Advances in Organic, Inorganic, and Organic/Inorganic Hybrid Composite Functional Materials Which Are High-Frequency and Low-Dielectric

Dear Colleagues,

With the rapid development of electronic information technologies, such as high-frequency communication, artificial intelligence, and cloud computing, various types of low-k materials have been adopted to avoid the signal capacitance delay, crosstalk, and increased power consumption caused by metal resistance and parasitic capacitance between lines and layers. For example, organosilicates (fluorinated silicon glass (FSG or SiOF) and organosilicate glass (SiCOH), etc.) have been widely used for low-k interlayer dielectrics in integrated circuits (IC) packaging. Additionally, certain kinds of polymers (such as poly(arylene ether), polyimide, parylene-N/F, polytetrafluoroethylene, benzocyclobutene-based polymer, etc.) are commercially available for spin-on dielectric applications.

Aside from material innovations, advanced chemical and physical structures of organic, inorganic, and hybrid low-k materials should be proposed to meet operation requirements, including outstanding mechanical property, good thermal stability, low shrinkage rate, low expansion coefficient, low water absorption, and good processability and surface smoothness.

The aim of this Special Issue is to elaborate on the recent innovations of functional low-k materials (including organic, inorganic, and organic/inorganic hybrid systems) and understand the relationship between structure and overall performances (such as dielectric, mechanical, thermal stability and other properties).

A thorough study of their chemical structures and compositions, microscopic properties on nano, micro, meso-scales, and different fabrication methods will greatly guide the future design and preparation of next-generation low-k functional materials to adapt to the fast demand of modern electronic components in high-frequency transmission.

Dr. Wenxin Fu
Guest Editor

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