The Effect of Temperature on the Mechanical Properties of Metallic Materials

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: 30 June 2024 | Viewed by 204

Special Issue Editors

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Guest Editor
Department of Mechanical Engineering, American University of Sharjah, Sharjah, United Arab Emirates
Interests: metallic materials; mechanical properties; high-temperature properties; cryogenic temperature properties; high-temperature high-entropy alloys; cryogenic-temperature alloys; high-temperature shape memory alloys
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Guest Editor
Department of Mechanical Engineering, Politecnico di Milano, Milan, Italy
Interests: testing of materials for the characterization of mechanical behavior; microstructural characterization via EBSD and X-ray diffraction; microscopy; digital image correlation

Special Issue Information

Dear Colleagues,

Efforts to develop metallic materials with superior mechanical properties under extreme temperatures, both high-temperature as well as cryogenic conditions, continue to capture significant research interest. Thermal effects, such as oxidation and loss of strength or ductility, have been a major challenge in many metallic systems. Recent notable advances in the fields of multi-principal element alloys, including high- and medium-entropy alloys and high-temperature shape memory alloys, have resulted in the development of many systems exhibiting superior and exceptional mechanical properties across a wide temperature range. Following the new design and alloying principles in these novel classes of materials, there is no doubt that new systems demonstrating superior mechanical properties for extreme temperature applications will continue to be proposed and optimized to better suit industry requirements for a wide spectrum of applications.

In this Special Issue, articles focusing on the temperature-dependent mechanical properties of novel metallic materials are welcomed. This includes the synthesis, characterization, failure mechanisms, microstructural stability, and mechanical response under static and dynamic loading conditions. Contributions will be considered noteworthy if they represent a real element of originality in terms of the development or characterization of advanced and novel metallic materials for elevated and cryogenic temperature applications.

Dr. Wael Abuzaid
Prof. Dr. Luca Patriarca
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.


  • metallic materials
  • extreme temperatures
  • high- and medium-entropy alloys
  • high-temperature shape memory alloys
  • mechanical property
  • failure
  • loading

Published Papers

This special issue is now open for submission.
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