Special Issue "Recent Progress in the Development, Material Properties, and Post-Processing of Additively Manufactured Components"

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Manufacturing Processes and Systems".

Deadline for manuscript submissions: 31 January 2021.

Special Issue Editors

Assist. Prof. Abdollah Saboori
Website
Guest Editor
Department of Applied Science and Technology, Politecnico Di Torino, Corso Duca Degli Abruzzi 24, 10129 Torino, Italy
Interests: Metal Additive Manufacturing, Materials characterization, Electron Beam Melting, Directed Energy Deposition, Laser Powder Bed Fusion, Stainless steel, Titanium alloys
Special Issues and Collections in MDPI journals
Dr. Giulio Marchese
Website
Guest Editor
Department of Applied Science and Technology, Politecnico di Torino, C.so Duca degli Abruzzi 24, 10129, Torino, Italy
Interests: Additive Manufacturing; Electron Beam Melting; Laser Powder Bed Fusion; Materials; Metallurgy; Alloys development; thermal treatments; Ni superalloys; Al alloys; Ti alloys

Special Issue Information

Dear Colleagues,

Additive manufacturing (AM) includes a set of processes in which a complex component can be produced in a layer-wise fashion using the heating provided by a laser or electron source. AM is a rapidly growing manufacturing capability. This technology is expected to revolutionize the fabrication of complex-shaped parts, in particular for application fields, where complex geometries, highly customized parts, small part production numbers and/or lead-time saving, play a decisive role. Nonetheless, despite all the remarkable efforts, there are significant challenges that are limiting the wider uptake and exploitation of AM, spanning across the entire AM supply chain. These include a lack of AM design and modelling skills and software, a gap in understanding in properties obtained from different machines and technologies, and their effect on part failure. Moreover, the mechanical performance of AM parts can be enhanced by post-processing, such as heat treatments. This Special Issue is dedicated to disseminate these recent scientific efforts. For this Special Issue in Materials, it is our pleasure to invite you to submit reviews and articles in the areas of material supply, part design, process modelling, process technology, post-processing techniques, and applications of AM.

Dr. Abdollah Saboori
Dr. Giulio Marchese
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2000 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Additive Manufacturing
  • Materials Properties
  • Materials Development
  • Design
  • Post-Processing

Published Papers

This special issue is now open for submission.
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