Special Issue "High-Entropy Alloys: Development and Microstructure–Property Relation"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Materials Chemistry".

Deadline for manuscript submissions: 30 November 2020.

Special Issue Editor

Dr. Alexander E. Karantzalis

Guest Editor
University of Ioannina, Ioannina, Greece
Interests: phase formation in high entropy alloys; mechanical properties of HEAs; surface degradation phenomena in HEAs

Special Issue Information

Dear Colleagues,

During the last two decades, high entropy alloys (HEAs) have become the forefront of the research efforts in the broad field of metallurgy and metallic materials and alloys. The novel idea of providing thermodynamically stable alloy systems by increasing the entropic content simply by combining multiple elements at almost equiatomic portions opened the horizons for the development of totally new alloy systems with an extreme potential for various applications.

The basic idea of the high entropic content by itself led to the establishment of a new material era far beyond the conventional metallurgy boundaries. The research work being conducted so far in the field of HEAs has shown exceptional properties and performance potential, and researchers all over the word progressively continue their efforts in designing, developing and evaluating numerous different elemental combinations.

The aim of this Special Issue is to gather as much as possible of the latest progress on the development and characterization of HEAs. Some of the potential topics to be covered in this topic are as follows:

  • Phase formation prediction models and assessment;
  • Microstructural evolution, characterization and evaluation;
  • Theoretical calculations on microstructure and properties;
  • Mechanical property assessment at ambient and elevated temperatures;
  • Surface degradation response evaluation (wear, solid particle erosion, corrosion etc.).

Special attention will be given in these efforts that systematically approach the relation between the microstructure and the properties.

The editorial team and the periodical greatly anticipate that this Special Issue will enlighten us around the phenomena governing HEAs and bring to the forefront the current research activity of the various groups dealing with this fascinating field. We welcome and look forward to your contribution.

Sincerely Yours

Dr. Alexander E. Karantzalis
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • High entropy alloy microstructural characterization
  • Mechanical properties
  • Surface degradation phenomena

Published Papers

This special issue is now open for submission.
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