have advantages such as better impedance matching with air, smaller size, lighter weight, higher sensitivity, and ease of array formation. Acoustic temperature measurement is a technology that utilizes the relationship between sound velocity [...] Read more.
Compared with traditional piezoelectric transducers, Capacitive Micromachined Ultrasonic Transducers (CMUTs) have advantages such as better impedance matching with air, smaller size, lighter weight, higher sensitivity, and ease of array formation. Acoustic temperature measurement is a technology that utilizes the relationship between sound velocity and temperature to achieve non-contact temperature detection, with advantages such as fast response and non-invasiveness. CMUT-based acoustic temperature field measurement can achieve temperature detection in situations with narrow spaces, portability, and high measurement accuracy. This paper investigates an air-coupled CMUT device for acoustic temperature measurement, featuring a resonant frequency of 220 kHz, and composed of 16 × 8 cells. The design and fabrication of the CMUT array were completed, and the device characteristics were tested and characterized. A temperature field measurement method using mechanical scanning was proposed. A temperature measurement experimental system based on CMUT devices was constructed, achieving preliminary measurement of acoustic transmission time in both uniform and non-uniform temperature fields. Using a temperature field reconstruction algorithm, the measurement and imaging of the temperature field above an electric heating wire were accomplished and compared with the thermocouple-based temperature measurement experiment. The experimental results verified the feasibility of CMUT devices for non-contact temperature field measurement. Full article
(This article belongs to the Special Issue MEMS Ultrasonic Transducers, 2nd Edition)
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