Ionic Liquid-Based Materials: Fundamentals and Applications
A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Soft Matter".
Deadline for manuscript submissions: 10 May 2026
Special Issue Editors
Interests: ionic liquids and deep eutectic solvents (DESs); structure; solvation properties. X-ray and neutrons diffraction techniques
Special Issues, Collections and Topics in MDPI journals
Interests: ionic liquids; deep eutectic solvents (DESs); water-in-salt electrolytes; molecular dynamics simulations; dynamics–structure relationships; intermolecular interactions; X-ray and neutron scattering
Special Issue Information
Following the 8th International Conference on Ionic Liquid-Based Materials (ILMAT2025), we are pleased to announce a Special Issue dedicated to the conference proceedings. This Special Issue will feature contributions presented at ILMAT2025, while also remaining open to researchers engaged in fundamental studies or applied innovations surroundingionic liquids and other related materials.
Reflecting the interdisciplinary nature of the conference, this Special Issue will cover recent advances in structure, dynamics, thermodynamics, as well as applications of ionic liquids in materials science, energy, sustainability, and biology.
We invite original research articles and focused review papers from both oral and poster presenters, with the goal of showcasing the high-quality research presented during ILMAT2025.
This Special Issue aims to document the scientific impact of the conference and to foster continued collaboration across the ionic liquids research community. It will highlight the breadth and depth of topics discussed during the event, ranging from fundamental investigations to innovative applications in energy technologies, materials design, and bio-sciences.
Submission Guidelines: Authors will receive detailed instructions via email following the conference. All submissions will undergo peer review to ensure scientific rigor and quality.
Benefits for Contributors:
- Winners of the ILMAT Best Presentation Awards will receive a total fee waiver.
- A limited number of 50% discounted publication fees will be available for selected contributions.
We encourage all participants to contribute to this Special Issue and help capture the spirit and scientific excellence of ILMAT2025.
Dr. Olga Russina
Dr. Alessandro Triolo
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- ionic liquids
- deep eutectic solvents
- electrolytes
- sustainability
- nanostructured materials
- chemical physical properties
- simulations
- theory
- thermodynamics
- hydrogen bonding
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